TWI551415B - Apparatus and method for clipping film sheet - Google Patents
Apparatus and method for clipping film sheet Download PDFInfo
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- TWI551415B TWI551415B TW103142763A TW103142763A TWI551415B TW I551415 B TWI551415 B TW I551415B TW 103142763 A TW103142763 A TW 103142763A TW 103142763 A TW103142763 A TW 103142763A TW I551415 B TWI551415 B TW I551415B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/10—Making cuts of other than simple rectilinear form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/25—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member
- B26D1/26—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut
- B26D1/28—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting
- B26D1/285—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D2007/0012—Details, accessories or auxiliary or special operations not otherwise provided for
- B26D2007/0018—Trays, reservoirs for waste, chips or cut products
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Advancing Webs (AREA)
- Details Of Cutting Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Description
本發明係關於一種為將離型薄膜片材自長帶薄膜切除之裝置及其方法,其於將半導體晶片等電子零件樹脂封裝時,尤其是為了壓縮成形,將顆粒狀、粉末狀、糊狀等之樹脂材料(以下,僅將此等總稱為「樹脂材料」。)供給至成形模具腔時所用。 The present invention relates to an apparatus for removing a release film sheet from a long belt film and a method thereof, which are used for encapsulating an electronic component such as a semiconductor wafer, particularly for compression molding, in the form of pellets, powders, and pastes. A resin material (hereinafter, simply referred to as "resin material" as such) is used for supply to a molding die cavity.
隨著電子零件之薄型化,近來壓縮成形被使用著。在壓縮成形中,將樹脂材料供給至由離型薄膜片材被覆之下膜具之腔,且將該樹脂材料加熱熔融,並使安裝於上模具且裝設有電子零件之基板浸漬至該熔融樹脂後,由下模具及上模具之閉膜將該樹脂壓縮進行成形。於如此之壓縮成形中,為了進行遍及大型基板全體且無缺陷之成形,將於腔內既定量之樹脂以均一且無過與無不及地供給變得重要。 With the thinning of electronic parts, compression molding has recently been used. In the compression molding, a resin material is supplied to a cavity of the film member coated with the release film sheet, and the resin material is heated and melted, and the substrate mounted on the upper mold and equipped with the electronic component is immersed in the melting. After the resin, the resin is compressed and formed by a closed film of the lower mold and the upper mold. In such compression molding, in order to perform molding without defects on all of the large substrates, it is important to supply the resin in a predetermined amount in the cavity in a uniform and unobscured manner.
專利文獻1中,於腔內將顆粒狀樹脂R以均一厚度且適量供給之方法係如下所記載(參照圖1)。首先,上下具有對應下模具8之腔18a之開口形狀之開口之框架11之下部開口由離型薄膜片材12被覆,且吸附於框架11之下表面製作凹狀收容部13(a)。此凹狀收容部13載於載置台14,且自送料器15將顆粒狀樹脂R於離型薄膜片材上以成為均一厚度之方式供給(b)。其後,將收容顆粒狀樹脂R之凹狀收容部13,以由框架11 包圍之離型薄膜片材12之部分到達腔18a之正上方之方式載置於下模具18之模具面(c),且於框架11之下表面之離型薄膜片材12之吸附解除後,將離型薄膜片材12,與於其上方之顆粒狀樹脂R一起吸引至腔18a內並拉入(d)。藉此,均一厚度之顆粒狀樹脂R被供給至腔18a內。其後,將顆粒狀樹脂R加熱熔融(e),將含有此熔融樹脂Rm於腔18a內之下模具18,及安裝有電子零件20之基板21,以其安裝面向下方之狀態與組裝之上模具19閉模,藉此將電子零件20浸漬至熔融樹脂R,並且將熔融樹脂Rm藉由樹脂加壓用之腔底面構件18b按壓(f)。熔融樹脂固化後,藉由將上模具19及下模具18開模,而得到電子零件20之樹脂封裝成型品(g)。 In Patent Document 1, a method of supplying the particulate resin R in a uniform thickness and an appropriate amount in a cavity is as follows (see FIG. 1). First, the lower portion of the frame 11 having the opening corresponding to the opening shape of the cavity 18a of the lower mold 8 is covered by the release film sheet 12, and is adsorbed to the lower surface of the frame 11 to form the concave receiving portion 13(a). The concave accommodating portion 13 is placed on the mounting table 14, and the granular resin R is supplied from the feeder 15 to the release film sheet so as to have a uniform thickness (b). Thereafter, the concave accommodating portion 13 of the particulate resin R is accommodated to be framed by the frame 11. The portion of the surrounding release film sheet 12 is placed directly above the cavity 18a and placed on the mold surface (c) of the lower mold 18, and after the adsorption of the release film sheet 12 on the lower surface of the frame 11 is released, The release film sheet 12 is attracted into the cavity 18a together with the particulate resin R above it and pulled in (d). Thereby, the uniform thickness of the particulate resin R is supplied into the cavity 18a. Thereafter, the particulate resin R is heated and melted (e), and the molten resin Rm is contained in the lower mold 18 in the cavity 18a, and the substrate 21 on which the electronic component 20 is mounted, with the mounting surface facing downward and assembled The mold 19 is closed, whereby the electronic component 20 is immersed in the molten resin R, and the molten resin Rm is pressed (f) by the cavity bottom surface member 18b for resin pressurization. After the molten resin is cured, the upper mold 19 and the lower mold 18 are opened to obtain a resin-molded article (g) of the electronic component 20.
