JPS6313903B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is a method of combining a circular thin plate, such as a silicon wafer, which is a base for forming an integrated circuit, and a ring, such as a circular ring, which is a carrier jig for the thin plate, into a single adhesive film. This relates to a method of pasting it on the surface.

Previously, the attachment of the film to the ring-shaped carrier jig as described above and the attachment of silicon wafers to the film were done by hand, and the film protruding from around the ring was also cut by hand. There were problems such as it was extremely time-consuming and difficult to apply the cloth without wrinkles, and required skill.

An object of the present invention is to provide a method for efficiently and continuously performing the operations of attaching a film to a ring as described above, attaching a thin plate to the film, and cutting the film along the ring. It consists of a series of processes in which rings and thin plates are successively attached while a film-like adhesive tape is moved intermittently at a fixed pitch, and the tape is then cut along the rings. The adhesive tape is supplied to the center of the ring using a vacuum suction type transfer means, and a pedestal is provided below the ring attachment part of the adhesive tape. Then, the tape is cut along the ring from the underside of the ring, and the ring covered with the thin film is collected as appropriate.
The remaining perforated tape is characterized by a step of appropriately winding it up.

The method of the present invention will be described below based on embodiments shown in the accompanying drawings.

In the figure, reference numeral 1 denotes a metal circular ring serving as a carrier jig, and the rings 1 are stacked at regular intervals in a magazine 2 as shown in FIG. This magazine 2 is placed on a pedestal 3, and the pedestal 3 is lowered intermittently at a constant pitch by a unitized elevating mechanism 4 such as a screw jack type, rack and pinion type, or cylinder type. The sheets are taken out one by one by the feeding means 5.

The feeding means 5 has an endless conveyor belt 7 that is continuously driven by a drive pulley 6 in the direction of the arrow in FIG.
When the magazine 2 is lowered one pitch, the lowermost ring 1 is placed on the belt 7 and taken out, but a mechanism other than that shown may be used. Reference numeral 10 denotes a machine base to which the elevating mechanism 4, delivery means 5, etc. are attached, and a machine box 11 is provided on the upper side thereof.

12 and 13 are upper and lower rollers provided on the machine box 11 and the machine stand 10, and are intermittently driven in the direction of the arrow in FIG.

In addition, as shown in FIG.
Adhesive tape 15 pulled out from 4 is guided onto roller 13 via guide roller 16. This tape 15 is a film made of polyurethane or the like with an adhesive surface on one side, and is directed onto the roller 13 with the adhesive surface facing up.

Therefore, the ring 1 sent out by the sending means is sandwiched together with the adhesive tape 15 by the rollers 12 and 13 and stuck to the tape 15. These rollers 12 and 13 are rubber rollers, and the roller 12 is attached to a swing lever provided on the machine box 11 and pressed onto the roller 13 by a spring.

In the plan view of FIG. 2, reference numeral 18 is a magazine made of a thin plate 19 such as a silicon wafer, which has the same structure as the magazine 2 of FIG. Thin plates 19 are inserted in multiple stages.

Although not shown, the magazine 18 is placed on a pedestal that is raised and lowered by a lifting mechanism similar to the pedestal 3 that supports the magazine 2, and a thin plate 19 at the bottom is a push-out member. Each time it is pushed out to position a in FIG. 2 by 20, it moves down one pitch.

Reference numeral 17 in FIGS. 1 to 3 is means for transporting the thin plate 19. This transfer means 17 includes a guide frame 21 fixed to the machine box 11, a transfer table 22 that moves forward and backward along this arm 21 using a feed screw, etc., and a suction device 23 that is attached to this table 22 so as to be raised and lowered by an air cylinder or the like. It is made up of

The suction device 23 is connected to a vacuum suction device by a flexible hose (not shown). 2
4 is attached to the hollow shaft of the cover suction device 23 so as to be able to rise and fall while maintaining airtightness, and is pushed downward by a spring, and a gasket 25 is attached to its lower edge. 26 is an arm fixed to the machine box 11,
A hollow pedestal 27 is provided at the top of the tip of this arm 26, a diaphragm 28 is stretched over this pedestal 27, the tape 15 is configured to move on this diaphragm 28, and a flexible hose (not shown) is attached. It is connected to the lower part of the pedestal 27 to apply air pressure to the lower part of the diaphragm 28.

