CN104795309B - Thin-film sheet device for excising and cutting method - Google Patents
Thin-film sheet device for excising and cutting method Download PDFInfo
- Publication number
- CN104795309B CN104795309B CN201510022076.9A CN201510022076A CN104795309B CN 104795309 B CN104795309 B CN 104795309B CN 201510022076 A CN201510022076 A CN 201510022076A CN 104795309 B CN104795309 B CN 104795309B
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- Prior art keywords
- film
- thin
- cut
- excision
- residual part
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/10—Making cuts of other than simple rectilinear form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/25—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member
- B26D1/26—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut
- B26D1/28—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting
- B26D1/285—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting for thin material, e.g. for sheets, strips or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
- B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D2007/0012—Details, accessories or auxiliary or special operations not otherwise provided for
- B26D2007/0018—Trays, reservoirs for waste, chips or cut products
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Advancing Webs (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Details Of Cutting Devices (AREA)
Abstract
The present invention provides a kind of thin-film sheet device for excising and cutting method, and correct shape is obtained by will suitably be handled from the residual part film after the long excision thin-film sheet with film.The long band film of roll winding is grasped by fixture, and the certain length part of the front end is placed on excision base station by fixture moving mechanism, and is cut off thin-film sheet by cutting off mechanism.Length after thin-film sheet is removed is with film by severing sword by the border severing of preceding sections, it will be received by long band film, that is, residual part film of severing by carrying roller to transporting in reverse direction and being taken out from excision with base station, and from the banner of wide cut and the receiving port of narrow depth with the corresponding residual part film to the attraction receiving portion for possessing suction device.
Description
Technical field
The present invention relates to it is a kind of be from long device and its cutting method with film excision, will by release film sheet material
Semiconductor wafer is when electronic components resin-encapsulated, especially for compression forming, by the tree of graininess, powdered, paste etc.
It is used when fat material (following, to be only collectively referred to as these " resin material ") supply is to molding die chamber.
Background technology
With the slimming of electronic component, recent compression forming is used.In compression forming, resin material is supplied
The chamber having to the lower film being coated by release film sheet material, and the resin material is heated and is melted, and make to be installed on mold and dress
Substrate equipped with electronic component is impregnated to the molten resin, by lower mold and mold close film by resin compression carry out into
Type, for this purpose, by the resin of intracavitary given amount with homogeneous and without crossing with becoming important without too late supply.
It is in intracavitary that particulate resins R is with homogeneous thickness and as follows not as good as ground supply method with nothing without crossing in patent document 1
Recorded (with reference to Figure 1A to Fig. 1 G).First, there is the frame of the opening of the opening shape of the chamber 18a of corresponding lower mold 8 up and down
11 lower openings are coated by release film sheet material 12, and the lower surface for being adsorbed in frame 11 makes concavity receiving portion 13.This is recessed
Shape receiving portion 13 is loaded in mounting table 14, and from feed appliance 15 by particulate resins R on release film sheet material to become homogeneous thickness
The mode of degree supplies.Thereafter, the concavity receiving portion 13 of particulate resins R will be accommodated, with the release film piece surrounded by frame 11
The mode that the part of material 12 enters the surface of chamber 18a is placed in the die face of lower mold 18, and in the lower surface of frame 11
After the absorption of release film sheet material 12 releases, by release film sheet material 12, chamber is attracted to square particulate resins R thereon
In 18a and pull in.The particulate resins R of homogeneous thickness is supplied in chamber 18a as a result,.Thereafter, particulate resins R is heated
Melting in the lower mold 18 in chamber 18a and will be equipped with the substrate 21 of electronic component 20 containing this molten resin Rm, be pacified with it
The state of dress downwards and 19 mold closing of mold of assembling, thus impregnate electronic component 20 to molten resin R, and will be molten
Melt resin Rm is pressed by the bottom of chamber surface member 18b of resin pressurization.After molten resin cures, by by mold 19 and lower die
18 die sinking of tool, and obtain the resin-encapsulated molded product of electronic component 20.