欲將其樹脂成形之基板為晶圓等圓盤狀之情況下,上述方法使用之圓形離型薄膜片材係,由自供給輥拉出之長帶離型薄膜依次圓形地切除、製作。具體而言,如圖2所示,自供給輥27捲出之離型薄膜F係藉由搬送機構22被搬送至切斷用基台23,且搬送機構22於來到切除用基台23上之時點停止,且藉由旋轉切斷刃25,離型薄膜被以圓形地切除。被切除之離型薄膜片材係,藉由設於切除用基台23之片材降下台24,保持其狀態向下方降下,且自切除用基台23卸除。並且,搬送機構22作動,將被切除之殘留部之離型薄膜F自切除用基台23搬送至捲取輥26處,且下一個切斷部位被配置於切除用基台23上。於捲取輥26以此方式使被圓形地切除之離型薄膜(殘留部薄膜)輥狀地被捲取。 When the substrate to be resin-molded is in the form of a disk such as a wafer, the circular release film sheet used in the above method is sequentially cut and formed by a long-distance release film drawn from a supply roller. . Specifically, as shown in FIG. 2, the release film F taken up from the supply roller 27 is conveyed to the cutting base 23 by the conveying mechanism 22, and the conveying mechanism 22 comes to the cutting base 23. At that point, the release film is stopped, and by rotating the cutting blade 25, the release film is cut in a circular shape. The cut-away film sheet to be cut is lowered by the sheet lowering stage 24 provided on the cutting base 23, and is removed from the cutting base 23. Then, the transport mechanism 22 is actuated, and the release film F of the removed residual portion is transported from the cutting base 23 to the take-up roller 26, and the next cut portion is placed on the cutting base 23. In this way, the take-up roll 26 is wound in a roll shape by a circularly cut release film (residual film).
專利文獻1日本特開2010-036542號公報 Patent Document 1 Japanese Patent Laid-Open Publication No. 2010-036542
如上述之習知技術,將離型薄膜片材被切除後之長帶殘留部 薄膜輥狀地捲取之情況,被捲取之輥之兩側端部分,離型薄膜被確實地捲取,但被切除之部分係於鬆動地重合之中央部分,離型薄膜逐漸地變得龐大,導致無法正常地捲取。並且,其影響亦波及被拉出且載置於切除用基台上之離型薄膜,該離型薄膜變得產生扭曲及皺褶。其結果,於被切除之離型薄膜片材產生扭曲,產生無法切除正確形狀之問題。如此之問題不僅限於樹脂封裝壓縮成形裝置用之離型薄膜,自長帶之薄膜切除薄膜片材之情況亦為共通者。 According to the above-mentioned prior art, the long strip residue after the release film sheet is cut off In the case where the film is wound up in a roll shape, the release film is surely wound up at both side end portions of the wound roll, but the cut portion is tied to the central portion which is loosely overlapped, and the release film gradually becomes Huge, resulting in failure to properly roll. Further, the influence also affects the release film which is pulled out and placed on the abutting base, and the release film becomes distorted and wrinkled. As a result, distortion occurs in the cut release film sheet, which causes a problem that the correct shape cannot be removed. Such a problem is not limited to the release film for a resin-packaged compression molding apparatus, and the film is cut from a long-length film.
本發明在此欲解決之課題係,提供一種藉由適當地處理自長帶薄膜將薄膜片材切除後之殘留部薄膜,將薄膜始終於適當地狀態下切除,能夠得到無扭曲且正確形狀之薄膜片材之薄膜片材切除裝置及切除方法。 The problem to be solved by the present invention is to provide a residual film which is obtained by appropriately processing a film from a long strip film, and to cut the film at an appropriate state, thereby obtaining a distortion-free and correct shape. Film sheet cutting device and cutting method for film sheet.
為解決上述課題而做出之本發明之薄膜片材切除裝置係,自長帶薄膜切除薄膜片材,其特徵在於,具備:a)切除用基台;b)第1搬送手段,搬送長帶薄膜並將其一端之既定長度之部分載置於前述切除用基台上;c)切除手段,自長帶薄膜之前述部分切除薄膜片材;d)切斷手段,將前述薄膜片材被切除後之長帶薄膜自前述部分之邊界切斷;e)第2搬送手段,將被切除切斷之長帶薄膜即殘留部薄膜,搬送於與第1搬送手段逆向之方向並自前述切除用基台取出;以及f)吸引收容部,具備接收自前述切斷用基台取出之殘留部薄膜並具有 對應該殘留部薄膜之寬幅之橫幅及狹窄之縱幅之接收口、及吸引裝置。 A film sheet cutting device according to the present invention, which is provided by the present invention, is characterized in that: a) a film for cutting a long film, a) a base for cutting, and b) a first conveying means for conveying a long belt a film and a portion of a predetermined length of one end thereof is placed on the abutting base; c) a cutting means for cutting the film sheet from the portion of the long strip film; d) cutting means, the film sheet is cut off The long strip film is cut from the boundary of the portion; e) the second transport means transports the residual film which is the long strip film which has been cut and cut, in a direction opposite to the first transport means, and from the cutting base And the f) suction accommodating portion includes a residual portion film that is taken out from the cutting base and has A wide-width banner corresponding to the residual film and a narrow vertical receiving opening and suction device.
本發明之薄膜片材切除裝置係進行如下之動作。首先,藉由第1搬送手段,將長帶薄膜之一端之既定長度部分(當然,此部分係較欲切除之薄膜片材大)載置於前述切除用基台上。並且,於此切除用基台上,藉由切除手段切除薄膜片材。於此之切除無論其方式、手段,亦能以切刀進行切除,亦能以沖裁進行切除。被切除之薄膜片材係,藉由另外設有之手段自切除用基台取出。 The film sheet cutting device of the present invention performs the following operations. First, by the first transport means, a predetermined length portion of one end of the long-belt film (of course, this portion is larger than the film sheet to be cut) is placed on the abutting base. Further, on the abutting base, the film sheet is cut by a cutting means. Regardless of the method and means, the cutting can be performed by a cutter, and can also be cut by punching. The cut film sheet is taken out from the abutting base by means of another means.
