CN111261590A - Method and apparatus for mounting semiconductor wafer - Google Patents

Method and apparatus for mounting semiconductor wafer Download PDF

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Publication number
CN111261590A
CN111261590A CN202010061259.2A CN202010061259A CN111261590A CN 111261590 A CN111261590 A CN 111261590A CN 202010061259 A CN202010061259 A CN 202010061259A CN 111261590 A CN111261590 A CN 111261590A
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CN
China
Prior art keywords
adhesive tape
semiconductor wafer
holding
wafer
mounting
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Pending
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CN202010061259.2A
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Chinese (zh)
Inventor
山本雅之
奥野长平
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN111261590A publication Critical patent/CN111261590A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

Abstract

The invention provides a method and an apparatus for mounting a semiconductor wafer, by which an adhesive tape for supporting is accurately adhered to a back surface of a semiconductor wafer having an annular projection formed on the back surface and a ring frame. A semiconductor wafer (W) is accommodated and held in one of a pair of covers in a state where an adhesive tape (T) attached to a ring frame (f) and the back surface of the wafer (W) are brought close to and opposed to each other, and the adhesive tape (T) is sandwiched between the two covers to form a chamber. A pressure difference is generated between two spaces partitioned by an adhesive tape (T) in a chamber, and the adhesive tape (T) is heated and bent in a concave manner, so that the adhesive tape (T) is bonded to the back surface of a wafer (W). After the pressure difference is eliminated and the heating is stopped, the adhesive tape (T) is attached to the wafer (W) while reheating the adhesive tape (T).

Description

Method and apparatus for mounting semiconductor wafer
The present application is a divisional application of patent application entitled method and apparatus for mounting semiconductor wafers on 2015, 12/23, application No. 201510980601.8.
Technical Field
The present invention relates to a method and an apparatus for mounting a semiconductor wafer (hereinafter, referred to as "wafer" as appropriate) on the center of a ring frame via an adhesive tape for supporting.
Background
In order to reinforce a wafer whose rigidity is reduced by back grinding, only the central portion is ground while leaving the outer periphery of the back surface. That is, an annular projection is formed on the outer periphery of the back surface of the wafer. Before the wafer is subjected to dicing processing, the wafer is mounted at the center of the ring frame via an adhesive tape for supporting.
For example, the wafer is placed and held on a holding table provided in a lower cover of a pair of upper and lower covers, and the ring frame is held on a frame holding table surrounding the lower cover. After the adhesive tape is attached to the ring frame, a part of the adhesive tape located inside the ring frame is sandwiched by two covers to form a chamber. At this time, since the adhesive tape and the back surface of the wafer are close to each other and face each other, the adhesive tape is pressed radially outward from the center of the adhesive tape by the hemispherical elastic body while generating a pressure difference between the two spaces partitioned by the adhesive tape, and the adhesive tape is attached to the back surface of the wafer.
After the adhesive tape is completely attached, a 2 nd attaching process is performed by blowing gas from the 1 st pressing member to a portion of the adhesive tape that is not completely attached to the inside corner of the annular convex portion and floats (see patent document 1).
Patent document 1: japanese patent laid-open publication No. 2013-232582
Disclosure of Invention
Problems to be solved by the invention
In the conventional adhesive tape joining method, the adhesive tape can be adhered to the inner corner of the annular convex portion. However, there is a problem that the adhesive tape is peeled from the corner portion toward the wafer center with the passage of time after the adhesive tape is attached.
The present invention has been made in view of the above circumstances, and a main object thereof is to provide a method of mounting a semiconductor wafer and an apparatus for mounting a semiconductor wafer, which can efficiently attach an adhesive tape to a back surface of a semiconductor wafer having an annular convex portion formed on the back surface thereof and can suppress peeling of the adhesive tape from the back surface of the semiconductor wafer.
Means for solving the problems
In order to achieve the object, the present invention adopts the following configuration.
That is, a method of mounting a semiconductor wafer, in which the semiconductor wafer is mounted on a ring frame via a supporting adhesive tape, wherein the semiconductor wafer has an annular projection on an outer periphery of a back surface thereof, the method comprising: a chamber forming step of forming a chamber by holding the semiconductor wafer by a holding table provided in one of a pair of covers and sandwiching the adhesive tape between the two covers, in a state where the adhesive tape attached to the ring frame and the back surface of the semiconductor wafer are brought close to each other and opposed to each other; a first bonding step of bonding the adhesive tape to the back surface of the semiconductor wafer by generating a pressure difference between two spaces partitioned by the adhesive tape in the cover and by heating the adhesive tape while bending the adhesive tape concavely; and a 2 nd joining step of joining the adhesive tape while reheating the adhesive tape after the pressure difference in the chamber is eliminated and the heating is stopped in the 2 nd joining step.
Action and Effect
In the above method, the adhesive tape is softened by heating. By generating a pressure difference between the two spaces in the chamber in this state, the adhesive tape can be concavely curved toward the wafer back surface. That is, the adhesive tape is attached while extending radially from the center toward the outer periphery of the semiconductor wafer. Therefore, air entrainment at the bonding interface between the adhesive tape and the semiconductor wafer can be suppressed.