It is in the case that wafer etc. is discoid, to use the circle of the above method release thin to be intended to the substrate of its resin forming
Film sheet, the long band release film by automatically supplying roller pull-out cut off, make successively roundly.Specifically, as shown in Fig. 2, certainly
The release film F that supply roller 27 rolls out is transported to cut-out base station 23 by transport mechanism 22, and transport mechanism 22 is in coming
Excision is stopped with the time point on base station 23, and by rotating cutting edge 25, release film with round is cut off.Removed
Release film sheet material is to fall platform with the sheet material of base station 23 by being arranged on excision, its state is kept to fall downwards, and is cut off certainly
With 23 removal of base station.Also, 22 start of transport mechanism removes the release film F of removed residual part from excision base station 23
It send to work beam 26, and next place of incision is configured on excision base station 23.So being done in work beam 26 makes to be justified
Release film (residual part film) the roll floor-covering roll cut off to shape takes.
The prior art described above, the feelings that the length after release film sheet material is removed is batched with residual part film roll
Condition, the two-side-ends part for the roller being taken up, release film are positively batched, but removed part is in loosely overlapping
Part is entreated, release film gradually becomes huge, leads to not normally batch.Also, it influences also to involve to be drawn out and carry
The release film being placed on excision base station becomes to generate distortion and gauffer.As a result, it is produced in removed release film sheet material
Raw distortion, correct shape can not be cut off by leading to the problem of.So the problem of, is not limited only to the release of resin-encapsulated molding machine
Film, the situation from the film excision thin-film sheet of long band is also common person.
1 Japanese Unexamined Patent Publication 2010-036542 publications of patent document
The content of the invention
It is existing in the prior art in order to solve the problems, such as, it is an object of the invention to：It provides a kind of by suitably handling certainly
The residual part film after thin-film sheet is cut off with film is grown, film under suitably state is cut off always, nothing can be obtained
The thin-film sheet device for excising and cutting method of the thin-film sheet of distortion and correct shape.
In order to achieve the above object, the present invention provides a kind of thin-film sheet device for excising,
Thin-film sheet is cut off from long band film, is possessed：Excision base station；1st conveyance means, the long band film of conveyance simultaneously will
The part of the certain length of its one end is placed on foregoing excision base station；Excision means are cut from long membrane preceding sections
Except thin-film sheet；Cut-off means, the length after aforementioned film sheet material is removed are cut off with film from the border of preceding sections；2nd
Conveyance means, by long band film, that is, residual part film of removed cut-out, transport in the direction reverse with the 1st conveyance means and from
Foregoing excision is taken out with base station；And attract receiving portion, possess the residual part film taken out received from foregoing cut-out base station
And with the corresponding banner of wide cut of the residual part film and the receiving port and suction device of narrow depth.
Preferably, the 1st conveyance means are the membrane front ends of the grasping length and pull on the cut-out base station
Fixture.
Preferably, the 2nd conveyance means are that the residual part film is clamped by two rollers and transported to transport in the 1st
The reverse carrying roller pair of means, and the roller above the carrying roller centering can be moved upward.
Preferably, the roller above the carrying roller centering, equipped with by the front end of the residual part film i.e. cut off end
It is directed at the film guiding element of the receiving port.
Preferably, the roller below the carrying roller centering is equipped with film guiding element, which is used in the residual
The front end of portion's film is to cut off the roller that it is made to be wound in below this when end enters the receiving port and do not make its winding excessive.
Preferably, the roller below the carrying roller centering is equipped with film guiding element, which is used in the residual
The front end of portion's film is to cut off the roller that it is made to be wound in below this when end enters the receiving port and do not make its winding excessive.
Preferably, in the inside of the attraction receiving portion, equipped in the lower section of the receiving port by the residual part
Film accommodates multiple receiving portion, and the suction device is arranged on compared with not interfering above the receiving portion and from the receiving port and fall
The position for falling access of the residual part film come.
In other words, thin-film sheet device for excising of the invention carries out following action.It first, will by the 1st conveyance means
The certain length part (certainly, this part is big compared with the thin-film sheet to be cut off) of long membrane one end is placed in foregoing excision and uses
On base station.Also, on this excision base station, thin-film sheet is cut off by cutting off means.In this excision no matter its mode, hand
Section, can also be cut off with cutter, can also be cut off with punching.Removed thin-film sheet by the means that are additionally provided with from
Excision is taken out with base station.