接下來之切斷手段係,將目標之薄膜片材被切除之長帶薄膜由前述部分及接下來之部分之邊界切斷。由於前述部分係載置於切除用基台上之部分,故此邊界係為切除用基台之端或稍為外側。第2搬送手段係,將如此被切除、切斷且變短之長帶薄膜(殘留部薄膜)搬送於與第1搬送手段逆向之方向(即返回方向)並自前述切除用基台取出。被取出之殘留部薄膜係,開頭藉由切斷手段形成被切斷之端部。殘留部薄膜係,雖自此切斷端部進入吸引收容部之接收口,但在此,由於此吸引收容部具備吸引裝置,殘留部薄膜係於縱幅之狹窄接收口藉由由吸引所形成之空氣層流,不接觸其接收口之壁面等而平順地進入吸引收容部內。薄型薄膜係因應其材質於搬送時因摩擦而產生靜電,若欲自狹窄口進入,則附著於口之周圍之壁面而產生堵塞之事態為多數,但本發明之薄膜片材切除裝置中,為使吸引收容部自接收口將空氣吸引並接收殘留部薄膜,藉由如前述之空氣層流防止其向壁面附著,使其能夠平順地接收。 The next cutting means is to cut the long film of the target film sheet from the boundary between the aforementioned portion and the next portion. Since the aforementioned portion is placed on the portion for cutting the abutment, the boundary is the end of the abutment or slightly outside. In the second transport means, the long-belt film (residual film) which has been cut, cut, and shortened is transported in a direction opposite to the first transport means (that is, in the return direction), and is taken out from the abutting base. The remaining portion of the film is taken out, and the cut end portion is formed by a cutting means at the beginning. The residual film layer enters the receiving port of the suction accommodating portion from the cut end portion. However, since the suction accommodating portion is provided with the suction device, the remaining portion film is formed by suction by the narrow receiving port of the vertical width. The air laminar flow smoothly enters the suction accommodating portion without contacting the wall surface of the receiving port or the like. The thin film is made to generate static electricity due to friction during transportation due to the material. If it is intended to enter from the narrow opening, the wall surface of the thin film is clogged and the clogging occurs. However, in the film sheet cutting device of the present invention, The suction accommodating portion sucks air from the receiving port and receives the residual film, and prevents it from adhering to the wall surface by the above-described air laminar flow, so that it can be smoothly received.
於本發明之薄膜片材切除裝置,第1搬送手段係,能夠做到抓持長帶薄膜之前端並拉入前述切斷用基台上之夾具,第2搬送手段係, 能夠將殘留部薄膜由兩根輥夾持並做為搬送於與前述夾具逆方向之搬送輥對。在此,第2搬送手段之搬送輥對中,上方之輥係於第1搬送手段之夾具將長帶薄膜搬送時,為不形成阻礙,能夠預先移動至上方。 In the film sheet cutting device of the present invention, the first conveying means is capable of gripping the front end of the long film and pulling the jig on the cutting base, and the second conveying means is The residual portion film can be sandwiched between the two rolls and transported as a pair of conveying rollers in the opposite direction to the jig. Here, in the pair of conveyance rollers of the second conveyance means, when the upper roller is conveyed by the jig of the first conveyance means, the long film is conveyed, and the upper roller can be moved upward without being hindered.
而且,於第2搬送手段之搬送輥對之中之上方輥,為將殘留部薄膜搬送而下降至下方時,為使殘留部薄膜之前端(即前述切斷端部)順利地進入前述接收口,較佳為設有薄膜導件(上薄膜導件)。 In the upper roller of the transport roller pair of the second transport means, when the residual film is transported and lowered downward, the front end of the residual film (that is, the cut end) smoothly enters the receiving port. Preferably, a film guide (upper film guide) is provided.
同樣地,亦於第2搬送手段之搬送輥對之中之下方輥,較佳為設有,為不使殘留部薄膜之前端(前述切斷端部)於進入前述接收口時過度捲繞於下方之輥之薄膜導件(下薄膜導件)。 Similarly, the lower roller among the pair of conveying rollers of the second conveying means is preferably provided so as not to excessively wind the leading end film (the cutting end portion) when entering the receiving port. Film guide for the lower roller (lower film guide).
於前述吸引收容部之內部,為於接收口之下方將殘留部薄膜多數收容而設有收容部,且較佳為,前述吸引裝置係設於較其收容部上方,且不干涉自該接收口落下來之殘留部薄膜之落下通路之位置。 The inside of the suction accommodating portion is provided with a accommodating portion for accommodating a plurality of residual film layers under the receiving port, and preferably, the suction device is disposed above the accommodating portion and does not interfere with the receiving port. The position of the drop path of the falling residual film.
為解決上述課題而做出之本發明之薄膜片材切除方法係,自長帶薄膜切除薄膜片材,其特徵在於,具有:a)第1搬送步驟,搬送長帶薄膜並將其一端之既定長度之部分載置於切除用基台上;b)切除步驟,自長帶薄膜之前述部分切除薄膜片材;c)切斷步驟,將前述薄膜片材被切除後之長帶薄膜自前述部分之邊界切斷;d)第2搬送步驟,將被切除切斷之長帶薄膜之殘留部薄膜,搬送於與第1搬送步驟逆向之方向並自前述切除用基台取出;以及e)廢材收容步驟,將自前述切除用基台取出之殘留部薄膜,由具備具 有對應該殘留部薄膜之寬幅之橫幅及狹窄之縱幅之接受部及吸引裝置之吸引收容部接收。 The film sheet cutting method of the present invention, which is a method of resolving the above-mentioned problem, is characterized in that: a) a first film transfer step, a long film is conveyed, and one end of the film is fixed. a portion of the length is placed on the abutting base; b) a cutting step to cut the film sheet from the portion of the long strip film; c) a cutting step, the long strip film after the film sheet is cut from the aforementioned portion d) the second transport step, the residual film of the long strip film that has been cut and cut is transported in a direction opposite to the first transport step and taken out from the abutting base; and e) waste material a housing step of removing a residual film from the abutting abutment There is a wide banner of the residual film and a receiving portion of the narrow vertical frame and the suction receiving portion of the suction device.
