JP5992803B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more particularly to a sheet sticking apparatus and a sticking method in which an adhesive sheet stuck to an adherend is not peeled off from the adherend due to the residual stress.

A semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) has various adhesive sheets such as a protective sheet on its front surface and a dicing sheet on its back surface in order to perform various treatments.
Such an adhesive sheet can be stuck using the sheet sticking apparatus disclosed by patent document 1, for example.

Japanese Patent Laid-Open No. 10-233430

  However, in the sheet sticking device described in Patent Document 1, for example, a wafer whose inner side is a thin plate portion is ground by grinding the inner side so as to form a reinforcing annular convex portion (thick plate portion) on the outer periphery. If the adhesive sheet is applied with tension applied to the top surface of the thick plate portion, the rising surface between the top surface and the thin plate portion, and one surface of the thin plate portion connected to the rising surface, the adhesive sheet However, there is a disadvantage that peeling occurs from the boundary between the upright surface and the one surface due to the residual stress of the adhesive sheet, and the adhesive sheet non-adhered portion expands.

[Object of invention]
The object of the present invention is to prevent the adhesive sheet affixed to the adherend with unevenness from peeling off from the boundary part of the unevenness due to the residual stress, and to prevent the adhesive sheet non-adhered part from expanding. It is providing the sticking apparatus and the sticking method.

In order to achieve the above object, the present invention provides an adherend having a thick plate portion and a thin plate portion formed on the top surface of the thick plate portion, an upright surface between the top surface and the thin plate portion, and the In the sheet sticking apparatus for sticking an adhesive sheet on the surface to be adhered, the sheet supporting means for disposing the adhesive sheet relative to the top surface, and the adhesive sheet. And a pressing means for applying an adhesive sheet to the adherend surface, the adhesive sheet portion extending over the top surface and the one surface, or the adhesive sheet portion extending over the upright surface and the one surface. A configuration is adopted in which a residual stress suppressing means for eliminating or relaxing the residual stress after sticking the adhesive sheet on the adherend surface is further provided.

  The adhesive sheet may include an energy ray curable component, and the residual stress suppressing unit may include an energy ray irradiating unit that cures the energy ray curable component. .

Furthermore, the present invention relates to an adherend on which a thick plate portion and a thin plate portion are formed, a top surface of the thick plate portion, a rising surface between the top surface and the thin plate portion, and a thin plate connected to the rising surface. In the sheet sticking method of sticking the adhesive sheet to the adherent surface, one surface of the part is an adherent surface, the step of relatively disposing the adhesive sheet facing the top surface, and applying a pressing force to the adhesive sheet, Adhering the adhesive sheet to the adherend surface, and the adhesive sheet portion over the top surface and one surface or the residual stress generated in the adhesive sheet portion over the upright surface and the one surface to the adherend surface And a step of disappearing or mitigating after sticking .

  According to the present invention, since the residual stress of the adhesive sheet can be eliminated or alleviated by providing the residual stress suppressing means, the adhesive sheet affixed to the adherend having unevenness is caused to have a boundary between unevenness by the residual stress. It can be prevented that peeling occurs from the part and the adhesive sheet non-sticking part expands.

The schematic side surface sectional drawing of a sheet sticking apparatus. Operation | movement explanatory drawing of a sheet sticking apparatus. Operation | movement explanatory drawing of a sheet sticking apparatus. The schematic side surface sectional view which shows the modification of a sheet sticking apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, for example, when directions such as up, down, left, right, front, back, etc. are shown, all of FIG. When viewed from the appropriate orientation), the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction orthogonal to the page. To do.

