JP2020021915A - Pickup device and pickup method - Google Patents

Abstract

To provide a pickup device capable of preventing a reduction in design flexibility.SOLUTION: A pickup device includes adhesive force reducing means 10 for reducing the adhesive force of an adhesive sheet AS, adherend holding means 20 for holding an adherend CP adhered to the adhesive sheet AS, and removing means 30 for relatively moving the adherend holding means 20 holding the adherend CP and the adhesive sheet AS, and removing the adherend CP from the adhesive sheet AS, and to the adhesive sheet AS, expandable particles SG that expand when predetermined energy is applied and reduce the adhesive force of the adhesive sheet AS are added, and the adhesive force reducing means 10 includes first energy applying means 11 for applying energy from the other surface CP2 side of the adherend CP to an adherend attaching region SA of the adhesive sheet AS to which the adherend CP is adhered.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a pickup device and a pickup method.

  2. Description of the Related Art Conventionally, there has been known a pickup device that reduces the adhesive force of an adhesive sheet to which an adherend is attached and removes the adherend from the adhesive sheet (for example, see Patent Document 1).

JP 2013-65757 A

  However, the conventional pickup device 10 (pickup device) described in Patent Literature 1 has an ultraviolet ray in which the adhesive strength of the adhesive sheet is reduced from the side opposite to the adhesive surface of the adhesive sheet 2 (adhesive sheet). Since the configuration is such that UV (predetermined energy) is applied, components to be disposed on the side opposite to the adhesive surface of the adhesive sheet are restricted, which causes a disadvantage that the degree of freedom in design is reduced.

  An object of the present invention is to provide a pickup device that can prevent a degree of freedom in design from being reduced.

  The present invention has adopted the configuration described in the claims.

According to the present invention, energy for reducing the adhesive force of the adhesive sheet is applied from the other surface side of the adherend having one surface side adhered to the adhesive sheet, and the adherend to which the adherend is adhered is applied. Since the adhesive strength of the body attachment region is reduced, the components arranged on the side opposite to the adhesive surface of the adhesive sheet are not restricted, and it is possible to prevent the degree of freedom in design from being reduced.
Further, if the removing means is configured to remove the adherend to which the adhesive layer for transfer is attached from the adhesive sheet, the adherend removed by the removing means can be immediately bonded to another object.
Furthermore, if the first energy applying means is incorporated in the adherend holding means, the apparatus can be simplified.
Further, if the second energy applying means is provided, the adhesive force of the adhesive sheet can be reduced more efficiently.
Further, if the second energy applying means is incorporated in the push-up means for pushing up the adherend, the apparatus can be simplified.

FIG. 1 is an explanatory diagram of a pickup device according to an embodiment of the present invention. (A), (B) is explanatory drawing of the pickup apparatus which concerns on the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other. The X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I do. Further, in the present embodiment, when the direction is shown without specifying the figure, “up” is “down” in the Z-axis arrow direction, based on the case where the direction is viewed from the near side in FIG. 1 parallel to the Y axis. 1 is the opposite direction, "left" is the direction of the arrow on the X axis, "right" is the opposite direction, "front" is the front direction in FIG. 1 parallel to the Y axis, and "rear" is the opposite direction.

  The pickup device EA according to the present invention includes a semiconductor chip (hereinafter, simply referred to as a “chip”) CP as one of the adherends, which is formed from an integrated object WK having one surface CP1 attached to the adhesive surface AS1 side of the adhesive sheet AS. An apparatus for removing a CP, the adhesive force reducing means 10 for reducing the adhesive force of the adhesive sheet AS, the adherend holding means 20 for holding the chip CP attached to the adhesive sheet AS, and the chip CP. It comprises a detaching means 30 for relatively moving the adherend holding means 20 and the adhesive sheet AS and removing the chip CP from the adhesive sheet AS, and an integral support means 40 for supporting the integral WK, and the chip CP is attached. It is arranged in the vicinity of a supporter 50 for supporting a supporter SB such as a lead frame or a substrate.

