JPS57155738A - Collet for pellet bonding - Google Patents

Collet for pellet bonding

Info

Publication number
JPS57155738A
JPS57155738A JP4033381A JP4033381A JPS57155738A JP S57155738 A JPS57155738 A JP S57155738A JP 4033381 A JP4033381 A JP 4033381A JP 4033381 A JP4033381 A JP 4033381A JP S57155738 A JPS57155738 A JP S57155738A
Authority
JP
Japan
Prior art keywords
pellet
collet
tip
buffer tube
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4033381A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4033381A priority Critical patent/JPS57155738A/en
Publication of JPS57155738A publication Critical patent/JPS57155738A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Abstract

PURPOSE:To permit the simplicity of workability and control by a method wherein a collet is formed in cylindrical shape and the tip of the collet is contacted with the surface of a pellet and vacuum sucking is also applied to the surface of the pellet. CONSTITUTION:A collet 10 is formed in cylindrical shape and a buffer tube 13 consisting of a soft member such as silicon rubber is engaged with the tip of the collet to project the tip of the buffer tube from the tip of the collet. In performing bonding, the collet 10 sucks one pellet from a wafer 2 for carriage. After performing positioning for the pellet 1 on a positioning dish 4, the pellet 1 is again sucked for carriage and the bonding of the pellet is completed by pressing the pellet 1 on a package 3. At that time, the tip of the buffer tube 13 just contacts with the surface of the pellet 1. Accordingly, the upper edge and surface of the pellet will not be damaged.
JP4033381A 1981-03-23 1981-03-23 Collet for pellet bonding Pending JPS57155738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4033381A JPS57155738A (en) 1981-03-23 1981-03-23 Collet for pellet bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4033381A JPS57155738A (en) 1981-03-23 1981-03-23 Collet for pellet bonding

Publications (1)

Publication Number Publication Date
JPS57155738A true JPS57155738A (en) 1982-09-25

Family

ID=12577691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4033381A Pending JPS57155738A (en) 1981-03-23 1981-03-23 Collet for pellet bonding

Country Status (1)

Country Link
JP (1) JPS57155738A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5345876B2 (en) * 1974-05-22 1978-12-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5345876B2 (en) * 1974-05-22 1978-12-09

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