於此本發明之薄膜片材切除方法,於切除步驟後進行切斷步驟係,於切除薄膜片材時,由於施加張力於長帶薄膜而能夠進行正確之切除,但若於切斷步驟採取另外之措施(例如,切除時將長帶薄膜吸附於切除用基台)等,則此等步驟為逆向亦無所謂。 In the film sheet cutting method of the present invention, the cutting step is performed after the cutting step, and when the film sheet is cut, the correct cutting can be performed by applying the tension to the long strip film, but if the cutting step is taken, The measures (for example, the long strip film is adsorbed to the abutment base when cutting), etc., the steps are reversed.
本發明之薄膜片材切除裝置及薄膜片材切除方法中,不會發生於將殘留部薄膜以原狀態捲取之習知方法中產生切除時薄膜之扭曲等問題,能夠切除正確形狀之薄膜片材。 In the film sheet cutting device and the film sheet cutting method of the present invention, the film of the correct shape can be cut off without causing a problem that the film is twisted during cutting in a conventional method of winding the residual film in the original state. material.
又,將殘留部薄膜自長帶薄膜切斷,且欲以短狀態處理之情況,因於薄膜產生靜電使殘留部薄膜附著於接觸其之部分而產生安裝困難之問題,但本發明之裝置及方法中,藉由使用具有新的構造之吸引收容部將其問題解決,且將殘留部薄膜適當地處理,不對薄膜片材切斷裝置整體之作業造成影響。 Further, when the residual film is cut from the long film, and the film is to be treated in a short state, the residual film is adhered to the portion where the film is adhered due to static electricity generated in the film, which causes difficulty in mounting, but the device of the present invention and In the method, the problem is solved by using the suction accommodating portion having a new structure, and the residual portion film is appropriately treated, which does not affect the overall operation of the film sheet cutting device.
30‧‧‧薄膜片材切除裝置 30‧‧‧film sheet cutting device
40‧‧‧薄膜供給部 40‧‧‧ Film Supply Department
41‧‧‧輥保持部 41‧‧‧ Roll Holder
42‧‧‧夾具 42‧‧‧ fixture
43‧‧‧夾具移動機構 43‧‧‧Jig moving mechanism
50‧‧‧薄膜片材切除部 50‧‧‧film sheet cutting section
51‧‧‧切除用基台 51‧‧‧Abutment abutment
52‧‧‧槽 52‧‧‧ slots
53‧‧‧片材降下台 53‧‧‧Sheel lowered
54‧‧‧切除導件 54‧‧‧Removal guides
55‧‧‧切除機構 55‧‧‧Removal mechanism
56‧‧‧旋轉軸 56‧‧‧Rotary axis
57‧‧‧臂部 57‧‧‧arm
58‧‧‧旋轉切刀 58‧‧‧Rotary cutter
60‧‧‧殘留部搬送部 60‧‧‧ Residual Department Transport Department
61‧‧‧搬送輥對 61‧‧‧Transport roller pair
61a‧‧‧上輥 61a‧‧‧Upper roll
61b‧‧‧下輥 61b‧‧‧ lower roll
62‧‧‧裁斷刃 62‧‧‧ cutting blade
63‧‧‧裁斷驅動機構 63‧‧‧ Cutting drive mechanism
64‧‧‧馬達 64‧‧‧Motor
65‧‧‧輥升降機構 65‧‧‧ Roller lifting mechanism
66‧‧‧上片材導件 66‧‧‧Upper sheet guide
67‧‧‧下片材導件 67‧‧‧Under sheet guide
70‧‧‧吸引收容部 70‧‧‧Attracting the Department of Housing
71‧‧‧收容箱 71‧‧‧Storage box
72‧‧‧吸引口 72‧‧‧ attracting mouth
73‧‧‧真空泵 73‧‧‧vacuum pump
74‧‧‧導入路 74‧‧‧Introduction
75‧‧‧接收口 75‧‧‧ receiving port
76‧‧‧隔離板 76‧‧‧Isolation board
77‧‧‧貫通孔 77‧‧‧through holes
80‧‧‧控制部 80‧‧‧Control Department
F‧‧‧離型薄膜 F‧‧‧ release film
Fr‧‧‧殘留部薄膜 Fr‧‧‧ Residual film
圖1係說明習知之壓縮成形之順序之概略圖 Figure 1 is a schematic view showing the sequence of conventional compression forming
圖2係習知之薄膜片材切除裝置之概略構成圖(a),及概略剖面圖(b)。 Fig. 2 is a schematic structural view (a) and a schematic sectional view (b) of a conventional film sheet cutting device.
圖3係本發明之一實施例之薄膜片材切除裝置之概略構成圖。 Fig. 3 is a schematic block diagram of a film sheet cutting device according to an embodiment of the present invention.
圖4係說明向同實施例之吸收收容部取出殘留部薄膜之狀態之概略圖。 Fig. 4 is a schematic view showing a state in which the residual film is taken out from the absorbing and accommodating portion of the same embodiment.