Next cut-off means, by the long band film that the thin-film sheet of target is removed by preceding sections and next
Portion boundary is cut off.Since preceding sections are placed in the part on excision base station, so border is the end of excision base station
Or slightly outside.2nd conveyance means, by the long band film (residual part film) for being so removed, cutting off and shortening transport in
It is simultaneously taken out from foregoing excision with base station in the reverse direction (i.e. Return-ing direction) of 1st conveyance means.The residual part film being removed is
Beginning forms cut-off end by cut-off means.Residual part film, though cut-out end enters connecing for attraction receiving portion since then
It closes up, but here, since this attraction receiving portion possesses suction device, residual part film passes through in the narrow receiving port of depth by inhaling
Draw formed lamina air flow, do not contact wall surface of its receiving port etc. and smoothly enter and attract in receiving portion.Thin gauge film because
Generate electrostatic when answering its material when conveyance because friction, if being intended to enter from narrow mouth, the wall surface that is attached to around mouth and produce
The state of affairs of raw interference is majority, but in the thin-film sheet device for excising of the present invention, to make attraction receiving portion from receiving port by air
Attract and receive residual part film, prevent it from adhering to wall surface by lamina air flow as the aforementioned, can smoothly receive.
In the thin-film sheet device for excising of the present invention, the 1st conveyance means can accomplish the long membrane front end of grasping and draw
Enter the fixture on foregoing cut-out base station, the 2nd conveyance means, residual part film can be clamped by two rollers and as conveyance in
With the carrying roller pair of foregoing fixture reverse direction.Here, the carrying roller centering of the 2nd conveyance means, the roller of top is in the 1st conveyance means
Fixture will long band film conveyance when, not form obstructions, can be moved in advance above.
Moreover, in the 2nd conveyance means carrying roller pair among upper rolls, for residual part film is transported and downwards under
During drop, for the front end of residual part film (i.e. foregoing cut-out end) is made to smoothly enter foregoing receiving port, preferably equipped with film
Guiding element (upper film guiding element).
Similarly, the lower roll among the carrying roller pair for also transporting means in the 2nd, is preferably equipped with, not make residual part
Film guiding element (the lower film of the front end (foregoing cut-out end) of the film roller of overwind in lower section when into foregoing receiving port
Guiding element).
In the inside of foregoing attraction receiving portion, for the multiple collectings of residual part film are equipped with collecting in the lower section of receiving port
Portion, and preferably, foregoing suction device are arranged on compared with above its receiving portion, and do not interfere the residual part fallen from the receiving port thin
The position for falling access of film.
In order to achieve the above object, present invention simultaneously provides thin-film sheet cutting method, cut off thin-film sheet from long band film,
It has：
1st conveyance step, conveyance is long to be placed in film and by the part of the certain length of its one end on excision base station；
Excision step, from long membrane preceding sections excision thin-film sheet；
Step is cut off, the length after aforementioned film sheet material is removed is cut off with film from the border of preceding sections；
2nd conveyance step transports the membrane residual part film of the length of removed cut-out in inverse with the 1st conveyance step
To direction and taken out from foregoing excision with base station；And
Waste wood accommodates step, and the residual part film that will be taken out from foregoing excision with base station has the corresponding residual by possessing
The attraction receiving portion of the receiving portion and suction device of the banner of the wide cut of portion's film and narrow depth receives.
In this thin-film sheet cutting method of the invention, cut-out step is carried out after excision step, in excision thin-film sheet
When, it can correctly be cut off in long band film due to applying tension, if but taking other measure (example in cut-out step
Such as, long band film is adsorbed in excision base station during excision) etc., then this and etc. also it doesn't matter to be reverse.
The beneficial effects of the present invention are：
The present invention thin-film sheet device for excising and thin-film sheet cutting method in, will not betide by residual part film with
When excision is generated in the existing method that original state is batched the problems such as the distortion of film, the thin-film sheet of correct shape can be cut off.