In addition, as shown in the figure attached with the symbol AA in FIG. 1, the adhesive sheet AS expands when heat as predetermined energy is applied, and expands to reduce the adhesive force of the adhesive sheet AS. SG is added.
Further, the adhesive sheet AS of the present embodiment includes a base sheet BS, an adhesive layer AL, and a transfer adhesive layer AD capable of bonding the chip CP to a support SB as another. The chip CP is attached via the wearing adhesive layer AD and heat is applied, so that the adhesive strength with the transfer adhesive layer AD is reduced.
Furthermore, the adhesive sheet AS of the present embodiment employs a material in which the expandable particles SG are added only to the adhesive layer AL, and a ring frame RF as a frame member is attached to an outer edge thereof to form an integral body WK. are doing.

  The adhesive force reducing means 10 includes a coil heater that applies heat from the other surface CP2 side of the chip CP to the adherend adhered area SA of the adhesive sheet AS to which the chip CP is adhered, such as a coil heater or a heating side of a heat pipe. A first energy applying means 11 is provided.

  The adherend holding means 20 includes a holding member 21 having a holding surface 21A that can be suction-held by a not-shown depressurizing means (holding means) such as a decompression pump or a vacuum ejector. In the case of the present embodiment, the first energy applying means 11 is built in the holding member 21.

  The removing means 30 includes a linear motor 31 as a driving device having a slider 31A movable in the left-right direction, and a linear motor 32 as a driving device having a slider 32A supported by the slider 31A and movable in the front-rear direction. , A linear motor 33 as a driving device having an output shaft 33A supported by a slider 32A and movable in the vertical direction and rotatable about an extending direction (vertical direction), and linearly driven via a bracket 34A. An image pickup unit such as a camera and a projector supported by the rotation motor 33, and a position detection device 34 such as various sensors such as an optical sensor and an ultrasonic sensor are provided. I support.

  The integrated object support means 40 includes a support table 41 having a holding surface 41A that can be sucked and held by a not-shown depressurizing means (holding means) such as a decompression pump or a vacuum ejector.

  The support member support means 50 includes a support table 51 having a holding surface 51A that can be suction-held by a pressure reducing means (holding means) (not shown) such as a pressure reducing pump or a vacuum ejector.

The operation of the pickup device EA will be described.
First, the user of the pickup device EA (hereinafter, simply referred to as “user”) attaches to the adhesive surface AS1 of the adhesive sheet AS with respect to the pickup device EA in which each member is waiting at the initial position indicated by a solid line in FIG. When the one-piece WK is placed on the one-piece support means 40 such that the anti-adhesion surface AS2 on the opposite side to the holding face 41A side and the support SB is placed on the one-piece support means 50, the pickup The device EA performs the following pickup operation. That is, the unitary body support means 40 and the support body support means 50 respectively drive the pressure reducing means (not shown), and the holding surfaces 41A and 51A start suction holding of the integrated body WK and the support body SB. Next, the removing means 30 drives the linear motors 31 and 32, the direct-acting rotation motor 33, and the position detection device 34, and holds the chip CP at a predetermined position and a predetermined direction based on the detection result of the position detection device 34. The holding member 21 is moved so as to be held by the member 21, and the holding surface 21A is brought into contact with the other surface CP2 of the chip CP as shown by a two-dot chain line in FIG. At this time, the detaching means 30 controls the pressing force applied to the chip CP via the holding member 21 to a predetermined pressing force based on the detection result of a pressing force detecting device (not shown) such as a load cell or a pressure sensor. , The linear motors 31 and 32 and the linearly rotating motor 33 are driven.