圖5係說明於同實施例之薄膜片材切除裝置之薄膜切除方法之流程圖。 Fig. 5 is a flow chart showing the film removing method of the film sheet cutting device of the same embodiment.
一面參照圖3及圖4一面說明為了製作於具備具有圓形腔之下膜具之樹脂封裝壓縮成形裝置被使用之圓形離型薄膜片材之本發明之薄膜片材切除裝置(以下,僅稱為「切除裝置」)30之一實施例。 A film sheet cutting device of the present invention for producing a circular release film sheet which is used in a resin-package compression molding apparatus having a film having a circular cavity can be described with reference to FIGS. 3 and 4 (hereinafter, only An embodiment of what is referred to as a "cutting device" 30.
本實施例之切除裝置30係,具備:薄膜供給部40,將輥狀地捲繞之離型薄膜F保持,且將其前端向前方(即,往薄膜切除部50之方向)供給;薄膜切除部50,自離型薄膜F將圓形離型薄膜片材切除;殘留部搬送部60,將離型薄膜片材被切除後之離型薄膜F其全幅切斷,且做為殘留部離型薄膜Fr向後方搬送;吸引收容部70,將向後方搬送之殘留部薄膜Fr吸引且收容;控制部80,控制其等各部。 The cutting device 30 of the present embodiment includes a film supply unit 40 that holds the release film F wound in a roll shape and feeds the front end thereof forward (that is, in the direction of the film cut portion 50); In the portion 50, the circular release film F is cut off from the release film F, and the residual portion transfer portion 60 cuts off the full-length film F from which the release film sheet is cut, and is used as a residual portion. The film Fr is conveyed rearward, and the suction receiving portion 70 sucks and houses the remaining portion film Fr that is transported rearward, and the control unit 80 controls the respective portions.
薄膜供給部40係,具備:輥保持部41,將被輥狀捲繞之長帶離型薄膜F保持;夾具42,抓持自該輥被拉出之離型薄膜F之前端(前方端);夾具移動機構43,將該夾具42於薄膜切除部50之切除用基台51之表面略為升起之位置前後移動。 The film supply unit 40 includes a roll holding unit 41 that holds the long tape release film F that is wound in a roll shape, and a jig 42 that grips the front end (front end) of the release film F that is pulled out from the roll. The jig moving mechanism 43 moves the jig 42 forward and backward at a position where the surface of the cutting base 51 of the film cutting portion 50 is slightly raised.
薄膜切除部50係具備:切除用基台51;切除機構55,設於該切除用基台51之上方;切除導件54,於該切除用基台51之表面及其上方之間形成為可上下移動。切除機構55係具備:旋轉軸56,自上方垂直垂下至切除用基台51且成為可升降;臂部57,自該旋轉軸垂直地(即,平行於切除用基台51)延伸;旋轉切刀58,垂直於臂部57向下方安裝。於切除用基台51之上面設有,具有與製作之離型薄膜F同直徑且僅於兩側具有寬度之圓形之槽52,且前述旋轉軸56係設於此圓形之槽52之中心垂線上。又,前述臂部57之長度相等於此圓之半徑。切除用基台51之較前述槽52之中心線內側之部分形成有,為取出被切除之離型薄膜片材之片材降下台 53。切除導件54由夾持切除用基台51之圓形之槽52之內側及外側之雙同心圓之壓止具形成。 The film cutting unit 50 includes a cutting base 51, a cutting mechanism 55 provided above the cutting base 51, and a cutting guide 54 formed between the surface of the cutting base 51 and the upper surface thereof. move up and down. The cutting mechanism 55 includes a rotating shaft 56 that vertically descends from above to the cutting base 51 and is movable up and down; the arm portion 57 extends perpendicularly from the rotating shaft (ie, parallel to the cutting base 51); The knife 58 is mounted downward perpendicular to the arm portion 57. A circular groove 52 having the same diameter as the produced release film F and having a width only on both sides is provided on the upper surface of the cutting base 51, and the rotating shaft 56 is disposed in the circular groove 52. Center vertical line. Further, the length of the arm portion 57 is equal to the radius of the circle. A portion of the abutting base 51 that is located inside the center line of the groove 52 is formed to remove the sheet of the removed release film sheet. 53. The cutting guide 54 is formed by a double concentric circle presser that sandwiches the inside and the outside of the circular groove 52 of the cutting base 51.
殘留部搬送部60係,除了包含將殘留部薄膜Fr向後方搬送之上下兩根之搬送輥對61之外,包含:裁斷刃62,設於其搬送輥對61之正後方(即,輥保持部41側);裁斷驅動機構63,驅動該裁斷刃62。搬送輥對61中之下輥61b係,其上部設於與前述切除用基台51之上面大致同樣高度,且藉由馬達64驅動。上輥61a係藉由輥升降機構65能夠升降,且下降至與下輥61b上之殘留部薄膜Fr接觸時帶動旋轉。於上輥61a設有將殘留部薄膜Fr之端部向下壓且為引導至收容部之接收口75之往下方曲折之L字型之上薄膜導件66。又,於下輥61b設有其殘留部薄膜Fr之端部伴隨著輥61b之旋轉,不捲繞於輥61b,且為正確地引導進入接收口75之下薄膜導件67。 The remaining portion conveying unit 60 includes a cutting blade 62 that is disposed immediately behind the conveying roller pair 61 (that is, the roller holding unit), except for the conveying roller pair 61 that conveys the remaining two sheets Fr to the rear. The portion 41 side); the cutting drive mechanism 63 drives the cutting edge 62. The lower roller 61b of the transport roller pair 61 has an upper portion substantially the same height as the upper surface of the cutting base 51, and is driven by a motor 64. The upper roller 61a is lifted and lowered by the roller elevating mechanism 65, and is lowered to bring it into rotation when it comes into contact with the residual portion film Fr on the lower roller 61b. The upper roller 61a is provided with an L-shaped upper film guide 66 that presses the end portion of the residual portion film Fr downward and is bent downward to the receiving port 75 of the accommodating portion. Further, the lower roller 61b is provided with the end portion of the residual portion film Fr along with the rotation of the roller 61b, and is not wound around the roller 61b, and is accurately guided to enter the film guide 67 below the receiving port 75.