In addition, residual part film is cut off from long band film, and situation about being handled with short status is intended to, makes residual because generating electrostatic in film
Portion's film be attached to contact its part and lead to the problem of it is difficult to install, but in the device of the invention and method, by using
Attraction receiving portion with new construction is suitably handled by its Resolving probiems, and by residual part film, thin-film sheet is not cut
The operation of disconnected device entirety impacts.
Description of the drawings
Figure 1A-Fig. 1 G are the skeleton diagram of the order of existing compression forming.
Fig. 2A is the schematic configuration diagram of existing film device for excising.
Fig. 2 B are the summary section of existing film device for excising.
Fig. 3 is the schematic configuration diagram of the thin-film sheet device for excising of one embodiment of the invention.
Fig. 4 is the skeleton diagram for absorbing receiving portion and taking out the state of residual part film illustrated to same embodiment.
Fig. 5 is the flow chart of the thin-film sheet cutting method for the thin-film sheet device for excising for being illustrated in same embodiment.
Primary symbols explanation：
30 thin-film sheet device for excising
40 membrane supplying portions
41 roller maintaining parts
42 fixtures
43 fixture moving mechanisms
50 thin-film sheet cutout units
51 excision base stations
52 slots
53 sheet materials fall platform
54 excision guiding elements
55 excision mechanisms
56 rotation axis
57 arms
58 rotary cuttves
60 residual part conveying units
61 carrying rollers pair
61a upper rollers
61b lower rolls
62 severing swords
63 severing driving mechanisms
64 motors
65 roller elevating mechanisms
Sheet material guiding element on 66
67 times sheet material guiding elements
70 attract receiving portion
71 containing cases
72 suction ports
73 vacuum pumps
74 import road
75 receiving ports
76 isolation versions
77 through holes
80 control units
F release films
Fr residual part films.
Specific embodiment
Following explanation is carried out while with reference to Fig. 3 and Fig. 4, in order to be made in the resin for possessing the lower film with circular cavity
The thin-film sheet device for excising of the present invention for the release film sheet material that encapsulation compression-molding apparatus is used (hereinafter simply referred to as " is cut
Except device ") 30.
The device for excising 30 of the present embodiment, possesses：Membrane supplying portion 40, the release film by roll wound are kept, and
By the supply (that is, toward the direction of film cutout unit 50) forwards of its front end；Cutout unit 50, will be circular release thin from release film F
Film sheet is cut off；Residual part conveying unit 60, release film F its full width cut-outs after release film sheet material is removed, and as
Residual part release film Fr is rearward transported；Attract receiving portion 70, the residual part film F r rearward transported is attracted and accommodated；
Control unit 80 controls each portion such as its.
Membrane supplying portion 40, possesses：Roller maintaining part 41 will be kept by the length that roll is wound with release film F；Fixture 42,
Grasp the front end (forward end) for the release film F being drawn out from the roller；Fixture moving mechanism 43 cuts off the fixture 42 in film
The position that the excision in portion 50 is slightly risen with the surface of base station 51 moves back and forth.
Film cutout unit 50 possesses：Excision base station 51；Mechanism 55 is cut off, arranged on the excision top of base station 51；It cuts
Except guiding element 54, be formed as to move up and down between the surface of the excision base station 51 and its top.Excision mechanism 55 possesses：From
Upper vertical hangs down to excision base station 51 and as liftable rotation axis 56；Arm 57, from the rotation axis vertically (i.e.,
Parallel to excision base station 51) extension；Rotary cutter 58 is installed downwards perpendicular to arm 57.It is upper with base station 51 in excision
Face is equipped with, with the release film F with making with diameter and only in circular slot 52 of the both sides with width, and foregoing rotation axis
56 are arranged on the center vertical line of this circular slot 52.In addition, the radius that the equal length of aforementioned arms 57 is justified in this.Excision base
The center line of the aforementioned grooves 52 of platform 51 is formed in part with compared with inside, and the sheet material to take out removed release film sheet material is fallen
Platform 53.It cuts off guiding element 54 and clamps circular slot of the excision with base station 51, and had by the fixed of double concentric circles in its inside and outside
It is formed.