  After that, when the adhesive force reducing unit 10 drives the first energy applying unit 11 to apply heat to the adherend attaching region SA from the other surface CP2 side of the chip CP, the diagram with the reference numeral BB in FIG. As shown, the expandable particles SG added to the adhesive layer AL located in the adherend attaching region SA expand, and countless convex portions CV are formed in the adherend attaching region SA. When the innumerable convex portions CV are formed in the adherend attaching region SA, the adhesion area of the adherend attaching region SA to the transfer adhesive layer AD decreases, and the adhesive sheet AS adheres to the transfer adhesive layer AD. Adhesive strength decreases. Next, the removing means 30 removes the chip CP to which the adhesive layer for transfer AD is adhered (hereinafter, referred to as “chip CP with adhesive”) from the adhesive sheet AS. That is, after the adherend holding means 20 drives the pressure reducing means (not shown) to start suction holding of the chip CP on the holding surface 21A, the removing means 30 drives the linear motion rotary motor 33 to suction hold the chip CP. The separated holding member 21 is separated from the adhesive sheet AS. At this time, since the adhesive force of the adherend adhered area SA to the transfer adhesive layer AD is reduced, the removing means 30 can easily remove the chip CP with adhesive from the adhesive sheet AS.

  Then, the removing means 30 drives the linear motors 31 and 32, the direct-acting rotation motor 33, and the position detecting device 34, and the adhesive-attached chip CP held by the holding member 21 is The holding member 21 is moved so as to adhere to the support SB at a predetermined position and in a predetermined direction, and the transfer adhesive layer AD is brought into contact with the upper surface of the support SB as shown by a two-dot chain line in FIG. . At this time, the detaching means 30 controls the linear motor so that the pressing force applied to the adhesive-attached chip CP via the holding member 21 becomes a predetermined pressing force based on the detection result of the pressing force detecting device (not shown). 31 and 32 and the linear motion rotary motor 33 are driven. When the chip CP is stuck on the upper surface of the support SB via the transfer adhesive layer AD, the adherend holding means 20 stops driving the pressure reducing means (not shown), and holds the chip CP by suction on the holding surface 21A. Cancel. Next, when the removing means 30 drives the linear motors 31 and 32 and the linearly rotating motor 33 to return the holding member 21 to the initial position, the supporter supporting means 50 stops driving the pressure reducing means (not shown), and The suction operation of the support SB at 51A is released, and the pickup operation is completed.

  After that, the user or a transport unit (not shown) transports the support SB on which the chip CP is mounted to another step, and then places a new support SB on the support support unit 50. Is performed, and the pick-up operation by the pickup device EA and the replacement operation of the support are repeated. Next, after the pickup operation is completed after all the chips CP or a predetermined number of chips CP are removed from the adhesive sheet AS, the integrated object supporting means 40 stops driving the pressure reducing means (not shown), and the holding surface 41A stops. Of the integrated object WK is released. Then, the user or the transporting means (not shown) transports the support SB to which the chip CP is attached to another process, and removes the one from which the chip CP has been removed from the integrated object WK from the holding surface 41A. A similar operation is repeated.

  According to the embodiment as described above, one surface CP1 is applied with heat from the other surface CP2 side of the chip CP stuck to the adhesive sheet AS to reduce the adhesive force of the adhesive sheet AS, and the chip CP Reduces the adhesive strength of the adherend adhered area SA to which the adhesive sheet AS is attached, so that the components arranged on the anti-adhesion surface AS2 side of the adhesive sheet AS are not restricted, and the degree of freedom in design is reduced. Can be prevented.

  The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for the means and steps, much less the constituents of only one embodiment shown in the above embodiment and There is no limitation to the process at all. For example, the adherend holding means is capable of holding the adherend on which the adhesive sheet is attached, in light of the common general technical knowledge at the time of filing, and is not limited as long as it is within the technical scope. No (same for other means and steps).