Further, as the adhesive tape is concavely curved, the tension applied to the adhesive tape increases toward the outer periphery of the semiconductor wafer. Therefore, the entire surface of the adhesive tape attached to the semiconductor wafer in the first attaching step 1 is in contact with the inside corner of the annular convex portion and the vicinity thereof, or a part of the adhesive tape is in contact with the inside corner of the annular convex portion and the vicinity thereof, and thus the adhesive tape is not completely adhered.
When the pressure difference is eliminated by returning the inside of the chamber to the atmospheric state, the adhesive tape is released from the corner portion with the passage of time by the action of the tensile stress accumulated in the adhesive tape by the tension at the time of attachment. The peeling in the first attaching step 1 is caused by at least one of stretching of the pressure-sensitive adhesive tape mainly due to elastic deformation by tension and the pressure-sensitive adhesive not sufficiently softened completely.
However, by reheating the adhesive tape in the 2 nd joining step after the 1 st joining step, at least one of the following functions can be exhibited: the adhesive tape near the corner portion is deformed mainly by plastic deformation and the adhesive of the adhesive tape is sufficiently softened, so that the adhesive tape can be prevented from being peeled from the semiconductor wafer.
In the method, it is preferable that the second bonding step 2 is performed in which the adhesive tape is exposed to the atmosphere at room temperature while the semiconductor wafer is carried out from the chamber in the first bonding step and conveyed to a different holding stage, and then the adhesive tape is bonded to the semiconductor wafer while being heated on the holding stage.
With this method, since the adhesive tape is exposed to the atmosphere at room temperature in the process of transporting the semiconductor wafer to another holding stage, the base material of the adhesive tape is slightly cooled and solidified. Therefore, the portion of the adhesive tape that adheres to the semiconductor wafer is easily adhered.
In order to achieve the above object, the present invention adopts the following configuration.
That is, the present invention provides a semiconductor wafer mounting apparatus for mounting a semiconductor wafer on a ring frame via a supporting adhesive tape, the semiconductor wafer mounting apparatus comprising: a 1 st holding stage for holding the semiconductor wafer having an annular projection on a back surface outer periphery; a frame holding section for holding a ring frame to which the adhesive tape is attached; a chamber for accommodating the 1 st holding stage and including a pair of covers for sandwiching an adhesive tape adhered to a ring frame; and a 1 st heater for heating the adhesive tape in the chamber; a 1 st bonding mechanism including a control unit that controls to cause a pressure difference between two spaces partitioned by the adhesive tape in the chamber, and to bond the adhesive tape to the back surface of the semiconductor wafer while bending the adhesive tape being heated in a concave manner, and a 2 nd holding stage that holds a mounting frame in which the semiconductor wafer is bonded to the adhesive tape by the 1 st bonding mechanism; a 2 nd heater for reheating the adhesive tape on the 2 nd holding stage; and a conveying mechanism for conveying the mounting frame from the 1 st attaching mechanism to the 2 nd holding table.
Action and Effect
With this configuration, the adhesive tape can be attached to the entire back surface of the semiconductor wafer by the 1 st attaching mechanism. Then, on the 2 nd holding stage, the semiconductor wafer already mounted on the ring frame is reheated by adhering an adhesive tape to a portion of the semiconductor wafer in a range from a vicinity of a corner portion on an inner side of the annular convex portion to the corner portion. That is, only a portion of the adhesive tape that is not completely bonded to the semiconductor wafer can be bonded to the wafer. Thus, the method can be suitably carried out.
In the above configuration, it is preferable that the 1 st attaching mechanism includes: a tape supply unit for supplying an adhesive tape covering the size of the ring frame; a tape attaching mechanism for attaching an adhesive tape to the ring frame and a joining portion of one of the pair of covers for joining the pair of covers; a cutting mechanism for cutting the adhesive tape on the ring frame; a peeling mechanism for peeling off the cut-out circular portion of the adhesive tape; and a tape recovery unit for recovering a portion of the adhesive tape that has been peeled off.
With this configuration, the adhesive tape can be diced while the adhesive tape is attached to the back surface of the semiconductor wafer in the chamber. Thus, the time for attaching the adhesive tape can be shortened.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the method and apparatus for mounting a semiconductor wafer of the present invention, it is possible to suppress the separation of the adhesive tape for supporting, which is adhered to the back surface of the semiconductor wafer having the annular convex portion formed on the outer periphery of the back surface, from the inner corner portion of the annular convex portion.
Drawings
Fig. 1 is a partially cut-away perspective view of a semiconductor wafer.
Fig. 2 is a perspective view of the back side of the semiconductor wafer.
FIG. 3 is a partial longitudinal cross-sectional view of a semiconductor wafer.
Fig. 4 is a plan view showing the structure of the mounting apparatus for a semiconductor wafer.
Fig. 5 is a front view of the mounting apparatus for a semiconductor wafer.
Fig. 6 is a front view showing a part of the wafer transfer mechanism.
Fig. 7 is a plan view showing a part of the wafer transfer mechanism.
Fig. 8 is a front view of the wafer conveyance device.
Fig. 9 is a plan view showing a moving structure of the wafer transfer device.
Fig. 10 is a front view of the frame conveying device.
Fig. 11 is a front view of the flipping unit.
Fig. 12 is a plan view of the flipping unit.
Fig. 13 is a front view of the ejector.
Fig. 14 is a top view of the pusher.