Residual part conveying unit 60, except comprising the carrying roller of two up and down for rearward transporting residual part film F r to 61
Outside, comprising：Severing sword 62, arranged on its carrying roller to 61 dead astern (that is, 41 side of roller maintaining part)；Severing driving mechanism 63,
Drive the severing sword 62.To the lower roll 61b in 61, its upper part is arranged on substantially same with base station 51 the upper surface of with foregoing excision carrying roller
Sample height, and driven by motor 64.Upper roller 61a can be lifted by roller elevating mechanism 65, and drop to on lower roll 61b
Rotation is driven when residual part film F r is contacted.The end of residual part film F r is pressed downward in upper roller 61a, and is guiding to collecting
The receiving port 75 in portion is equipped with the upper film guiding element 66 of tortuous L fonts in lower section.In addition, in lower roll 61b, residual part film
The end of Fr is not wound in roller 61b, and is equipped with correctly to lead into thin under receiving port 75 with the rotation of roller 61b
Film guiding element 67.
Attract receiving portion 70, arranged on compared with lower roll 61b rears, and compared with being lower section above excision base station 51, and possess：It receives
Tank 77 accommodates cut-off residual part film F；Vacuum pump 73 attracts the air in the containing case 71；Road 74 is imported,
Extend upward from the top of the containing case 71.Road 74 is imported, is had：Be open immediately below the rear of lower roll 61b, and with compared with
The receiving port 75 of the slightly big banner of the width (that is, the width of release film F) of residual part film F r and narrow depth.It accommodates
The lower section in portion 71 can take out the residual part film of accumulation, and being capable of removal.It is equipped with and attracts above the side of receiving portion 71
Mouth 72, and aforementioned vacuum pump connects this suction port 72.Suction port 72 in the containing case 71 by with multiple through holes 77 every
It is surrounded from plate 76, and contains part i.e. receiving portion 78 (Fig. 4, the dotted portion) isolation of residual part film F r certainly.Furthermore Yu Qian
The part for being capable of removal or its upper part are stated, can also be equipped with to confirm the confirmation window of the collecting situation of residual part film F r.
Control unit 80 cuts off circular release film sheet material with release film F from length, and in order to by suitably will be residual
Portion film F r is stayed to be recycled, make its excision continuous and is unchangeably carried out, above-mentioned each portion is with the order control of the flow chart of such as Fig. 5
System.Furthermore the processing of the flow chart of Fig. 5 is repeated for continuously long band film.
First, fixture 42 is moved at roller maintaining part 41 by fixture moving mechanism 43, and the grasping of fixture 42 is long with release film F
End.Then, fixture moving mechanism 43 is drawn release film F from roller by the way that fixture 42 is moved to 51 side of excision base station
Go out.Time point of the excision with the rear end (end with 41 opposite side of roller maintaining part) of base station 51 is reached in the forward end of release film F,
Fixture 42 stops, and release film F is configured on excision base station 51 (step S11).
Following control unit 80, excision guiding element 54 drop on excision base station 51, release film F are pressed.Then, revolve
Release film F is pierced through in the front end that shaft 56 drops to rotary cutter 58, and the rotation of rotation axis 56 is made to turn around.Thus by excision base station
Release film F on 51 is circularly cut off, and makes circular release film sheet material (step S12).
Thereafter, excision is fallen platform 53 with the sheet material in 51 center of base station and is fallen downwards.Release film sheet material passes through not shown
Device or by operator, taken out (step S13) from excision base station 51.
Control unit 80 then will be long with release film F severing (step 14) by severing driving mechanism 63.At this point, for make from
Type film F is fixed on by cutting off guiding element 54 on excision board, passes through 62 certain severing of severing sword.Thereafter, control unit 80 will be cut
Disconnected guiding element 54 rises to top.Release film sheet material is removed as a result, with short length by the waste wood of severing, that is, release film F
(residual part film F) becomes free state (step S15) in releasing fixation on excision base station.
Thereafter, control unit 80 start the vacuum pump 73 (step S16) for attracting receiving portion 70 first.Furthermore vacuum pump 73
Startup also can simultaneously drive with following motor 64.Alternatively, vacuum pump can not also start, stop repeatedly, and constantly operate.