In the pickup device EA of the present invention, as shown in FIG. 2 (A), the adhesive force reducing means 10 applies a coil heater that applies heat to the adherend attaching area SA from the side of the adhesive sheet AS opposite to the adhesive surface AS2. A second energy applying means 12 such as a heating side of a heat pipe may be provided.
Such a second energy applying unit 12 is, for example, built in the support table 41 and applies heat to the adherend attaching region SA before the holding member 21 holds the chip CP. According to the principle described above, the adhesive strength of the entire adhesive sheet AS or a part of the adhesive sheet AS to the transfer adhesive layer AD can be reduced.

Further, as shown in FIG. 2B, the pickup device EA of the present invention employs a push-up means 60 for pushing up the chip CP from the side opposite to the adhesive surface AS2, and the second energy imparting means 12 is provided with the push-up means 60. It may be built in.
As shown in FIG. 2 (B-1), such a push-up means 60 is supported by the linear motor 61 as a driving device having a slider 61A movable in the left-right direction and the slider 61A, and is supported in the front-rear direction. A linear motor 62 as a driving device having a movable slider 62A, a linear motor 63 as a driving device supported by the slider 62A and having an output shaft 63A movable vertically, and a bracket 64A Imaging means such as a camera and a projector supported by the linear motor 63, position detecting devices 64 such as various sensors such as an optical sensor and an ultrasonic sensor, and push-up supported by an output shaft 63A of the linear motor 63. A second energy applying means 12 is built in the push-up member 65.
In this case, before the chip CP is held by the holding member 21, the push-up means 60 drives the linear motors 61 and 62, the linear motion motor 63, and the position detection device 64, and as shown in FIG. The tip CP is pushed up by the push-up member 65 based on the detection result of the position detection device 64. Next, the adhesive force reducing means 10 drives the second energy applying means 12 to apply heat to the adherend attaching area SA, and the adhesive sheet AS is applied to the transfer adhesive layer AD with the same principle as in the above embodiment. Decreases adhesive strength. After that, the same operation as in the above-described embodiment is performed. After the holding surface 21A is brought into contact with the other surface CP2 of the chip CP, as shown by the two-dot chain line in FIG. Heat is applied to the adherend attaching area SA by the energy applying means 11 to remove the chip CP from the adhesive sheet AS.
As described above, in the pickup device EA of the present invention, the components arranged on the side opposite to the adhesive surface AS2 of the adhesive sheet AS are not restricted, so that the components shown in FIGS. In addition, other components can be freely disposed on the side opposite to the adhesive surface AS2 of the adhesive sheet AS as needed, and a reduction in design flexibility can be prevented.

  The adhesive force reducing means 10 may be provided with the first energy applying means 11 outside the holding member 21 or may be provided with the second energy applying means 12 outside the push-up member 65, For example, the first energy applying unit 11 and the second energy applying unit 12 may be supported by the holding member 21 and the push-up member 65 via a bracket, or the first energy applying unit 11 may be driven by a driving device. It may be configured to be replaced with the holding member 21, and the first energy applying means 11 may be arranged on the other surface CP2 side of the chip CP, or the first energy applying means 11 and the second energy applying means 11 may be arranged. The applying means 12 and the applying means 12 may be constituted by the same kind or different means, and the first and second energy applying means 11 and 12 may be constituted by one chip. For example, an object that applies heat to each adherend attaching area SA corresponding to the substrate CP may be employed, or an object that applies heat to the adherend attaching area SA corresponding to a plurality of chips CP may be employed. The first energy applying means for partially applying heat to the attachment area SA and the integrated object WK may be relatively moved to apply heat to the entire adherend attachment area SA, or may be expanded. The time for applying heat to the adherend attachment area SA can be arbitrarily determined in consideration of the characteristics, characteristics, properties, materials, compositions, configurations, and the like of the particles SG, and the first and second energy application can be performed. As means 11 and 12, an infrared heater, a hot water heater, an LED (Light Emitting Diode, light emitting diode) lamp, a high pressure mercury lamp, a low pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, and the like are employed. The adhesive force may be reduced, or the first and second energy applying means 11 and 12 appropriately combining known energy output means capable of outputting various energies and those exemplified above are employed. Alternatively, the energy may be gradually applied from one end to the other end of the adherend attachment region SA, or the energy may be gradually applied from the center to the outer edge of the adherend attachment region SA. Alternatively, the energy may be gradually applied from the outer edge to the center of the adherend attaching area SA.