Fig. 15 is a front view of the 1 st pasting unit.
Fig. 16 is a partial sectional view showing a schematic configuration of the tape application portion.
Figure 17 is a longitudinal cross-sectional view of the chamber.
Fig. 18 is a top view of the tape cutting mechanism.
Fig. 19 is a schematic view showing an operation of attaching the adhesive tape.
Fig. 20 is a schematic view showing an operation of attaching the adhesive tape.
Fig. 21 is a schematic view showing an operation of attaching the adhesive tape.
Fig. 22 is a schematic view showing an operation of attaching the adhesive tape.
Fig. 23 is a schematic view showing an operation of attaching the adhesive tape.
Fig. 24 is a perspective view of the mounting frame.
Fig. 25 is a schematic diagram of the 2 nd pasting process.
FIG. 26 is a graph showing a comparison of the results of the peeling measurements carried out by the example apparatus and the comparative example apparatus.
Fig. 27 is a schematic view showing measurement of the sag of the adhesive tape.
FIG. 28 is a graph showing a comparison of relaxation measurement results performed by the apparatus of the example and the apparatus of the comparative example.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Semiconductor wafer
As shown in fig. 1 to 3, a semiconductor wafer W (hereinafter simply referred to as "wafer") is a wafer having a surface on which a protective tape PT is bonded and subjected to a back grinding process with the surface protected. The back surface of the wafer is ground (back-ground) so that the outer peripheral portion is left by about 2mm in the radial direction. That is, the wafer to be used is processed into a shape in which a flat concave portion b is formed on the back surface and an annular convex portion r is left along the outer periphery of the back surface. For example, the flat concave portion b is processed so that the depth d is several hundreds of μm and the wafer thickness t in the grinding region is several tens of μm. Therefore, the annular projecting portion r formed on the outer periphery of the back surface functions as an annular rib for improving the rigidity of the wafer W, and suppresses the wafer W from being deformed by bending (handling) or other processing steps.
Mounting of semiconductor wafersMounting device
Fig. 4 shows a plan view of a mounting device for a semiconductor wafer.
As shown in fig. 4, the mounting device includes: a base unit having a convex shape and including a horizontally long rectangular portion A and a protruding portion B connected to the central portion of the rectangular portion A and protruding upward; and a marking unit C connected to the base unit in a space on the left side of the protruding portion B in the lateral direction. In the following description, the longitudinal direction of the rectangular portion a is referred to as the left-right direction, and the horizontal direction orthogonal to the longitudinal direction is referred to as the lower side and the upper side.
A wafer transfer mechanism 1 is provided on the right side of the rectangular portion a. Two containers 2 are placed in parallel on the lower right side of the rectangular portion a, and wafers W are accommodated in the two containers 2. A recovery unit 3 is provided at the left end of the lower side of the rectangular portion a, and the recovery unit 3 is used to recover a mounting frame MF shown in fig. 24 after the mounting of the wafer W is completed.
The aligner 4, the 1 st holding stage 5, the frame supply unit 6, and the reversing unit 7 are arranged in this order from the upper right side of the rectangular portion a. A 2 nd holding table 8 described later is provided below the reversing unit 7. Further, a slidably movable pusher 9 is provided above the reversing unit 7.
The protruding portion B serves as the 1 st attaching unit 10 for attaching the adhesive tape T (dicing tape) for support to the ring frame f and attaching the adhesive tape T to the wafer W.
As shown in fig. 5, the wafer transfer mechanism 1 includes: a wafer transfer device 15 supported on the right side of the guide rail 14 so as to be capable of reciprocating left and right, the guide rail 14 being horizontally erected on the upper portion of the rectangular portion a; and a frame conveyance device 16 supported on the left side of the guide rail 14 so as to be movable in the left-right direction.
The wafer transfer device 15 is configured to be able to transfer the wafer W taken out from any one of the containers 2 in the left-right direction and the front-back direction and to be able to turn the posture of the wafer W back and forth.
As shown in fig. 6 and 8, the wafer transfer device 15 is equipped with a movable right and left table 18 that can move right and left along the guide rail 14. A movable table 20 for forward and backward movement is provided so as to be movable forward and backward along a guide rail 19 provided on the movable table 18 for leftward and rightward movement. A holding unit 21 for holding the wafer W is provided below the movable forward/backward movement table 20 so as to be movable up and down.
As shown in fig. 6 and 7, a drive pulley 23 that is driven by the motor 22 to rotate forward and backward is axially supported near the right end of the guide rail 14, and an idle pulley 24 is axially supported on the center side of the guide rail 14. A slide engaging portion 18a of the movable leftward and rightward movement table 18 is connected to a belt 25 wound around the drive pulley 23 and the idle pulley 24, and the movable leftward and rightward movement table 18 is moved in the leftward and rightward direction by forward and reverse rotation of the belt 25.
As shown in fig. 9, a drive pulley 27 driven by a motor 26 to rotate forward and backward is axially supported near the upper end of the movable leftward and rightward movement table 18, and an idle pulley 28 is axially supported near the lower end of the movable leftward and rightward movement table 18. A slide engaging portion 20a of the forward-and-backward movable base 20 is connected to a belt 29 wound around the drive pulley 27 and the idle pulley 28, and the forward-and-backward movable base 20 is moved in the forward-and-backward direction by forward and reverse rotation of the belt 29.