  The sheet sticking device 10 grinds the inner side so as to form a reinforcing annular convex portion (hereinafter referred to as “thick plate portion WFA”) on the outer periphery, and thereby a wafer as an adherend having the inner side as a thin plate portion WFB. With respect to WF, a top surface WF1 of the thick plate portion WFA, a rising surface WF2 between the top surface WF1 and the thin plate portion WFB, and a bottom surface WF3 as one surface of the thin plate portion WFB connected to the rising surface WF2 are attached surfaces WFS. The adhesive sheet AS is affixed to the adherend surface WFS, the supporting means 11 for supporting the wafer WF, the sheet supporting means 12 for relatively disposing the adhesive sheet AS so as to face the top surface WF1, and the adhesive sheet A pressing means 13 that applies pressing force to the AS and affixes the adhesive sheet AS to the adherend surface WFS, an adhesive sheet portion that extends over the top surface WF1 and the bottom surface WF3, or a contact that extends over the upstanding surface WF2 and the bottom surface WF3. Seat part (since their combined (see FIG. 3) of "the tensile bonding unit AS1") and a residual stress suppressing means 14 to eliminate or alleviate the residual stress generated in.

  The adhesive sheet AS is composed of a base sheet BS and an ultraviolet curable adhesive layer AD that is a component that is cured by ultraviolet rays as energy rays provided on the lower surface side of the base sheet BS. Yes.

  The support means 11 is supported by an output shaft 22 of a linear motor 21 as a drive device, and has a plurality of suction holes 24 communicating with a chamber 23 to which decompression means such as a suction pump and a vacuum ejector (not shown) are connected. 25.

  The sheet supporting means 12 includes a case 34 having a bottom 31 for supporting the linear motor 21 and a side wall 33 having a mounting surface 32 for mounting the lower surface of the ring frame RF with the adhesive sheet AS attached to the upper surface. It is comprised by. The side wall 33 is provided with a through hole 35 for discharging the gas in the case 34.

  The pressing means 13 is an additive capable of supplying a gas such as air or gas connected to a cover plate 43 supported by an output shaft 42 of a linear motor 41 as a drive device and a pipe 44 penetrating the cover plate 43. It is comprised with pressurization means 45, such as a pressure pump and a turbine. The bottom surface of the lid plate 43 has a bottom surface 46 and a side surface 47 inclined outward from the center of the lid plate 43 on a circle centered on the center of the lid plate 43, and a concave groove 48 inclined outward in cross section. Is formed.

  A plurality of the residual stress suppressing means 14 are arranged along the bottom surface 46 of the concave groove 48, and are constituted by light emitting diodes 51 as energy ray irradiating means capable of irradiating energy rays for curing the adhesive layer AD.

  Next, the sheet sticking method in this embodiment is demonstrated.

As shown in FIG. 1, when the transfer means (not shown) transfers the wafer WF onto the table 25 with the cover plate 43 being separated from the case 34, the support means 11 drives the decompression means (not shown). The inside of the chamber 23 is depressurized, and the wafer W is sucked and held through the suction hole 24.
Next, the conveyance means (not shown) places the adhesive sheet AS supported by the ring frame RF on the placement surface 32, so that the adhesive sheet AS is relatively disposed so as to face the top surface WF1.

  Thereafter, the pressing means 13 drives the linear motion motor 41 to lower the cover plate 43, and the ring frame RF is sandwiched between the cover plate 43 and the side wall 33 as shown in FIG.