吸引收容部70係,具備:收容箱77,設於較下輥61b後方,且較切除用基台51之上面為下方,且將被切斷之殘留部薄膜Fr收容;真空泵73,將該收容箱71內之空氣吸引;導入路74,自該收容箱71之上部向上方延伸。導入路74係,具有:於下輥61b之後方正下方開口,且具有較殘留部薄膜Fr之寬度(即,離型薄膜F之寬度)略為大之橫幅及狹窄之縱幅之接收口75。收容部71之下方係,能夠將累積之殘留部薄膜取出,而能夠卸除。於收容部71之側面上方設有吸引口72,且前述真空泵連接此吸引口72。吸引口72於收容箱71內藉由具有多數個貫通孔77之隔離板76包圍,且自收容有殘留部薄膜Fr之部分即收容部78(圖4,虛線部分)隔離。再者,於前述能夠卸除之部分或其上部,亦可設有為確認殘留部薄膜Fr之 收容狀況之確認窗。 The suction accommodating portion 70 is provided with a storage box 77 which is provided behind the lower roller 61b and which is lower than the upper surface of the cutting base 51, and accommodates the cut residual film Fr; the vacuum pump 73 accommodates the housing The air in the tank 71 is sucked; the introduction path 74 extends upward from the upper portion of the storage box 71. The introduction path 74 has a banner that is slightly open below the lower roller 61b and has a width that is slightly larger than the width of the residual film Fr (that is, the width of the release film F) and a narrow vertical receiving port 75. Below the accommodating portion 71, the accumulated residual portion film can be taken out and removed. A suction port 72 is provided above the side surface of the accommodating portion 71, and the vacuum pump is connected to the suction port 72. The suction port 72 is surrounded by the partition plate 76 having a plurality of through holes 77 in the storage box 71, and is isolated from the accommodating portion 78 (the dotted line portion in Fig. 4) which is a portion in which the residual portion film Fr is accommodated. Further, the detachable portion or the upper portion thereof may be provided to confirm the residual portion film Fr. Confirmation window of containment status.
控制部80係,自長帶離型薄膜F將圓形之離型薄膜片材切除,且為了藉由適當地將殘留部薄膜Fr回收處理,使其切除連續且安定地進行,上述各部以如圖5之流程圖之順序控制。再者,圖5之流程圖之處理係,對於連續之長帶離型薄膜F反覆進行。 The control unit 80 cuts off the circular release film sheet from the long tape release film F, and performs the cutting process continuously and stably by appropriately recovering the residual portion film Fr. The sequence control of the flow chart of Figure 5. Furthermore, the processing of the flow chart of Fig. 5 is repeated for the continuous long strip release film F.
首先,夾具移動機構43將夾具42移動至輥保持部41處,夾具42抓持長帶離型薄膜F之端部。然後,夾具移動機構43藉由將夾具42移動至切除用基台51側,將離型薄膜F自輥拉出。於離型薄膜F之前方端到達切除用基台51之後端(與輥保持部41相反側之端)之時間點,夾具42停止,將離型薄膜F配置於切除用基台51上(步驟S11)。 First, the jig moving mechanism 43 moves the jig 42 to the roller holding portion 41, and the jig 42 grips the end portion of the long tape release film F. Then, the jig moving mechanism 43 pulls the release film F from the roll by moving the jig 42 to the side of the cutting base 51. At the time when the square end of the release film F reaches the rear end of the cutting base 51 (the end opposite to the roller holding portion 41), the jig 42 is stopped, and the release film F is placed on the cutting base 51 (step S11).
接下來控制部80係,將切除導件54下降至切除用基台51上,將離型薄膜F按壓。然後,將旋轉軸56下降至旋轉切刀58之前端刺穿離型薄膜F為止,使旋轉軸56旋轉一圈。藉此將切除用基台51上之離型薄膜F被圓形地切除,且製作圓形之離型薄膜片材(步驟S12)。 Next, the control unit 80 lowers the cutting guide 54 to the cutting base 51 to press the release film F. Then, the rotating shaft 56 is lowered until the front end of the rotary cutter 58 pierces the release film F, and the rotary shaft 56 is rotated once. Thereby, the release film F on the cutting base 51 is circularly cut, and a circular release film sheet is produced (step S12).
其後,切除用基台51中央之片材降下台53向下方降下。離型薄膜片材係藉由無圖示之裝置或是藉由作業者,自切除用基台51取出(步驟S13)。 Thereafter, the sheet lowering stage 53 at the center of the cutting base 51 is lowered downward. The release film sheet is taken out from the cutting base 51 by a device (not shown) or by an operator (step S13).
控制部80接著藉由裁斷驅動機構63將長帶離型薄膜F裁斷(步驟14)。此時,為使離型薄膜F藉由切除導件54固定於切除機台上,藉由裁斷刃62確實裁斷。其後,控制部80將切斷導件54上升至上方。藉此,離型薄膜片材被切除,以較短長度被裁斷之廢材之離型薄膜F(殘留部薄膜Fr)於切除基台上解除固定,成為自由狀態(步驟S15)。 The control unit 80 then cuts the long-band release film F by the cutting drive mechanism 63 (step 14). At this time, in order to fix the release film F to the cutting machine by the cutting guide 54, the cutting blade 62 is surely cut. Thereafter, the control unit 80 raises the cutting guide 54 to the upper side. As a result, the release film sheet is cut, and the release film F (residual portion film Fr) of the waste material cut at a shorter length is released from the cutting base and is in a free state (step S15).