As shown in fig. 8, the holding unit 21 includes: an inverted L-shaped support frame 30 coupled to the lower portion of the forward-and-backward movable base 20, an elevating table 32 that is moved up and down by a screw feed by a motor 31 along the vertical frame portion of the support frame 30, a turning table 34 that is pivotally supported by the elevating table 32 via a turning shaft 33 so as to be rotatable about a vertical support shaft p, a rotating motor that is interlocked with the turning shaft 33 by hooking of a belt 35, a holding arm 38 that is pivotally supported by the lower portion of the turning table 34 via a turning shaft 37 so as to be rotatable about a horizontal direction toward the support shaft q, and a reversing motor 40 that is interlocked with the turning shaft 37 by hooking of a belt 39.
The retaining arm 38 is horseshoe shaped. A plurality of suction cups 41 are provided on the holding surface of the holding arm 38 so as to slightly protrude. The holding arm 38 communicates with and is connected to the air compressor via a flow path formed inside the holding arm 38 and a connection flow path connected to the flow path on the base end side of the flow path.
By using the movable structure, the wafer W held by suction can be moved forward and backward, leftward and rightward, and rotated about the vertical support shaft p by the holding arm 38, and the wafer W can be turned upside down by turning it about the horizontal support shaft q shown in fig. 8.
As shown in fig. 10, the frame conveyance device 16 includes: a vertical frame 44 connected to a lower portion of the forward/backward movable table 43, a lifting frame 45 supported so as to be capable of sliding and lifting along the vertical frame 44, a telescopic link mechanism 46 for vertically moving the lifting frame 45, a motor 47 for driving the telescopic link mechanism 46 to be forwardly and reversely telescopic, a suction plate 48 for sucking the wafer W mounted on a lower end of the lifting frame 45, and a plurality of suction pads 49 disposed around the suction plate 48 for sucking the ring frame f. Therefore, the frame transfer device 16 can transfer the ring frame f and the mounting frame MF placed and held on the 1 st holding base 5 in the up-down direction, the front-rear direction, and the left-right direction by sucking them. The suction cup 49 is slidably adjustable in the horizontal direction corresponding to the size of the ring frame f.
As shown in fig. 15 to 17, the 1 st holding stage 5 is a metallic chuck stage having the same shape as the wafer W and a size equal to or larger than the size of the wafer W, and the 1 st holding stage 5 is connected to and communicated with an external vacuum device 95 through a flow path 94. The 1 st holding base 5 is provided with a plurality of support pins 50.
The pins 50 are provided at regular intervals on a predetermined circumference of the 1 st holding base 5. That is, the pin 50 is configured to be movable up and down to extend and retract with respect to the holding surface of the 1 st holding base 5 by an actuator such as a cylinder. Further, the tip of the pin 50 is constituted by or covered with an insulator.
An annular convex portion is formed on the 1 st holding stage 5, and the annular convex portion supports only the outer peripheral region of the wafer W in contact therewith. Further, a heater 107 is embedded in the 1 st holding base 5. The 1 st holding base 5 is accommodated in a lower cover 11A constituting a chamber 11 described later. The lower cover 11A has a frame holding portion 51 surrounding the lower cover 11A. The frame holding portion 51 is configured to make the cylindrical top of the lower cover 11A flush with the ring frame f when the ring frame f is placed thereon.
As shown in fig. 4, the 1 st holding stage 5 is configured to be reciprocally movable by a driving mechanism, not shown, along a rail 58, and the rail 58 is laid between a position for placing the wafer W in the rectangular portion a and a position for attaching the 1 st tape attaching unit 10 to the projecting portion B.
The frame supply unit 6 accommodates a pull-out type cassette, and a predetermined number of ring frames f are stacked and accommodated in the cassette.
As shown in fig. 11 and 12, in the reversing unit 7, a receiving frame 62 that can be rotated about a horizontal support shaft r by a rotary actuator 61 is attached to an elevating table 60 in a cantilever shape, the elevating table 60 can be elevated and lowered along a vertical rail 59 that is fixed upright, and claws 63 are respectively provided on a base portion and a tip portion of the receiving frame 62 so as to be rotatable about a support shaft s. The inverting unit 7 is configured to face the circuit pattern upward after receiving the mounting frame MF with the circuit face downward from the frame conveyance device 16 and inverting the mounting frame MF.
The 2 nd holding base 8 reciprocates along the rail 58C between the receiving position of the mounting frame MF directly below the reversing unit 7 and the printing position of the marking unit C. As shown in fig. 25, the 2 nd holding base 8 is a chuck base having a size capable of suction-holding the entire back surface of the mounting frame MF. The 2 nd holding base 8 is formed of a metal or ceramic porous material. Further, a heater is embedded in the 2 nd holding base 8.
The pusher 9 is used to accommodate the mounting frame MF placed on the 2 nd holding base 8 in the mounting frame collecting unit 3. The detailed structure of the pusher 9 is shown in fig. 13 and 14.
