JPS57210641A - Supporting structure for wafer - Google Patents

Supporting structure for wafer

Info

Publication number
JPS57210641A
JPS57210641A JP9381681A JP9381681A JPS57210641A JP S57210641 A JPS57210641 A JP S57210641A JP 9381681 A JP9381681 A JP 9381681A JP 9381681 A JP9381681 A JP 9381681A JP S57210641 A JPS57210641 A JP S57210641A
Authority
JP
Japan
Prior art keywords
wafer
tape
bonding strength
dicing
full
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9381681A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9381681A priority Critical patent/JPS57210641A/en
Publication of JPS57210641A publication Critical patent/JPS57210641A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing

Abstract

PURPOSE:To facilitate the handling of a wafer supporting structure by extending a tape of strong bonding strength on a supporting jig and bonding a wafer through a tape of weak bonding strength on the upper surface of the tape, thereby enabling to support the wafer in a flat state even if a full dicing is executed. CONSTITUTION:A tape 5 of strong bonding strength is bonded to a semiconductor wafer supporting jig 4, and a wafer 1 is bonded through a tape 6 of weak bonding strength cut partly at the time of full dicing on the tape 5. In this manner, even if the wafer 1 is full diced, the flat state of the wafer 1 can be maintained, thereby performing the treatment of the later step. Thus, the wafer dicing can be fully automatized, and a breaking is eliminated, thereby preventing the crack and cutout or the like of a pellet.
JP9381681A 1981-06-19 1981-06-19 Supporting structure for wafer Pending JPS57210641A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9381681A JPS57210641A (en) 1981-06-19 1981-06-19 Supporting structure for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9381681A JPS57210641A (en) 1981-06-19 1981-06-19 Supporting structure for wafer

Publications (1)

Publication Number Publication Date
JPS57210641A true JPS57210641A (en) 1982-12-24

Family

ID=14092918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9381681A Pending JPS57210641A (en) 1981-06-19 1981-06-19 Supporting structure for wafer

Country Status (1)

Country Link
JP (1) JPS57210641A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815355U (en) * 1981-07-23 1983-01-31 日本電気ホームエレクトロニクス株式会社 Semiconductor wafer adhesive structure
JPS59181554A (en) * 1983-03-31 1984-10-16 Nec Corp Processing method for semiconductor element
JPS6031918A (en) * 1983-07-29 1985-02-18 関西日本電気株式会社 Adhesive sheet for dicing semiconductor wafer
JPS61289645A (en) * 1985-06-13 1986-12-19 ナショナル　スターチ　アンド　ケミカル　コーポレイション Adhesive die attaching film
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
US6136137A (en) * 1998-07-06 2000-10-24 Micron Technology, Inc. System and method for dicing semiconductor components

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815355U (en) * 1981-07-23 1983-01-31 日本電気ホームエレクトロニクス株式会社 Semiconductor wafer adhesive structure
JPS59181554A (en) * 1983-03-31 1984-10-16 Nec Corp Processing method for semiconductor element
JPS6031918A (en) * 1983-07-29 1985-02-18 関西日本電気株式会社 Adhesive sheet for dicing semiconductor wafer
JPS61289645A (en) * 1985-06-13 1986-12-19 ナショナル　スターチ　アンド　ケミカル　コーポレイション Adhesive die attaching film
US5362681A (en) * 1992-07-22 1994-11-08 Anaglog Devices, Inc. Method for separating circuit dies from a wafer
US6136137A (en) * 1998-07-06 2000-10-24 Micron Technology, Inc. System and method for dicing semiconductor components
US6319354B1 (en) 1998-07-06 2001-11-20 Micron Technology, Inc. System and method for dicing semiconductor components

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