In the above configuration, the transfer table 22 is a
The suction device 23 descends to suck the thin plate 19 and then rises, and then the transfer table 22 moves onto the pedestal 27 and stops as shown in FIG. 3. During this time, the ring 1 on the tape 15 is placed on the pedestal 2.
7 and stops, the suction device 23 that has sucked the thin plate 19 descends to bring the thin plate 19 into contact with the tape 15 in the ring 1, and at the same time
Air pressure is applied inside 7 to push the diaphragm 28 upward, and the tape 15 and thin plate 19 are bonded together.

Next, suction by the suction device 23 is stopped, the suction device 23 is raised, the pressure inside the pedestal 27 is released, and the tape 15 is advanced one pitch.

FIG. 4 shows another embodiment, in which the suction device 29
It is the same as that shown in FIG. 3, except that the holder 27 is shaped like a hollow flat plate and has a large number of small holes at the bottom, and the diaphragm of the pedestal 27 is omitted and the pedestal 27 is made into a dish-like shape with an insertion hole 30 provided therein. In this case, when the thin plate 19 is suctioned by the suction device 29 and lowered onto the pedestal 27, first, the cover 24
is in close contact with the ring 1, and then the thin plate 19 on the lower surface of the suction device 29 is in close contact with the tape 15. In this state, the gasket 25 at the bottom of the cover 24 is attached to the ring 1.
Since the tape 15 is in close contact with the top and the bottom surface of the ring 1, the inside of the cover 24 is in the same vacuum state as the inside of the suction device 29. On the other hand, inside the pedestal 27 is a ventilation hole 30.
Since the tape 15 is connected to the atmosphere by the atmospheric pressure, the tape 15 is pressed toward the suction device 29 by the atmospheric pressure, so that the tape 15 and the thin plate 19 come into close contact with each other. Other operations are similar to the example shown in FIG.

The ring 1 and the thin plate 19 thus pasted on the tape 15 move onto the next cutting means 32 as the tape 15 advances.

As shown in FIG.
Provided at the end. Gear motor 3 is installed at the bottom of the arm 34 end.
5 is fixed, a cutter arm 38 that swings about a shaft 37 is attached to a rotating frame 36 rotated by a motor 35, and a freely rotating disc-shaped cutter 39 is attached to the tip of this arm 38. The tip of the arm 38 is pushed up by a spring 40.

Also, a vertical shaft 4 fixed at the center of the rotating frame 36
A disc-shaped presser plate 42 is rotatably attached to the upper end of the rotation frame 36, and a circular annular rubber 43 is attached to the upper surface of the outer periphery of the presser plate 42. roller 4 in contact with the lower circumference of
4 will be provided.

Further, above the cylinder 33, a receiving member 48 that is raised and lowered by an air cylinder 47 is provided at the tip of an arm 46 fixed to the machine box 11, and a projecting edge 49 on the lower outer periphery of this receiving member 48 receives the ring 1. Configure.

In the above configuration, when the ring 1 and the thin plate 19 stuck on the adhesive tape 15 come onto the cutting means 32 and stop, the cylinders 33 and 47 act to raise the cutting means 32 and simultaneously lower the receiving member 48. The rubber 43 of the presser plate 42 and the ridge 49 of the receiving member 48 sandwich the tape 15 and ring 1, and the cutter 39
cuts into the tape 15, and the motor 35 rotates the shaft 41 and the rotating frame 36 to cut the tape 15 on the lower surface of the ring 1. When the rotating frame 36 rotates approximately two times and completely cuts the tape 15, the motor 35
stops, the arm 34 is lowered by the cylinder 33, and the receiving member 48 is also raised.