In the pusher 9, a fixed receiving piece 66 and a chuck piece 68 opened and closed by a cylinder 67 are provided on the upper portion of a movable table 65 horizontally moving in the left-right direction along a rail 64. The pusher 9 is configured to hold one end portion of the mounting frame MF from the vertical direction by the fixing receiving piece 66 and the chuck piece 68. The lower portion of the movable table 65 is connected to a belt 70 rotated by a motor 69, and the movable table 65 is reciprocated in the left-right direction by the forward-reverse operation of the motor 69.
As shown in fig. 15, the 1 st pasting unit 10 includes a tape supply section 71, a separator recovery section 72, a tape pasting section 73, a tape recovery section 74, and the like. The respective configurations are described in detail below.
The tape supply section 71 is configured to peel off the separator S by a peeling roller 75 while supplying the adhesive tape T from a supply roll filled with a raw material roll wound with the adhesive tape T for support to a joining position in the axial direction. The supply spool is linked to the electromagnetic brake in an interlocking manner and is applied with an appropriate rotational resistance. Thus, the tape can be prevented from being excessively discharged from the supply reel.
The tape supply unit 71 is configured to swing a swing arm 77 connected to the cylinder 76, press the adhesive tape T downward by a top regulation roller 78, and apply tension to the adhesive tape T.
The separator recovery unit 72 includes a recovery reel for winding the separator S peeled off from the adhesive tape T. The recovery reel is driven and controlled by a motor to rotate forward and backward.
The tape application section 73 includes the chamber 11, a tape application mechanism 81, a tape cutting mechanism 82, and the like. The tape application mechanism 81 corresponds to the application mechanism of the present invention, and the tape cutting mechanism 82 corresponds to the cutting mechanism.
The chamber 11 is composed of a lower cover 11A and an upper cover 11B, the lower cover 11A reciprocates in the rectangular portion a and the tape joining portion 73, and the upper cover 11B is configured to be able to move up and down in the protruding portion B. Both covers 11A, 11B have an inner diameter smaller than the width of the adhesive tape T. The lower cover 11A has a rounded upper portion and is subjected to a mold release treatment such as fluorine treatment.
As shown in fig. 16, the upper cover 11B is provided on the elevation drive mechanism 84. The lift drive mechanism 84 includes: an elevating platform 87 that can move along a rail 86 disposed in the longitudinal direction on the back of the vertical wall 85; a movable frame 88 supported by the lift table 87 so as to be adjustable in height; and an arm 89 extending forward from the movable frame 88. The upper cover 11B is attached to a support shaft 90 extending downward from the tip end of the arm 89.
The elevating table 87 performs screw feed elevation by rotating the screw shaft 91 forward and backward by the motor 92.
As shown in fig. 17, the covers 11A and 11B are connected to and communicated with a vacuum device 95 via a flow path 94. Further, a solenoid valve 96 is provided in the passage 94 on the upper cover 11B side. The covers 11A and 11B are connected to and communicate with a flow path 99 having electromagnetic valves 97 and 98 for opening the atmosphere, respectively. The upper cover 11B is connected to and communicates with a flow path 101 having an electromagnetic valve 100 for adjusting the temporarily lowered internal pressure so as to leak air. The opening and closing operations of the solenoid valves 96, 97, 98, and 100 and the operation of the vacuum device 95 are performed by the control unit 102.
Returning to fig. 15, the tape application mechanism 81 includes: a guide rail 105 which is bridged over a pair of left and right support frames 104 provided upright on the apparatus base 103 with the 1 st holding base 5 interposed therebetween; a movable table 106 horizontally movable right and left along the guide rail 105; an adhesion roller 109 pivotally supported by a bracket connected to a tip end of a cylinder provided on the movable table 106; and a pinch roller 110 provided at a position closer to the belt collecting section 72.
The movable base 106 is configured such that the movable base 106 is horizontally moved to the left and right along the guide rail 105 by transmission of a driving force via a belt 113, the belt 113 is wound around a drive pulley 111 and an idle pulley 112, the drive pulley 111 is axially supported by a drive device fixedly provided on the device base 103 to rotate in the forward and reverse directions, and the idle pulley 112 is axially supported on the support frame 104 side.
The pinch rollers 110 include feed rollers 114 driven by a motor and pinch rollers 115 that are raised and lowered by a cylinder.
As shown in fig. 16, the belt cutting mechanism 82 is provided with a lifting drive mechanism 84 for lifting and lowering the upper cover 11B. That is, the tape cutting mechanism 12 includes a boss portion 117 that rotates about the support shaft 90 via a bearing 116. As shown in FIG. 18, 4 support arms 118 to 121 are provided on the hub 117 so as to extend in the radial direction from the center of the hub.
A tool holder 123 for horizontally supporting the circular plate-shaped tool 122 is attached to the tip of one support arm 118 so as to be movable up and down, and a pressing roller 124 is attached to the tips of the other support arms 119 to 121 so as to be movable up and down via a swing arm 125.
The boss 117 has a coupling portion 126 at an upper portion thereof, and the coupling portion 126 is coupled to a rotary shaft of a motor 127 provided in the arm 89 so as to be drivable by the motor 127.
As shown in fig. 15, the tape collecting unit 74 is provided with a collecting reel for winding up the unnecessary adhesive tape T that has been peeled off after the dicing. The recovery reel is driven and controlled by a motor, not shown, so as to be rotatable in the forward and reverse directions.