Following control unit 80 drops to upper roller 61a and is connected to roller 61b by roller elevating mechanism 65.Thus residual part is thin
Its severing end of film Fr is sandwiched in carrying roller between 61.Next, lower roll 61b passes through 61 rotation driving of motor, upper roller 61a
Rotation is driven by lower roll 61.Residual part film F r is drawn out from excision base station 51 and rearward transports and (step S17, schemes as a result,
4).At this point, fixture moving mechanism 43 is grasp the front side end of residual part film F r upwards with fixture 42, at the same with carrying roller pair
61 rotation is rearward moved simultaneously.The conveyances of residual part film F r rearward are smoothly carried out as a result,.Such as without this fixture 42
The situation of the conveyance of progress, residual part Fr generates electrostatic by slip of the cut-out on base station 51 during conveyance, has and is attached to
Excision is with base station 51 or other parts and the possibility that can not smoothly be transported.Fixture moving mechanism 43, in fixture 42
It to the time point at 61, is released the fixture 42 of the forward end grasping of residual part film F r to transporting.It will to 61 by carrying roller
When residual part film F r is rearward transported, the severing end of residual part film F r by be arranged on upper roller 61a upper film guiding element and
Arranged on the lower film guiding element of lower roll 61b, the receiving port 75 to the importing road 74 for attracting receiving portion 70 is smoothly imported into.
In attracting receiving portion 70, by the receiving port 75 of 73 self-conductance approach 74 of vacuum pump by importing road 74 in containing case 71
Interior attraction air.Since the depth of receiving port 75 is narrow, lamina air flow is generated at it, residual part film F r multiplies its air layer
Stream is attached to the upper lower wall surface of receiving port 75 and smoothly imports and import road 74.
The suction port 72 for being connected in vacuum pump 71 is arranged on above the side of containing case 71, and because being set in the top of isolation board 76
There is big through hole 77, above the containing case 71 in the source of self-conductance approach 74, air more strongly attracts.As a result, it imports
Road 74 is by the residual part film F r of removing in great power inspiration containing case 71.On the other hand, because arranged on 76 lower section of isolation board
Through hole 77 to be small, self-gravitation mouth 72 becomes in the attraction of 71 lower air of distant place containing case and stablizes, and is sucked into containing case
Residual part in 71 drops down onto the lower section (Fig. 4) of containing case 71 by it from body weight.
Even if how much the residual part film F r for falling to the lower section of containing case 71 is floated by the attraction of self-gravitation mouth 71, because
There is isolation board 76 between the bottom of containing case 71 and suction port 72, residual part film F r is sucked into suction port 72 and does not stop attracting.
Control unit 80 after lower roll 61b is only made to rotate both fixing turns, stops motor 64.Residual part film F r is whole as a result,
By carrying roller to 61, and accommodate to the containing case for attracting receiving portion 70.In addition, vacuum pump 73 stops, and pass through roller liter
Descending mechanism 65 makes upper roller 61a rise (step S18).As carried out by above, waste wood, that is, residual part film F r is unloaded from excision base station 51
It removes.
Thereafter, step S11 is returned to, repeatedly step S11~S18.As carried out by above, circular release film sheet material is continuous
And it unchangeably makes.
If in this way, thin-film sheet device for excising 30 through this embodiment, produced by often making a piece of release film sheet
Residual part film F r (waste wood) from long with release film F severing and from excision 51 removal of base station, lead to because long with release film F
It crosses fixture 42 to reconfigure, the distortion generated such as the situation batched with regard to this in the past or gauffer will not be generated.It is in addition, thin in residual part
The recycling of film Fr also by the laminar flow that the attraction of air is formed, can prevent electrostatic from causing residual part film F r to importing
The problems such as attachment on road 74.
Claims (8)
1. a kind of thin-film sheet device for excising cuts off thin-film sheet, which is characterized in that it possesses from long band film：Excision base
Platform；1st conveyance means are placed in the excision base station for conveyance length with film and by the part of the certain length of its one end
On；Excision means are to cut off thin-film sheet from the part of the long membrane certain length；Cut-off means, for by institute
The length after thin-film sheet is removed is stated to cut off from the portion boundary of the certain length with film；2nd conveyance means, being will
Long band film, that is, residual part film of cut-out is removed, transport in the direction reverse with the 1st conveyance means and is used from the excision
Base station takes out；And attract receiving portion, possess the residual part film received from excision base station taking-up and with correspondence
The receiving port and suction device of the banner of the wide cut of the residual part film and narrow depth.
