JPS55128817A - Device for bonding piece on tape - Google Patents

Device for bonding piece on tape

Info

Publication number
JPS55128817A
JPS55128817A JP3547379A JP3547379A JPS55128817A JP S55128817 A JPS55128817 A JP S55128817A JP 3547379 A JP3547379 A JP 3547379A JP 3547379 A JP3547379 A JP 3547379A JP S55128817 A JPS55128817 A JP S55128817A
Authority
JP
Japan
Prior art keywords
wafer
tape
bonding
bernoulli
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3547379A
Other languages
Japanese (ja)
Inventor
Yuzo Taniguchi
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3547379A priority Critical patent/JPS55128817A/en
Publication of JPS55128817A publication Critical patent/JPS55128817A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To surely and quickly bond a wafer without damaging it, by intermittently moving a tape, only the top of which is coated with a bonding agent and by using a Bernoulli's chuck to place the wafer on the tape and lifting up the tape by a bonding mechanism synchronously with the placing of the wafer.
CONSTITUTION: A tape 14, only the top of which is coated with a bonding agent, is intermittently moved by four pairs of rollers 15 which are provided in a tape moving mechanism and located on the obverse and reverse sides of the tape. A surface A surrounded by the rollers 15 is in a wafer bonding position. A wafer feed stage 18, on which a wafer 19 is placed, is provided near the tape 14. When the tape 14 is at rest, the wafer 19 is sucked by a Bernoulli's chuck 24 which constitutes a wafer conveying mechanism 22. After that, the arm 23 of the mechanism 22 is swung to transfer the wafer 19 to the position A. A bonding mechnaism 16 provided below the position A is operated synchronously with the transfer of the wafer to lift up the tape 14 by an upper rubber pusher 17 and fix the wafer 19.
COPYRIGHT: (C)1980,JPO&Japio
JP3547379A 1979-03-28 1979-03-28 Device for bonding piece on tape Pending JPS55128817A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3547379A JPS55128817A (en) 1979-03-28 1979-03-28 Device for bonding piece on tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3547379A JPS55128817A (en) 1979-03-28 1979-03-28 Device for bonding piece on tape

Publications (1)

Publication Number Publication Date
JPS55128817A true JPS55128817A (en) 1980-10-06

Family

ID=12442740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3547379A Pending JPS55128817A (en) 1979-03-28 1979-03-28 Device for bonding piece on tape

Country Status (1)

Country Link
JP (1) JPS55128817A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038897A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding thin plate to ring
JPS6038898A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding ring to thin plate
JPS6121762U (en) * 1984-07-13 1986-02-07 積水化学工業株式会社 tape pasting machine
JPH01267264A (en) * 1988-04-19 1989-10-25 Nitto Denko Corp Sticking method for thin plate and adhesive tape

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038897A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding thin plate to ring
JPS6038898A (en) * 1983-08-11 1985-02-28 日東電工株式会社 Method of bonding ring to thin plate
JPS6313903B2 (en) * 1983-08-11 1988-03-28 Nitto Electric Ind Co
JPS6337018B2 (en) * 1983-08-11 1988-07-22 Nitto Electric Ind Co
JPS6121762U (en) * 1984-07-13 1986-02-07 積水化学工業株式会社 tape pasting machine
JPH0117561Y2 (en) * 1984-07-13 1989-05-22
JPH01267264A (en) * 1988-04-19 1989-10-25 Nitto Denko Corp Sticking method for thin plate and adhesive tape

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