The marking unit C is configured to read an ID imprinted on the wafer W with a reader such as an optical sensor, to bar-code the ID in a two-dimensional or three-dimensional manner, for example, and to print and attach the bar code.
As shown in fig. 5, a cassette 130 for stacking and collecting the mounting frames MF is provided in the collecting section 3. The cartridge 130 includes: a longitudinal rail 132 coupled to the device frame 131; and an elevating table 134 that is screw-fed and elevated along the longitudinal rail 132 by a motor 133. Therefore, the recovery unit 3 is configured to mount the mounting frame MF on the lift table 134 and perform pitch feed lowering (japanese: ピッチ feeding り lowering).
Next, the operation of mounting the wafer W on the ring frame f via the adhesive tape T using the apparatus of the embodiment will be described.
The operation of conveying the ring frame f from the frame supply unit 6 to the frame holding unit 51 of the lower cover 11A and the operation of conveying the wafer W from the container 2 to the 1 st holding stage 5 are performed simultaneously.
One frame transfer device 16 sucks the ring frame f from the frame supply unit 6 and transfers the ring frame f to the frame holding unit 51. When the frame holding portion 51 lifts up after releasing the suction, the ring frame f is aligned by the support pins. That is, the ring frame f is set on the frame holding portion 51 and stands by until the wafer W is conveyed.
The other transport device 15 inserts the holding arm 38 between the wafers W accommodated in a plurality of stages, suctions and holds the wafers W from the circuit forming surface of the wafers W via the protective tape PT, outputs the wafers W, and transports the wafers W to the aligner 4.
The aligner 4 sucks the center of the wafer W with a chuck protruding from the center thereof. At the same time, the transfer device 15 releases the suction of the wafer W and retreats upward. The aligner 4 aligns the wafer W with a notch or the like while holding the wafer W by a chuck and rotating the wafer W.
After the alignment is completed, the chuck holding the wafer W is protruded from the surface of the aligner 4. The transfer device 15 is moved to this position to suction and hold the wafer W from the front surface side of the wafer W. The suction cup is lowered after the suction of the suction cup is released.
The transport device 15 moves onto the 1 st holding table 5, and transfers the wafer W with the protective tape facing downward to the supporting pins 50 protruding from the 1 st holding table 5. The pins 50 descend after receiving the wafer W.
When the 1 st holding stage 5 and the frame holding portion 51 attract the wafer W and the frame holding portion 51 attracts the ring frame f, the lower cover 11A moves along the rail 58 toward the tape joining mechanism 82.
When the lower cover 11A reaches the tape application position of the tape application mechanism 82 as shown in fig. 19, the application roller 109 is lowered, and the adhesive tape T is applied so as to straddle the top of the lower cover 11A and the ring frame f while the application roller 109 rolls on the adhesive tape T as shown in fig. 20. In conjunction with the movement of the joining roller 109, a predetermined amount of the adhesive tape T is released from the tape supplying section 71 while the separator S is peeled off.
When the adhesive tape T is completely attached to the ring frame f, the upper cover 11B is lowered as shown in fig. 21. As the wafer W moves downward, the exposed portion of the adhesive surface of the adhesive tape T is sandwiched between the outer periphery of the wafer W and the inner diameter of the ring frame f by the upper cover 11B and the lower cover 11A to form the chamber 11. At this time, the adhesive tape T functions as a sealing material and divides the upper cover 11B side and the lower cover 11A side to form two spaces.
The wafer W positioned in the lower cover 11A is close to and opposed to the adhesive tape T with a predetermined gap therebetween.
The controller 102 operates the heater 107 to heat the adhesive tape T from the lower cover 11A side, and operates the vacuum device 95 to reduce the pressure in the upper cover 11B and the lower cover 11A in a state where the electromagnetic valves 97, 98, and 100 shown in fig. 16 are closed. At this time, the opening degree of the electromagnetic valve 96 is adjusted so that the inside of the covers 11A and 11B is depressurized at the same speed.
When the pressure inside the covers 11A and 11B is reduced to a predetermined pressure, the controller 102 closes the electromagnetic valve 96 to stop the operation of the vacuum device 95.
The controller 102 adjusts the opening of the solenoid valve 100 to leak air and gradually increases the air pressure in the upper cover 11B to a predetermined air pressure. At this time, the air pressure in the lower cover 11A becomes lower than the air pressure in the upper cover 11B, and the adhesive tape T is sucked from the center thereof toward the lower cover 11A side as shown in fig. 22 by this pressure difference. That is, the adhesive tape T is attached radially from the center toward the outer periphery of the wafer W while being concavely curved. At this time, air is pushed out from the inner corner of the annular projection r, and the adhesive tape T is bonded with the gap eliminated.
When the air pressure in the upper cover 11B reaches a predetermined value, the controller 102 adjusts the opening degree of the solenoid valve 98 so that the air pressure in the lower cover 11A becomes equal to the air pressure in the upper cover 11B. Thereafter, as shown in fig. 23, the controller 102 raises the upper cover 11B to open the inside of the upper cover 11B to the atmosphere, and opens the solenoid valve 98 fully to open the lower cover 11A side to the atmosphere.