2. thin-film sheet device for excising according to claim 1, which is characterized in that the 1st conveyance means are grasping institutes
It states long membrane front end and pulls in the fixture on the excision base station.
3. thin-film sheet device for excising according to claim 1 or 2, which is characterized in that the 2nd conveyance means are by institute
Residual part film is stated to be clamped by two rollers and transported in the carrying roller pair reverse with the 1st conveyance means, and in the carrying roller centering
The roller of side can be moved upward.
4. thin-film sheet device for excising according to claim 3, which is characterized in that above the carrying roller centering
Roller, equipped with the film guiding element that the front end of the residual part film i.e. cut-out end is directed to the receiving port.
5. thin-film sheet device for excising according to claim 3, which is characterized in that below the carrying roller centering
Roller, equipped with the film guiding element that the front end of the residual part film i.e. cut-out end is directed to the receiving port.
6. thin-film sheet device for excising according to claim 4, which is characterized in that below the carrying roller centering
Roller, equipped with the film guiding element that the front end of the residual part film i.e. cut-out end is directed to the receiving port.
7. thin-film sheet device for excising according to claim 1, which is characterized in that in it is described attraction receiving portion inside,
Equipped with for the residual part film to be accommodated multiple receiving portion in the lower section of the receiving port, and the suction device is arranged on
The position for falling access of the residual part film fallen from the receiving port is not interfered compared with receiving portion top and.
8. a kind of thin-film sheet cutting method cuts off thin-film sheet, which is characterized in that it has from long band film：
1st conveyance step is placed in for conveyance length with film and by the part of the certain length of its one end on excision base station；
Excision step is to cut off thin-film sheet from the long membrane part；
Step is cut off, is cut off for the long band film after the thin-film sheet is removed from the portion boundary；
2nd conveyance step is by the membrane residual part film of the length of removed cut-out, transports in inverse with the 1st conveyance step
To direction and taken out from the excision with base station；And
Waste wood accommodates step, for the residual part film that will be taken out from the excision base station, has the corresponding residual by possessing
The attraction receiving portion of the receiving portion and suction device of the banner of the wide cut of portion's film and narrow depth receives.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-008925 | 2014-01-21 | ||
| JP2014008925A JP6212399B2 (en) | 2014-01-21 | 2014-01-21 | Film sheet cutting device and cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104795309A CN104795309A (en) | 2015-07-22 |
| CN104795309B true CN104795309B (en) | 2018-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510022076.9A Active CN104795309B (en) | 2014-01-21 | 2015-01-16 | Thin-film sheet device for excising and cutting method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6212399B2 (en) |
| KR (1) | KR101622509B1 (en) |
| CN (1) | CN104795309B (en) |
| TW (1) | TWI551415B (en) |
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|---|---|---|---|---|
| CN107571321A (en) * | 2017-08-21 | 2018-01-12 | 盐城雄鹰精密机械有限公司 | The flexible material outfeed platforms of waste material separating treatment can be achieved |
| CN108284460A (en) * | 2018-01-17 | 2018-07-17 | 罗弟容 | A kind of cutting paging machine |
| KR101924109B1 (en) * | 2018-02-21 | 2018-11-30 | 주식회사 상동 | Vinyl spatula removal device of plastic packing machine |