  The adherend holding means 20 may have a configuration capable of holding only one chip CP, a configuration capable of holding a plurality of chips CP, or may be configured to detach one or a plurality of chips CP from the adhesive sheet AS by the removing means 30. Alternatively, one or a plurality of chips CP removed from the adhesive sheet AS may be attached to the support SB by removing means 30.

  The detaching means 30 adheres the chip CP by moving one of the adherend holding means 20 holding the chip CP and the adhesive sheet AS while regulating the other, or by moving both of them. It may be removed from the sheet AS, or by moving one of the adherend holding means 20 holding the chip CP and the support SB while regulating the other, or by moving both of them. The chip CP may be stuck to the support SB, the position detecting device 34 may not be provided, and the chip CP removed from the adhesive sheet AS may not be stuck to another.

  The one-piece support means 40 may not include the holding means for holding the one-piece WK, may be provided in the pickup device EA of the present invention, or may not be provided in the pickup device EA. When the object support means 40 is not provided in the pickup device EA, the pickup device EA does not need to perform a step of sucking and holding the integrated object WK on the holding surface 41A in the pickup operation exemplified in the above embodiment. Good.

  The supporter support means 50 may not have the holding means for holding the supporter SB, may be provided in the pickup device EA of the present invention, or may not be provided in the pickup device EA of the present invention. If the supporter supporting means 50 is not provided in the pickup device EA, the pickup device EA may perform a step of adsorbing and holding the supporter SB on the holding surface 51A in the pickup operation illustrated in the above-described embodiment. It is not necessary to perform a step of attaching the chip with adhesive CP held by the member 21 to the upper surface of the support SB.

  The push-up means 60 may push up the chip CP with a push-up member 65 that does not incorporate the second energy applying means 12, may not have the position detecting device 64, and may be a pickup device of the present invention. The EA need not be provided.