其後,控制部80係,首先啟動吸引收容部70之真空泵73(步驟S16)。再者,真空泵73之啟動亦可與以下之馬達64同時驅動。或者,真空泵亦可以不反覆啟動、停止,而持續地運作。 Thereafter, the control unit 80 first activates the vacuum pump 73 that sucks the storage unit 70 (step S16). Furthermore, the activation of the vacuum pump 73 can also be driven simultaneously with the motor 64 below. Alternatively, the vacuum pump can be operated continuously without restarting and stopping.
接下來控制部80係藉由輥升降機構65,使上輥61a下降至接於輥61b。藉此殘留部薄膜Fr係其裁斷端側被夾於搬送輥對61之間。接下來,下輥61b藉由馬達61旋轉驅動,上輥61a亦被下輥61帶動旋轉。藉此,殘留部薄膜Fr自切除用基台51被拉出且向後方搬送(步驟S17、圖4)。此時,夾具移動機構43以夾具42將殘留部薄膜Fr之前側端抓持著漸漸向上,並與搬送輥對61之旋轉同時地向後方移動。藉此,平順地進行殘留部薄膜Fr向後方之搬送。如無如此之夾具42進行之搬送輔助之情況,於搬送時殘留部Fr因於切斷用基台51之上之滑動產生靜電,具有附著於切除用基台51或其他部分且無法平順地進行搬送之可能性。夾具移動機構43係,於夾具42來到搬送輥對61處之時間點,解除將殘留部薄膜Fr之前方端抓持之夾具42。 Next, the control unit 80 lowers the upper roller 61a to the roller 61b by the roller elevating mechanism 65. Thereby, the cut portion end side of the residual portion film Fr is sandwiched between the pair of conveying rollers 61. Next, the lower roller 61b is rotationally driven by the motor 61, and the upper roller 61a is also rotated by the lower roller 61. Thereby, the residual portion film Fr is pulled out from the cutting base 51 and conveyed rearward (step S17, FIG. 4). At this time, the jig moving mechanism 43 grips the front end side of the remaining portion film Fr gradually upward by the jig 42 and moves rearward together with the rotation of the conveying roller pair 61. Thereby, the residual portion film Fr is smoothly conveyed rearward. When there is no such conveyance assistance by the jig 42, the residual portion Fr generates static electricity due to sliding on the cutting base 51 during transportation, and adheres to the cutting base 51 or other portions and cannot be smoothly performed. The possibility of moving. The jig moving mechanism 43 releases the jig 42 that grips the front end of the residual portion film Fr when the jig 42 comes to the transport roller pair 61.
藉由搬送輥對61將殘留部薄膜Fr向後方搬送時,殘留部薄膜Fr之裁斷端藉由設於上輥61a之上薄膜導件以及設於下輥61b之下薄膜導件,向吸引收容部70之導入路74之接收口45平順地被導入。 When the residual film Fr is conveyed rearward by the conveyance roller pair 61, the cutting end of the residual portion film Fr is sucked and received by the film guide provided on the upper roll 61a and the film guide provided under the lower roll 61b. The receiving port 45 of the introduction path 74 of the portion 70 is smoothly introduced.
於吸引收容部70,藉由真空泵73自導入路74之接收口75透過導入路74於收容箱71內吸引空氣。由於接收口75之縱幅狹窄,於其處產生空氣層流,殘留部薄膜Fr乘著其空氣層流不附著於接收口75之上下壁面而平順地導入導入路74。 In the suction accommodating portion 70, air is sucked into the storage box 71 through the introduction path 74 through the introduction port 75 of the introduction path 74 by the vacuum pump 73. Since the longitudinal width of the receiving port 75 is narrow, a laminar air flow is generated therein, and the residual film Fr is smoothly introduced into the introduction path 74 by the air layer flow which does not adhere to the upper wall surface of the receiving port 75.
聯接於真空泵71之吸引口72設於收容箱71之側面上方,且因於隔離 板76之上方設有大貫通孔77,於自導入路74之出處之收容箱71上方,空氣較為強力地吸引。其結果,導入路74將除去之殘留部薄膜Fr以強大力量吸進收容箱71內。另一方面,因設於隔離板76下方之貫通孔77為小,自吸引口72於遠處收容箱71下方空氣之吸引成為穩定,且被吸進收容箱71內之殘留部薄膜Fr藉由其自體重量落至收容箱71之下方(圖4)。 The suction port 72 coupled to the vacuum pump 71 is disposed above the side of the storage box 71, and is isolated A large through hole 77 is provided above the plate 76, and the air is relatively strongly attracted above the storage box 71 from the outlet of the introduction path 74. As a result, the introduction path 74 sucks the removed residual portion film Fr into the storage case 71 with a strong force. On the other hand, since the through hole 77 provided under the partition plate 76 is small, the suction of the air from the suction port 72 below the remote storage box 71 becomes stable, and the residual film Fr sucked into the storage case 71 is used by Its own weight falls below the containment box 71 (Fig. 4).
落下至收容箱71之下方之殘留部薄膜Fr即使因自吸引口71之吸引多少上浮,因收容箱71之底及吸引口72之間有隔離板76,殘留部薄膜Fr被吸進吸引口72且不停止吸引。 The residual portion film Fr that has fallen below the storage box 71 is slightly attracted by the suction port 71, and the partition plate 76 is formed between the bottom of the storage box 71 and the suction port 72, and the residual portion film Fr is sucked into the suction port 72. And don't stop attracting.