| CN109230724A (en) * | 2018-08-21 | 2019-01-18 | 广州和井贸易有限公司 | A kind of nylon cloth process equipment |
| CN109291313A (en) * | 2018-08-21 | 2019-02-01 | 广州星引科技有限公司 | A kind of method that efficient paper mill waste plastics recovery utilizes |
| CN109291312A (en) * | 2018-08-21 | 2019-02-01 | 广州星引科技有限公司 | A kind of paper mill waste plastics recovery utilizes device and its application method |
| CN109291311A (en) * | 2018-08-21 | 2019-02-01 | 广州星引科技有限公司 | A kind of method of plastics recovery processing |
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| CN110525754A (en) * | 2019-08-20 | 2019-12-03 | 江苏东旭亿泰智能装备有限公司 | Band body recyclable device |
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| CN112519316A (en) * | 2020-12-30 | 2021-03-19 | 苏州华日金菱机械有限公司 | Automatic device for feeding bag ironing film of ostomy bag |
| CN113148749B (en) * | 2021-04-09 | 2024-05-07 | 威海市龙升精密机械股份有限公司 | Domestic film cutting machine |
| CN113753652A (en) * | 2021-10-08 | 2021-12-07 | 铜陵天天纸品科技有限公司 | Napkin packaging and distributing system |
| CN114380102B (en) * | 2021-12-14 | 2023-05-12 | 泉州市环球新材料科技有限公司 | Automatic composite film cutting and forming equipment |
| CN115418848B (en) * | 2022-09-23 | 2024-02-13 | 绍兴博利豪家纺有限公司 | High-efficient fabric cutting machine |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6080263A (en) * | 1997-05-30 | 2000-06-27 | Lintec Corporation | Method and apparatus for applying a protecting film to a semiconductor wafer |
| CN102034729A (en) * | 2009-10-01 | 2011-04-27 | 日东电工株式会社 | Adhesive tape joining apparatus |
| CN102529002A (en) * | 2010-09-16 | 2012-07-04 | 东和株式会社 | Compression forming mold and compression forming method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6165060U (en) * | 1984-10-05 | 1986-05-02 | ||
| JPH0487796A (en) * | 1990-07-27 | 1992-03-19 | Kataoka Mach Co Ltd | Apparatus for cutting and processing side wrapping paper and apparatus for preparing side wrapping paper |
| JPH085577B2 (en) * | 1992-04-23 | 1996-01-24 | 日本金網商工株式会社 | Transfer device for thin strips |
| JP4796673B2 (en) | 2005-06-14 | 2011-10-19 | 日本メクトロン株式会社 | Long film substrate cutting device |
| JP4403133B2 (en) * | 2005-11-18 | 2010-01-20 | 日本メクトロン株式会社 | Long film transport apparatus and transport method. |
| JP5028233B2 (en) * | 2007-11-26 | 2012-09-19 | 日東電工株式会社 | Semiconductor wafer protective tape cutting method and protective tape cutting device |
| CN101450419B (en) * | 2007-11-30 | 2011-09-28 | 深圳市大族激光科技股份有限公司 | ITO film laser engraving device and method |
| JP5153509B2 (en) | 2008-08-08 | 2013-02-27 | Ｔｏｗａ株式会社 | Electronic component compression molding method and mold apparatus |
| JP5413582B2 (en) | 2009-07-17 | 2014-02-12 | 岩崎通信機株式会社 | Cutting device and paper discharge tray |
| JP5991655B2 (en) * | 2012-02-27 | 2016-09-14 | 三菱重工メカトロシステムズ株式会社 | Print issue device |
-
2014
- 2014-01-21 JP JP2014008925A patent/JP6212399B2/en active Active
- 2014-12-09 TW TW103142763A patent/TWI551415B/en active
-
2015
- 2015-01-16 CN CN201510022076.9A patent/CN104795309B/en active Active
- 2015-01-21 KR KR1020150009825A patent/KR101622509B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6080263A (en) * | 1997-05-30 | 2000-06-27 | Lintec Corporation | Method and apparatus for applying a protecting film to a semiconductor wafer |
| CN102034729A (en) * | 2009-10-01 | 2011-04-27 | 日东电工株式会社 | Adhesive tape joining apparatus |
| CN102529002A (en) * | 2010-09-16 | 2012-07-04 | 东和株式会社 | Compression forming mold and compression forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104795309A (en) | 2015-07-22 |
| JP6212399B2 (en) | 2017-10-11 |
| KR101622509B1 (en) | 2016-05-18 |
| TWI551415B (en) | 2016-10-01 |
| JP2015137157A (en) | 2015-07-30 |
| TW201532769A (en) | 2015-09-01 |
| KR20150087137A (en) | 2015-07-29 |
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