  Next, when the pressing unit 13 drives the pressurizing unit 45 to supply and pressurize gas between the lid plate 43 and the adhesive sheet AS until a predetermined pressure is reached, the center of the adhesive sheet AS is expanded by the pressurization. It will be in the state. In this state, the support means 11 drives the linear motor 21 and raises the table 25. Thereby, the adhesive sheet AS gradually adheres from the center of the bottom surface WF3 toward the outside, and the support means 11 stops driving the linear motion motor 21 when the top surface WF1 contacts the adhesive layer AD. At this time, the tensile sticking part AS1 indicated by the two-dot chain line in FIG. 3 is elastically deformed by the pressure applied by the pressing means 13, and is attached to the wafer WF in the state indicated by the solid line in FIG. The affixing part AS1 is in a state containing residual stress due to the elastic restoring force of the adhesive sheet AS. In this state, when the space between the cover plate 43 and the adhesive sheet AS is returned to atmospheric pressure, the adhesive sheet AS is peeled off from the vicinity of the boundary between the standing surface WF2 and the bottom surface WF3 due to the residual stress of the tensile sticking portion AS1. Originated, the adhesive sheet non-stick part US would expand. Therefore, the residual stress suppressing means 14 causes the light emitting diode 51 to emit light, and irradiates the tensile sticking portion AS1 with ultraviolet rays. As a result, the adhesive layer AD is cured while the tensile sticking portion AS1 is in an elastically deformed state (the state indicated by the solid line in FIG. 3), and the elastic restoring force of the tensile sticking portion AS1 is reduced. The residual stress of the part AS1 is relaxed. Thereby, it can suppress that peeling originates from the boundary part vicinity of standing surface WF2 and bottom face WF3, and the adhesive sheet non-sticking part US expands. Next, the residual stress suppressing unit 14 stops the light emission of the light emitting diode 51, and the supporting unit 11 stops driving the decompression unit (not shown) to release the wafer W from being sucked and held. Then, after the pressing means 13 drives the linear motion motor 41 to raise the lid plate 43, the wafer WF integrated with the ring frame RF via the adhesive sheet AS is transferred to another process by a transfer means (not shown). Be transported. Thereafter, the support means 11 drives the linear motor 21 to lower the table 25 to the position indicated by the solid line in FIG. 1, and thereafter the same operation as described above is repeated. Note that the adhesive sheet AS may be made of an ultraviolet curable resin as well as the base sheet BS. In this case, the tensile sticking portion AS1 is also elastically deformed, and the base sheet BS is also cured. The elastic restoring force of the tensile sticking part AS1 is further reduced or lost, and the residual stress of the tensile sticking part AS1 is further relaxed or lost. Further, the adhesive sheet AS may be one in which only the base sheet BS is made of an ultraviolet curable resin.

  Therefore, according to such an embodiment, since the residual stress of the adhesive sheet AS can be eliminated and alleviated, the adhesive sheet attached to the uneven adherend is peeled off from the boundary portion of the unevenness by the residual stress. It originates and it can prevent that the adhesive sheet non-sticking part US expands.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary, and can adopt various configurations shown below.

For example, as shown in FIG. 4, the residual stress suppressing means 14 includes a rotation motor 62 as a drive device supported by an output shaft 61 of a linear motion motor 60 as a drive device arranged at the upper side of the case 34. And a light emitting diode 51 supported by an output shaft 65 of a linear motion motor 64 as a driving device supported by the output shaft 63 of the rotation motor 62. In this case, after the residual stress suppressing means 14 drives the linear motion motors 61 and 64 and the rotation motor 62 and moves the light-emitting diode 51 above the tension sticking part AS1 in accordance with the diameter of the tension sticking part AS1 to be irradiated. A configuration in which the entire region of the tensile sticking portion AS1 is irradiated with ultraviolet rays by rotating around the central axis of the output shaft 63 of the rotation motor 62 can be exemplified.
According to such a modification, the number of the light emitting diodes 51 in the embodiment can be reduced, and the cover plate 43 can be simplified by removing the concave groove 48 and the light emitting diode 51.
In addition, depending on how the pressing force of the pressing means 13 is applied, the region of the tensile sticking portion AS1 becomes larger or smaller, or the entire inner peripheral region of the top surface WF1. Depending on the size of the area of the part AS1, the area where the residual stress suppressing means 14 irradiates ultraviolet rays can be changed as appropriate.
Furthermore, you may make it irradiate an ultraviolet-ray to tensile sticking part AS1 shown with a dashed-two dotted line in FIG.
The energy beam irradiation means may be a high pressure mercury lamp, a low pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, a fluorescent lamp, or the like.
Furthermore, the energy beam irradiation means can take into account the components of the adhesive sheet such as the base sheet BS and the adhesive layer AD, and the adhesive sheet components can be cured by energy rays such as infrared rays and microwaves. Further, it can be configured to irradiate energy rays such as infrared rays and microwaves.
Further, the residual stress suppressing means 14 may be constituted by a cutting means such as a cutting blade that forms a cut in the base sheet BS or the base sheet BS and the adhesive layer AD in the tensile sticking portion AS1, and forms a cut. By doing so, you may make it maintain the state which tension | tensile_strength sticking part AS1 extended | stretched.
Further, the residual stress suppressing means 14 may be constituted by a heating means for heating the tensile sticking part AS1 or a cooling means for cooling, or the tensile sticking part AS1 may be plastically deformed by heating or cooling.
Further, the bottom surface 46 and the side surface 47 need not be inclined outward from the center of the lid plate 43.
Further, the residual stress suppressing means 14 may be provided on a plurality of concentric circles centered on the center of the lid plate 43 in accordance with the diameter of the tensile sticking portion AS1.
Further, the support means 11 may be provided with a frictional engagement member having a viscosity made of rubber, silicone resin, or the like that supports the wafer WF so as not to move due to friction on the outer peripheral side of the table 25. The friction engagement member may be provided in a single circle or a plurality of concentric circles around the center of the table 25 in accordance with the outer shape of the wafer WF.
Further, the support unit 11 may be configured to change the region for sucking the wafer WF in accordance with the outer diameter of the wafer WF.
Alternatively, the adhesive sheet AS may be placed on the placement surface 32 without being supported by the ring frame RF.