The adhesive sheet AS is provided with a predetermined amount of heat such as hot water or hot air, a cooling medium such as a cooled gas or liquid, electromagnetic waves of any wavelength such as ultraviolet rays, visible rays, sound waves, X-rays or gamma rays, vibrations, chemicals, and chemical substances. The first energy, the second energy, and the first energy, the second energy may be used. The giving means 11 and 12 give heat, a cooling medium, electromagnetic waves of all wavelengths, vibrations, chemicals, chemical substances and the like in consideration of the characteristics, characteristics, properties, materials, compositions and configurations of the expandable particles SG. Any configuration may be used as long as the expandable particles SG can be expanded to reduce the adhesive strength of the adhesive sheet AS.
The adhesive sheet AS may be one in which the expandable particles SG are added only to the base sheet BS constituting the adhesive sheet AS, or may be expanded to both the adhesive layer AL and the base sheet BS. The particles to which the conductive particles SG are added may be employed, or one or more intermediate layers may be present between the adhesive layer AL and the base sheet BS, and the intermediate layer, the adhesive layer AL and the base layer may be used. A sheet in which the expandable particles SG are added to at least one or at least two of the material sheets BS may be employed, may be attached to a surface of the chip CP on which a circuit is formed, or may be a circuit. May be affixed to the surface on which is not formed, or when the expandable particles SG are added to both the adhesive layer AL and the base sheet BS, or when the intermediate layer, the adhesive layer AL and the base material are added. Less of seat BS If it is added also is expandable particles SG into two, they expandable particles SG may be identical ones or may be ones not identical.
In the chip CP, a predetermined circuit may be formed on at least one of one surface and the other surface, or a circuit may not be formed on both of them.
The adhesive sheet AS does not have the transfer adhesive layer AD, and the chip CP may be directly attached to the adhesive layer AL. In this case, when the adhesive force reducing unit 10 drives the first energy applying unit 11 to apply heat to the adherend attaching region SA from the other surface CP2 side of the chip CP, the adhesive sheet AS The adhesive strength is reduced. Then, the removing means 30 drives each driving device, and removes only the chip CP from the adhesive sheet AS. When the chip CP detached from the adhesive sheet AS is adhered to another one, for example, an adhesive means such as an adhesive or an adhesive tape may be laminated on the chip CP being conveyed by the detaching means 30.
The adherend, for example, is formed on a base material such as a semiconductor wafer or a glass plate, and is formed with an easily-cleavable portion such as a modified portion or a groove that is cut by applying an external force, and is divided by the easily-cleavable portion. It may be an area. In this case, the area divided by the easily cleavable portion may be held by the adherend holding means 20, and the adherend may be detached by using the force for detaching the adhesive sheet AS by the detaching means 30 as an external force. In addition, such an easily cleavable part is provided with laser beams, electromagnetic waves, vibrations, heat, chemicals, chemical substances, and the like, and by changing the properties, characteristics, properties, materials, compositions, configurations, dimensions, and the like of the base material. The base material may be formed by weakening, pulverizing, liquefying, or hollowing, and the easy-to-cleave portion may be, for example, one parallel to the X axis or one parallel to the Y axis. , One or more that are not parallel to the X-axis or the Y-axis, multiples that are unequally spaced from each other, multiples that are not parallel or parallel to each other, multiples that do not intersect with each other, It may be a plurality of orthogonal or oblique, or one or more of a curved line or a broken line, and the shape of the adherend formed by such an easily cleavable part may be a circle, an ellipse, a triangle or a quadrangle or more. Any shape such as a polygon may be used.
The integrated object WK may have one chip CP, two or more chips CP attached to the adhesive sheet AS, or may have a structure in which the chip CP is different from and integrated with the frame member via the adhesive sheet AS. However, an annular or non-annular frame member may be attached, or the frame member may not be attached.

  Examples of the expandable particles SG include, for example, fine particles in which a substance that easily gasifies and expands by heating, such as isobutane, propane, and pentane, is contained in an elastic shell. Japanese Patent Application No. 2017-73236, -159743, JP-A-2012-167151, JP-A-2001-123002 and the like, and heat-expandable fine particles disclosed in JP-A-2013-47321, JP-A-2007-254580, JP-A-2011-212528, JP-A-2003-261842 and the like. It is not limited at all, such as the expandable particles disclosed in, for example, by pyrolysis, water, carbon dioxide, adopting a foaming agent that produces a similar effect to the expandable particles by generating nitrogen Or azotization which generates gas by ultraviolet rays disclosed in JP-A-2006-53115 and JP-A-7-278333. May be one that expands the shell in a gas generator such as an object, for example, it may be a rubber or resin that expands by heating, other, baking soda, sodium bicarbonate, or a baking powder or the like.

  The material, type, shape, and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS and the adherend may have a circular shape, an elliptical shape, a polygonal shape such as a triangle or a quadrangle, or other shapes, and the adhesive sheet AS may have an adhesive property such as pressure-sensitive adhesive property or heat-sensitive adhesive property. It may be of the form. Further, such an adhesive sheet AS is, for example, a single layer having only the adhesive layer AL, a sheet having an intermediate layer between the base sheet BS and the adhesive layer AL, and a cover on the upper surface of the base sheet BS. Three or more layers, such as having a layer, further may be a so-called double-sided adhesive sheet capable of peeling the base sheet BS from the adhesive layer AL, the double-sided adhesive sheet may be a single layer or It may have a multi-layered intermediate layer, or may have a single-layered or multi-layered structure without an intermediate layer. Examples of the adherend include food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood plates, and resin alone. It may be an object, a composite formed of two or more of them, and a member or an article of any form can be targeted. In addition, the adhesive sheet AS may be replaced with a functional or application-specific reading method. For example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Sheet, film, tape or the like.