控制部80係,僅使下輥61b旋轉既定圈數後,使馬達64停止。藉此,殘留部薄膜Fr整體通過搬送輥對61,且收容至吸引收容部70之收容箱內。又,真空泵73停止,並且藉由輥升降機構65使上輥61a上升(步驟S18)。如以上所為,廢材即殘留部薄膜Fr自切除用基台51卸除。 The control unit 80 stops the motor 64 only after the lower roller 61b is rotated by a predetermined number of turns. Thereby, the residual portion film Fr as a whole passes through the transport roller pair 61 and is housed in the storage case of the suction accommodating portion 70. Further, the vacuum pump 73 is stopped, and the upper roller 61a is raised by the roller elevating mechanism 65 (step S18). As described above, the waste material, that is, the residual portion film Fr, is removed from the cutting base 51.
其後,回到步驟S11,反覆步驟S11~S18。如以上所為,圓形之離型薄膜片材被連續且安定地製作。 Thereafter, the process returns to step S11, and steps S11 to S18 are repeated. As described above, the circular release film sheet is continuously and stably produced.
如此,若藉由本實施例之薄膜片材切除裝置30,將每製作一片離型膜片材所產生之殘留部薄膜Fr(廢材)自長帶離型薄膜F裁斷且自切除用基台51卸除,因長帶離型薄膜F藉由夾具42重新配置,不會產生如以往就此捲取之狀況產生之扭曲或皺褶。又,於殘留部薄膜Fr之回收,亦藉由利用空氣之吸引形成之層流,能夠防止靜電造成殘留部薄膜Fr向導入路74之附著等問題。 Thus, by the film sheet cutting device 30 of the present embodiment, the residual portion film Fr (waste material) generated for each of the release film sheets is cut from the long tape release film F and the self-cutting abutment 51 is cut. The unloading, because the long release film F is reconfigured by the jig 42, does not cause distortion or wrinkles which are caused by the condition of the winding in the past. Further, in the recovery of the residual portion film Fr, a laminar flow formed by suction by air can prevent the adhesion of the residual portion film Fr to the introduction path 74 by static electricity.
30‧‧‧薄膜片材切除裝置 30‧‧‧film sheet cutting device
40‧‧‧薄膜供給部 40‧‧‧ Film Supply Department
41‧‧‧輥保持部 41‧‧‧ Roll Holder
42‧‧‧夾具 42‧‧‧ fixture
43‧‧‧夾具移動機構 43‧‧‧Jig moving mechanism
50‧‧‧薄膜片材切除部 50‧‧‧film sheet cutting section
51‧‧‧切除用基台 51‧‧‧Abutment abutment
52‧‧‧槽 52‧‧‧ slots
53‧‧‧片材降下台 53‧‧‧Sheel lowered
54‧‧‧切除導件 54‧‧‧Removal guides
55‧‧‧切除機構 55‧‧‧Removal mechanism
56‧‧‧旋轉軸 56‧‧‧Rotary axis
57‧‧‧臂部 57‧‧‧arm
58‧‧‧旋轉切刀 58‧‧‧Rotary cutter
60‧‧‧殘留部搬送部 60‧‧‧ Residual Department Transport Department
61‧‧‧搬送輥對 61‧‧‧Transport roller pair
61a‧‧‧上輥 61a‧‧‧Upper roll
61b‧‧‧下輥 61b‧‧‧ lower roll
62‧‧‧裁斷刃 62‧‧‧ cutting blade
63‧‧‧裁斷驅動機構 63‧‧‧ Cutting drive mechanism
64‧‧‧馬達 64‧‧‧Motor
65‧‧‧輥升降機構 65‧‧‧ Roller lifting mechanism
66‧‧‧上片材導件 66‧‧‧Upper sheet guide
67‧‧‧下片材導件 67‧‧‧Under sheet guide
70‧‧‧吸引收容部 70‧‧‧Attracting the Department of Housing
71‧‧‧收容箱 71‧‧‧Storage box
72‧‧‧吸引口 72‧‧‧ attracting mouth
73‧‧‧真空泵 73‧‧‧vacuum pump
74‧‧‧導入路 74‧‧‧Introduction
75‧‧‧接收口 75‧‧‧ receiving port
76‧‧‧隔離板 76‧‧‧Isolation board
77‧‧‧貫通孔 77‧‧‧through holes
78‧‧‧收容部 78‧‧‧ Housing Department
80‧‧‧控制部 80‧‧‧Control Department
F‧‧‧離型薄膜 F‧‧‧ release film
Claims (8)
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KR (1) | KR101622509B1 (en) |
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CN107571321A (en) * | 2017-08-21 | 2018-01-12 | 盐城雄鹰精密机械有限公司 | The flexible material outfeed platforms of waste material separating treatment can be achieved |
CN108284460A (en) * | 2018-01-17 | 2018-07-17 | 罗弟容 | A kind of cutting paging machine |
KR101924109B1 (en) * | 2018-02-21 | 2018-11-30 | 주식회사 상동 | Vinyl spatula removal device of plastic packing machine |
CN109291313A (en) * | 2018-08-21 | 2019-02-01 | 广州星引科技有限公司 | A kind of method that efficient paper mill waste plastics recovery utilizes |
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CN109291311A (en) * | 2018-08-21 | 2019-02-01 | 广州星引科技有限公司 | A kind of method of plastics recovery processing |
CN109291312A (en) * | 2018-08-21 | 2019-02-01 | 广州星引科技有限公司 | A kind of paper mill waste plastics recovery utilizes device and its application method |
CN109455490A (en) * | 2018-11-16 | 2019-03-12 | 东莞哈工自控科技有限公司 | A kind of cutting mechanism of lithium battery encapsulation equipment |
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KR101622509B1 (en) | 2016-05-18 |
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