Further, the pressing means 13 may be configured to form the lid plate 43 with an appropriate elastic member and apply a pressing force to the adhesive sheet AS by deforming the lower surface of the lid plate 43.
Further, a pressure reducing means such as a suction pump or a vacuum ejector may be connected to the through hole 35, and the inside of the case 34 may be pressure reduced to adhere the adhesive sheet AS to the wafer WF.

Further, the material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS is not limited to adhesive forms such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. When the heat-sensitive adhesive sheet AS is employed, appropriate heating for heating the adhesive sheet is performed. Means may be provided. Moreover, such an adhesive sheet has, for example, a single layer having only an adhesive layer, an intermediate layer between the base material sheet and the adhesive layer, a cover layer on the upper surface of the base material sheet, etc. 3 It may be a layer or more, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer. Or a single layer or multiple layers without an intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes, and the like can be attached to any adherend as described above.
Note that the standing surface WF2 is not limited to a vertical surface, but includes an inclined surface, a curved surface, or a combination of these.

  In addition, the drive device adopts an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, a combination of them directly or indirectly can be adopted (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Sheet support means 13 Press means 14 Residual stress suppression means AS adhesive sheet AS1 Tensile sticking part WF Semiconductor wafer (adhered body)
WFS adherend surface WFA Thick plate part WFB Thin plate part WF1 Top face WF2 Standing face WF3 Bottom face (one face of thin plate part)

Claims (3)

To the adherend on which the thick plate portion and the thin plate portion are formed, the top surface of the thick plate portion, the rising surface between the top surface and the thin plate portion, and one surface of the thin plate portion connected to the rising surface are attached. In the sheet sticking device for sticking the adhesive sheet on the adherend surface,
Sheet support means for disposing an adhesive sheet relative to the top surface;
A pressing means for applying a pressing force to the adhesive sheet, and affixing the adhesive sheet on the adherend surface;
Residual stress suppressing means for eliminating or relieving residual stress generated in the adhesive sheet portion extending over the top surface and the one surface or the adhesive sheet portion extending between the standing surface and the one surface after the adhesive sheet is applied to the adherend surface. Furthermore, the sheet sticking apparatus characterized by the above-mentioned.   The said adhesive sheet contains an energy-beam curable structure, The said residual stress suppression means is equipped with the energy-beam irradiation means to harden the said energy-beam curable structure. Sheet sticking device. To the adherend on which the thick plate portion and the thin plate portion are formed, the top surface of the thick plate portion, the rising surface between the top surface and the thin plate portion, and one surface of the thin plate portion connected to the rising surface are attached. In the sheet sticking method of sticking an adhesive sheet on the adherend surface,
Placing the adhesive sheet relative to the top surface;
Applying a pressing force to the adhesive sheet, and attaching the adhesive sheet to the adherend surface;
A step of eliminating or alleviating the residual stress generated in the adhesive sheet portion extending over the top surface and the one surface or the adhesive sheet portion extending between the standing surface and the one surface after the adhesive sheet is applied to the adherend surface. The sheet sticking method characterized by this.

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