Driving devices in the embodiment include electric devices such as a rotary motor, a linear motion motor, a linear motor, a single-axis robot, a multi-joint robot having two or three or more joints, an air cylinder, a hydraulic cylinder, and a rodless. Actuators, such as cylinders and rotary cylinders, can be employed, and those obtained by directly or indirectly combining them can be employed.
In the above-described embodiment, when a member that supports or holds a supported member such as a supporting (holding) unit or a supporting (holding) member is employed, a holding unit such as a mechanical chuck or a chuck cylinder, a Coulomb force, an adhesive ( A configuration in which the supported member is supported (held) by an adhesive (adhesive sheet, adhesive tape), an adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli suction, suction suction, a driving device, or the like may be employed.

EA: Pick-up device 10: Adhesive force reducing means 11: First energy applying means 12: Second energy applying means 20: Adherend holding means 30: Removing means 60: Raising means AD: Adhesive layer AS ... Adhesive sheet AS1 ... Adhesive surface AS2 ... Anti-adhesive surface CP ... Semiconductor chip (adherend)
CP1: One surface CP2: The other surface SA: Adherend adhered area SB: Support (other)
SG: expandable particles WK: monolithic

Claims (6)

In a pickup device for removing the adherend from an integrated body in which one surface of the adherend is attached to the adhesive surface side of the adhesive sheet,
Adhesive force reducing means for reducing the adhesive force of the adhesive sheet,
Adherend holding means for holding the adherend adhered to the adhesive sheet,
A relative movement of the adherend holding means holding the adherend and the adhesive sheet, and removing means for removing the adherend from the adhesive sheet,
The adhesive sheet expands when given energy is applied thereto, and expandable particles that reduce the adhesive force of the adhesive sheet are added,
The adhesive force reducing unit includes a first energy applying unit that applies the energy from the other surface side of the adherend to an adherend adhered region of the adhesive sheet to which the adherend is adhered. A pickup device. The adhesive sheet has a transfer adhesive layer capable of adhering the adherend to another, the adherend is attached via the transfer adhesive layer, and the energy is applied. In, the adhesive force with the transfer adhesive layer is reduced,
2. The pickup device according to claim 1, wherein the removing unit removes the adherend to which the adhesive layer for transfer is attached from the adhesive sheet. 3.   The pickup device according to claim 1, wherein the first energy applying unit is built in the adherend holding unit.   The adhesive force reducing unit includes a second energy applying unit that applies the energy from the side opposite to the adhesive surface of the adhesive sheet to the adherend attaching region from the side opposite to the adhesive surface. The pickup device according to claim 1.   5. The pickup device according to claim 4, further comprising a push-up unit that pushes up the adherend from the non-adhesive surface side, and wherein the second energy applying unit is built in the push-up unit. In a pickup method in which one surface of the adherend is removed from the integrated body attached to the adhesive surface side of the adhesive sheet,
An adhesive force reducing step of reducing the adhesive force of the adhesive sheet,
An adherend holding step of holding the adherend adhered to the adhesive sheet by an adherend holding means,
A removing step of relatively moving the adherend holding means holding the adherend and the adhesive sheet, and removing the adherend from the adhesive sheet;
The adhesive sheet expands when given energy is applied thereto, and expandable particles that reduce the adhesive force of the adhesive sheet are added,
In the adhesive force reducing step, a first energy applying step of applying the energy from the other surface side of the adherend to an adherend adhered region of the adhesive sheet to which the adherend is adhered is performed. A pickup method.