The tape cutting mechanism 82 operates while the adhesive tape T is attached to the wafer W in the chamber 11. At this time, as shown in fig. 21 and 22, the cutter 122 cuts the adhesive tape T attached to the ring frame f into the shape of the ring frame f along the outer shape of the ring frame f, and the pressing roller 124 presses the tape T while rolling along the tape cut portion on the ring frame f by the cutter 122. That is, when the upper cover 11B is lowered to form the chamber 11 with the lower cover 11A, as shown in fig. 15, the cutter 122 and the pressing roller 124 of the tape cutting mechanism 82 also reach the cutting action position.
Since the 1 st attaching of the adhesive tape T to the wafer W and the dicing of the adhesive tape T have been completed at the time of raising the upper cover 11B, the pinch roller 115 is raised to release the nipping of the adhesive tape T. Thereafter, the nip roller 115 is moved to convey the unnecessary adhesive tape T after cutting toward the tape collecting unit 74, and the unnecessary adhesive tape T is collected by the tape collecting unit 4 and discharged from the tape supplying unit 71 by a predetermined amount.
When the peeling of the adhesive tape T is completed and the grip roller 115 and the application roller 109 are returned to the initial positions, the lower cover 11A moves to the output position on the rectangular portion a side while holding the ring frame f and the mounting frame MF to which the adhesive tape T is adhered on the back surface, as shown in fig. 23.
The mounting frame MF having reached the output position is delivered from the frame transfer device 16 to the inverting unit 7. The reversing unit 7 reverses the mounting frame MF up and down while holding the mounting frame MF. I.e., with the circuit pattern facing upward. As shown in fig. 25, the reversing unit 7 places the mounting frame MF on the 2 nd holding base 8 in a vertically reversed state.
The 2 nd pasting process is performed on the wafer W, and in the 2 nd pasting process, the wafer W is reheated by the heater 108 embedded in the 2 nd holding stage 8. The processing time is set to be the same as the time for the 1 st paste process using the chamber 11. After the 2 nd pasting process is completed, the 2 nd holding table 8 is moved along the rail 58 to the printing position (label pasting position) of the marking unit C. When the 2 nd holding table 8 reaches the bonding position, the ID imprinted on the wafer W is read by an optical sensor, a camera, or the like. The marking unit C creates a label corresponding to the ID and attaches the label to the wafer W.
After the label application is completed, the 2 nd holding table 8 is moved to the output position on the rectangular portion a side. When the 2 nd holding base 8 reaches the output position, the pusher 9 holds the mounting frame MF and conveys the mounting frame MF to the recovery unit 3.
As described above, a series of operations for mounting the wafer W on the ring frame f via the adhesive tape T is completed. Thereafter, the above process is repeated until the number of mounting frames MF reaches a predetermined number.
A comparative experiment was conducted using the example apparatus between a comparative example in which the 1 st joining process was performed by the 1 st joining unit 10 without heating the adhesive tape, and an example in which the 1 st joining process with heating the adhesive tape was performed by the 1 st joining unit 10, and thereafter, the 2 nd joining process with reheating was performed by the 2 nd holding stage 8.
As the wafer W to be used, a wafer W of 200mm having the annular convex portion r formed on the back surface as described above is used. A protective tape PT is attached to the surface of the wafer W. WS-01 of Nitto electrician (K.K.) was used as the adhesive tape. The pasting conditions in this example are as follows: in the first bonding step 1, pressure difference and heating are used in the chamber 11, and in the second bonding step 2, only the wafer W is reheated by the second holding stage 8. In the first and second bonding steps, heating was performed at 80 ℃ for 1 minute with a pressure difference applied. The pasting conditions of the comparative examples are as follows: in the chamber 11, a pressure difference of 1 minute is applied without heating, and the adhesive tape T is attached to the wafer W.
Fig. 26 shows the result of peeling of the adhesive tape T after the adhesive tape T is attached under these conditions. That is, the peel generated immediately after the completion of the pasting process for 72 hours at room temperature was measured. The peeling was measured as the distance from the corner inside the convex portion toward the gap 200 shown in fig. 25 formed by peeling.
As a result of the measurement, the adhesive tapes did not adhere to each other immediately after the tape was attached, and the generated voids were 0.05mm in both the examples and the comparative examples. However, in the comparative example, the peeling of the adhesive tape T was expanded with the lapse of time, and finally, the gap reached 0.6mm after 72 hours.
In contrast, in the present example, the separation converged after 48 hours, and the gap became 0.3 mm. Thus, the improvement was also 50% over the comparative example.
As described above, according to the present embodiment, by performing the 2 nd adhesion process while reheating the adhesive tape T by the 2 nd holding table, the portion of the adhesive tape T which is not completely adhered in the vicinity of the inner corner of the annular convex portion r can be softened and adhered. Therefore, the adhesive tape T can be prevented from peeling from the corner portion and expanding after the joining process.
In addition, the sag of the pressure-sensitive adhesive tape T was measured after 3 experiments under the same conditions. Specifically, as shown in fig. 27, the ring frame f on which the mounting frame MF is mounted measures the distance of fall of the wafer W due to its own weight, and the measured distance is used as the sag of the adhesive tape. Specifically, the reference distance without slack is H1, and the slack is obtained by adding the distance between H1 and H2 further decreased from H1. Further, the measurement is performed at the center of the wafer W.