As shown in FIGS. 1 and 6, the cut tape 15 is guided by a roller 51 in front of the cutting means 32, passes through a guide roller 52, and is wound onto a take-up shaft 53. Therefore, the adhesive tape 15 has holes 54 formed at regular intervals through which the film 15' attached to the ring 1 is cut out.

Further, the ring 1 covered with the film 15' to which the thin plate 19 is attached is separated from the tape 15 and placed on the roller 55.
The rollers 55 and the conveyor 56 are attached to the machine box 11 and the machine stand 10.

Reference numeral 57 in FIG. 1 is a magazine for storing the ring 1 covered with the thin plate 19 and film 15' as described above. This magazine 57 includes each of the magazines 2,
It is almost similar to 18, and has an appropriate lifting mechanism 58.
The conveyor 5 is placed on a pedestal 59 that is raised and lowered by
The ring 1 that has moved above the ring 6 rises one pitch before it enters the magazine 57.

In this invention, as described above, a film-like adhesive tape is moved intermittently in the longitudinal direction with the adhesive side facing upward, and the rings, which are fed out one by one by a feeding means, are stuck onto the adhesive tape by upper and lower rollers. The process is to supply a thin plate to the center of the ring stuck on the adhesive tape and stick it on the adhesive tape,
Next, the tape is cut along the ring on the lower surface of the ring, the ring covered with the thin film attached is appropriately collected, and the remaining perforated tape is appropriately wound. In the method of this invention, the thin plate is automatically attached to the adhesive tape and the thin plate is attached to the adhesive tape without manual intervention. The adhesive tape is supplied to the center of the ring by a transfer means, and a pedestal is provided below the ring attachment part of the adhesive tape, and the adhesive tape is pushed by air pressure inside the pedestal onto a thin plate that is suctioned and held by the transfer means. Because it is crimped and pasted,
Adhesive tape can be attached extremely easily. These attachments are carried out on the tape stretched between the rollers, and the cutting means acts on the underside of the ring to cut the tape while it is still attached to the ring, making it possible to cut very accurately and to avoid wrinkles in the film. Does not occur. Furthermore, since the perforated tape after being cut is wound up by a winding roller, there is an effect that the tape after being cut can be easily disposed of.

[Brief explanation of the drawing]

Fig. 1 is a front view showing an example of an apparatus for carrying out the method of the present invention, Fig. 2 is a plan view of the same as above, Fig. 3 is an enlarged vertical sectional side view taken along line A-A in Fig. FIG. 1 is an enlarged longitudinal sectional side view taken along line A-A in FIG. 1, showing another example, FIG. 5 is an enlarged longitudinal sectional side view taken along line BB in FIG. 1, and FIG. 6 is a perspective view of main parts. DESCRIPTION OF SYMBOLS 1... Ring, 5... Delivery means, 15... Tape, 15'... Film, 19... Thin plate, 32
... Cutting means.

Claims (1)

[Claims] 1. A step in which a film-like adhesive tape is moved intermittently in the longitudinal direction with the adhesive side facing upward, and the rings fed out one by one by a feeding means are stuck onto the adhesive tape by upper and lower rollers; A method comprising the steps of supplying a thin plate to the center of the ring attached to the adhesive tape and pasting it on the adhesive tape, the thin plate is supplied to the center of the ring by a vacuum suction type transfer means, and the adhesive tape is attached to the ring. A cradle is provided at the bottom of the ring, and the adhesive tape is pressed and adhered to the thin plate held by the transfer means by air pressure, and then the tape is attached to the bottom of the ring. A method for attaching a ring and a thin plate, which consists of the steps of separating the ring along the ring, collecting the ring covered with a thin plate, and winding up the remaining perforated tape.