JPS6425549A - Transfer apparatus - Google Patents

Transfer apparatus

Info

Publication number
JPS6425549A
JPS6425549A JP62181094A JP18109487A JPS6425549A JP S6425549 A JPS6425549 A JP S6425549A JP 62181094 A JP62181094 A JP 62181094A JP 18109487 A JP18109487 A JP 18109487A JP S6425549 A JPS6425549 A JP S6425549A
Authority
JP
Japan
Prior art keywords
wafer
jig
hand
sucking
transferred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62181094A
Other languages
Japanese (ja)
Inventor
Akihiko Sato
Kimio Muramatsu
Yoshiharu Shigyo
Seiichi Yamada
Shigeo Tomiyama
Daijiro Ida
Masami Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP62181094A priority Critical patent/JPS6425549A/en
Publication of JPS6425549A publication Critical patent/JPS6425549A/en
Pending legal-status Critical Current

Links

Landscapes

  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

PURPOSE:To prevent the contamination and breakdown of a material to be transferred and to improve productivity, when the material to be transferred is transferred between a first jig and a second jig, by providing a hand, which sucks and holds the material to be transferred, and providing a transfer apparatus, which moves said hand. CONSTITUTION:When a wafer in a jig 2 is held with a hand 31, it is moved to input/output parts of the carrier jig 2 with a robot. The outer peripheral part of each wafer 1 is inserted into a sucking part 36 of a sucking head 35. The wafer 1 is sucked with the sucking part 36 by the sucking force of a sucking port 37. The wafer is sealed with a sucking pad 38. The hand 31, which sucks and holds the wafer 1 and pulls the wafer out of the carrier jig 1, is moved on a part directly over a special jig 5 with the robot. When the hand 31 is vertically lowered, the wafer is inputted into the special jig 5 along a mounting surface. When the wafer 1 is inserted into a specified height, the sucking force of the sucking port 37 is cut with the control of a controller. The wafer 1 is transferred into the jig 5. When the holding of the wafer 1 is released, the hand 31 is lifted vertically. Then the hand is moved to the position of the jig 2.
JP62181094A 1987-07-22 1987-07-22 Transfer apparatus Pending JPS6425549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62181094A JPS6425549A (en) 1987-07-22 1987-07-22 Transfer apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62181094A JPS6425549A (en) 1987-07-22 1987-07-22 Transfer apparatus

Publications (1)

Publication Number Publication Date
JPS6425549A true JPS6425549A (en) 1989-01-27

Family

ID=16094724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62181094A Pending JPS6425549A (en) 1987-07-22 1987-07-22 Transfer apparatus

Country Status (1)

Country Link
JP (1) JPS6425549A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04369243A (en) * 1991-06-17 1992-12-22 Nissin Electric Co Ltd Wafer conveyor mechanism
JP2019189939A (en) * 2018-04-18 2019-10-31 キヤノントッキ株式会社 Work piece housing device and work piece housing method and evaporation method using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04369243A (en) * 1991-06-17 1992-12-22 Nissin Electric Co Ltd Wafer conveyor mechanism
JP2019189939A (en) * 2018-04-18 2019-10-31 キヤノントッキ株式会社 Work piece housing device and work piece housing method and evaporation method using the same

Similar Documents

Publication Publication Date Title
DE3889672D1 (en) Device for treating disc-shaped objects.
JPH0745556A (en) Dicing device
JPS6424440A (en) Device for transferring and positioning flat-platelike object
JPS6425549A (en) Transfer apparatus
ATE128397T1 (en) WORK TABLE WITH VACUUM SUCTION FOR MACHINE TOOLS.
JPH07283174A (en) Dicing device
JPS57127638A (en) Work positioning and clamping method
CN112008702B (en) Conveying robot
JPS6461031A (en) Device for mounting chip
JPS6487424A (en) Translocating device for workpiece
JPS6423547A (en) Transfer device
JPS55128817A (en) Device for bonding piece on tape
JPS56100433A (en) Manufacture of semiconductor device
EP0607441A4 (en) Abrading device and abrading method employing the same.
JPS6431431A (en) Conveying method
CN214981033U (en) Six-shaft manipulator transfer device
JPS6461033A (en) Device for mounting chip
JPS577135A (en) Wire bonding apparatus
JPS6440293A (en) Robot hand for carrying
JPS57155738A (en) Collet for pellet bonding
JPS62157149U (en)
JPS54128895A (en) Vertical double-head surface grinder
JPS61101321A (en) Wafer transport device
JPS6422722A (en) Work carrier
JPS5723238A (en) Suction tweezers