The results are shown in fig. 28. That is, in the comparative example, the average value of the sag was 3.7mm when the joining treatment was performed 1 time only by the pressure difference without heating. In contrast, in the present example, the average value of the sag when the two pasting processes using the pressure difference, heating and reheating were performed was 1.3 mm. That is, by performing the joining process twice as in this embodiment, the looseness of the adhesive tape T occurring at the 1 st joining is improved by the heating at the 2 nd joining. That is, the elastic deformation is returned to a state close to the original state by heating with respect to the looseness caused by the elastic deformation due to the sandwiching by the pair of upper and lower covers. Therefore, by improving the sag, the wafer can be accurately divided into chips in the dicing process in the subsequent step.
In addition, in the apparatus of the present embodiment, since the 1 st pasting process and the 2 nd pasting process are performed at different positions, the processes can be performed more efficiently than the processes performed at the same position.
The present invention can also be implemented in the following manner.
In the above-described example apparatus, the heater may be embedded in the upper cover 11B to heat the adhesive tape T from both the upper and lower sides.
Description of the reference numerals
1. A conveying mechanism; 5. 1 st holding stage; 6. a frame supply section; 7. a turning unit; 8. a 2 nd holding table; 9. pushing the piece; 10. a 1 st pasting unit; 11. a chamber; 11A, a lower cover; 11B, an upper cover; 81. a tape sticking mechanism; 82. a belt cutting mechanism; 102. a control unit; w, a semiconductor wafer; f. a ring frame; t, an adhesive tape; PT, guard band.

Claims (4)

1. A method of mounting a semiconductor wafer by mounting the semiconductor wafer on a ring frame via an adhesive tape for supporting,
the semiconductor wafer has an annular projection on the outer periphery of the back surface,
the method for mounting a semiconductor wafer comprises the following steps:
a chamber forming step of forming a chamber by holding the semiconductor wafer by a holding table provided in one of a pair of covers and sandwiching the adhesive tape between the two covers, in a state where the adhesive tape attached to the ring frame and the back surface of the semiconductor wafer are brought close to each other and opposed to each other;
a first bonding step of bonding the adhesive tape to the back surface of the semiconductor wafer by generating a pressure difference between two spaces partitioned by the adhesive tape in the cover and by heating the adhesive tape while bending the adhesive tape concavely; and
and a 2 nd joining step of joining the adhesive tape while removing the tensile stress accumulated in the adhesive tape by reheating the adhesive tape without pressing the adhesive tape after removing the pressure difference in the chamber and stopping heating in the 2 nd joining step.
2. The method of mounting a semiconductor wafer according to claim 1,
in the method for mounting a semiconductor wafer, a 2 nd bonding step is performed in which the adhesive tape is exposed to the atmosphere at room temperature while the semiconductor wafer is carried out of the chamber in the 1 st bonding step and conveyed to a different holding stage, and then the adhesive tape is bonded to the semiconductor wafer on the holding stage while heating the semiconductor wafer.
3. A semiconductor wafer mounting apparatus for mounting a semiconductor wafer on a ring frame via an adhesive tape for supporting,
the mounting apparatus for a semiconductor wafer includes:
a 1 st holding stage for holding the semiconductor wafer having an annular projection on a back surface outer periphery;
a frame holding section for holding a ring frame to which the adhesive tape is attached;
a chamber for accommodating the 1 st holding stage and including a pair of covers for sandwiching an adhesive tape adhered to a ring frame;
a 1 st heater for heating the adhesive tape in the chamber;
a 1 st bonding mechanism including a control unit for controlling to cause a pressure difference between two spaces partitioned by the adhesive tape in the chamber, and to bond the adhesive tape to the back surface of the semiconductor wafer while concavely bending the adhesive tape being heated,
a 2 nd holding stage for holding a mounting frame in which the semiconductor wafer is bonded to the adhesive tape by the 1 st bonding mechanism;
a 2 nd heater for reheating the adhesive tape on the 2 nd holding stage;
a conveying mechanism for conveying the mounting frame from the 1 st attaching mechanism to the 2 nd holding table; and
and a 2 nd joining mechanism that joins the adhesive tape while reheating the adhesive tape by the 2 nd heater without pressing the adhesive tape after eliminating the pressure difference in the chamber and stopping heating by the 1 st heater, thereby eliminating the tensile stress accumulated in the adhesive tape.
4. The mounting apparatus for a semiconductor wafer according to claim 3,
the 1 st attaching mechanism includes:
a tape supply unit for supplying an adhesive tape covering the size of the ring frame;
a tape attaching mechanism for attaching an adhesive tape to the ring frame and a joining portion of one of the pair of covers for joining the pair of covers;
a cutting mechanism for cutting the adhesive tape on the ring frame;
a peeling mechanism for peeling off the cut-out circular portion of the adhesive tape; and
and a tape recovery unit for recovering a portion of the adhesive tape that has been peeled off.
CN202010061259.2A 2014-12-25 2015-12-23 Method and apparatus for mounting semiconductor wafer Pending CN111261590A (en)

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CN108248233B (en) * 2018-02-01 2023-10-24 梵利特智能科技（苏州）有限公司 High-precision card stamping and printing device
JP2021027070A (en) 2019-07-31 2021-02-22 日東電工株式会社 Sheet material pasting method and sheet material pasting device
KR20210073270A (en) * 2019-12-10 2021-06-18 정라파엘 Tape mounting apparatus
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