JPH02112258A - Adhesive tape for semiconductor device - Google Patents
Adhesive tape for semiconductor deviceInfo
- Publication number
- JPH02112258A JPH02112258A JP63265302A JP26530288A JPH02112258A JP H02112258 A JPH02112258 A JP H02112258A JP 63265302 A JP63265302 A JP 63265302A JP 26530288 A JP26530288 A JP 26530288A JP H02112258 A JPH02112258 A JP H02112258A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive tape
- adhesive
- bubble
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000005498 polishing Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 20
- 239000000463 material Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、半導体装置のウェハでの固定、保護に用いる
粘着テープの構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an adhesive tape used for fixing and protecting semiconductor devices on wafers.
［発明の概要１
本発明は、半導体装置のウェハでの固定、保護に用いら
れる粘着テープにおいて、粘着テープに孔を設けること
により、ウェハと粘着テープ間の気泡による密着不良を
防止したものである。[Summary of the Invention 1 The present invention is an adhesive tape used for fixing and protecting a semiconductor device on a wafer, by providing holes in the adhesive tape to prevent poor adhesion due to air bubbles between the wafer and the adhesive tape. .
［従来の技術］
従来の半導体用粘着テープは、第１図に示すように、孔
なしの基材１に粘着剤２を塗布したものが知られている
。[Prior Art] As shown in FIG. 1, a conventional adhesive tape for semiconductors is known in which an adhesive 2 is applied to a base material 1 without holes.
〔発明が解決しようとする課題］
しかし、従来の粘着テープは、ウェハ３と粘着テープの
貼り合せ時に、ウェハ３と粘着剤２の間に気泡４が入っ
た場合、ウェハ３の領域Ａと粘着剤２の領域Ｂの部分の
密着がわるく、あらためて気泡を抜くということをしな
ければならない課題を有していた。[Problems to be Solved by the Invention] However, with the conventional adhesive tape, if air bubbles 4 enter between the wafer 3 and the adhesive 2 when the wafer 3 and the adhesive tape are bonded together, the area A of the wafer 3 and the adhesive There was a problem in that the adhesion of Agent 2 to Area B was poor, and air bubbles had to be removed again.
そこで本発明は、従来のこのような課題を解決するため
、粘着テープとウニ入間に気泡が入っても、自然に気泡
が抜け、良好な密着が得られることを目的としている。Therefore, in order to solve these conventional problems, the present invention aims to allow air bubbles to naturally escape even if air bubbles are introduced between the adhesive tape and the sea urchin inlet, thereby achieving good adhesion.
［課題を解決するための手段］
上記課題を解決するために、本発明の半導体装置用粘着
テープは、粘着テープの基材及び粘着剤に気泡抜きのた
めの孔を設けたことを特徴とする。[Means for Solving the Problems] In order to solve the above problems, the adhesive tape for semiconductor devices of the present invention is characterized in that the base material and the adhesive of the adhesive tape are provided with holes for removing air bubbles. .
［作 用］
上記のように構成された粘着テープにてウェハを貼り付
けた際、ウェハと粘着テープの間に気泡が入り込んでも
、粘着テープに設けた孔により気泡が抜け、粘着テープ
とウェハの密着むらを良好にさせることができる。[Function] When a wafer is attached using the adhesive tape configured as described above, even if air bubbles enter between the wafer and the adhesive tape, the air bubbles will escape through the holes provided in the adhesive tape, and the adhesive tape and wafer will be separated. It is possible to improve uneven adhesion.
［実 施 例］
以下に本発明の実施例を図面にもとすいて説明する。第
２図は、ウェハ３を各々のタイに切断分離するダイシン
グ時に、ダイの飛び敗り防止のため使用される粘着テー
プに於いて、空気が通過することができる大きさ以上の
孔を高密度に設けた粘着テープを使用することにより、
ウェハ３への粘着テープの貼り合わせ時に、ウェハ３と
粘着剤２との間に生じた気泡４を、孔５より自然に抜き
ウェハ３と粘着剤２の密度を良好とし、密着不良による
ダイシング中のタイの飛び敗りを防止する。[Examples] Examples of the present invention will be described below with reference to the drawings. Figure 2 shows the adhesive tape used to prevent the die from flying off during dicing to cut and separate the wafer 3 into individual ties. By using the adhesive tape provided on the
When bonding the adhesive tape to the wafer 3, air bubbles 4 generated between the wafer 3 and the adhesive 2 are naturally removed from the hole 5 to improve the density of the wafer 3 and the adhesive 2, and during dicing due to poor adhesion. This will prevent the tie from being lost.
また第３図において、ウェハの裏面研削の際、ウェハ表
面の保護用に用いられる粘着テープに上記の様な孔５を
設けた粘着テープを使用することにより気泡４が抜け、
フラットなテープ面を研削ステージで吸着することによ
りより安定に吸着でき、しかも従来、気泡の圧力によっ
てウェハ表面へ加わっていたストレスを緩和することが
できる。In addition, in FIG. 3, when grinding the back side of the wafer, air bubbles 4 are removed by using an adhesive tape used to protect the wafer surface with holes 5 as described above.
By adsorbing the flat tape surface on the grinding stage, it is possible to achieve more stable adsorption, and moreover, it is possible to alleviate the stress conventionally applied to the wafer surface due to the pressure of bubbles.
［発明の効果１
これにより本発明は、粘着テープとウェハ間に良好な密
着が得られる。さらに、ウェハ表面へ加わっていたスト
レスも緩和することができる。[Effect of the Invention 1] As a result, the present invention provides good adhesion between the adhesive tape and the wafer. Furthermore, stress applied to the wafer surface can be alleviated.
第１図は、従来の半導体装置用粘着テープのウェハとの
貼り合わせを示す主要断面図である。
第２図及び第３図は、本発明にかかる半導体装置用粘着
テープの実施例を示す主要断面図である。
１・・・基板
２・・・粘着剤
３・・・ウェハ
４・・・気泡
５・・・孔
６・・・吸着ステージ
以上
出願人 セイコーエプソン株式会社FIG. 1 is a main cross-sectional view showing how a conventional adhesive tape for semiconductor devices is bonded to a wafer. FIGS. 2 and 3 are main sectional views showing embodiments of the adhesive tape for semiconductor devices according to the present invention. 1... Substrate 2... Adhesive 3... Wafer 4... Bubbles 5... Holes 6... Adsorption stage and above Applicant: Seiko Epson Corporation
Claims (1)
粘着テープに孔を設けたことを特徴とする半導体装置用
粘着テープ。An adhesive tape for a semiconductor device, characterized in that a hole is provided in the adhesive tape when the adhesive tape is bonded to a semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63265302A JPH02112258A (en) | 1988-10-21 | 1988-10-21 | Adhesive tape for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63265302A JPH02112258A (en) | 1988-10-21 | 1988-10-21 | Adhesive tape for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02112258A true JPH02112258A (en) | 1990-04-24 |
Family
ID=17415314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63265302A Pending JPH02112258A (en) | 1988-10-21 | 1988-10-21 | Adhesive tape for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02112258A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1009026A3 (en) * | 1998-12-11 | 2000-12-13 | Mitsubishi Denki Kabushiki Kaisha | Power semiconductor module |
| EP1139415A1 (en) * | 2000-03-30 | 2001-10-04 | Nitto Denko Corporation | Water-permeable adhesive tape for semiconductor processing |
| JP2003034780A (en) * | 2001-04-23 | 2003-02-07 | Furukawa Electric Co Ltd:The | Pressure sensitive adhesive tape for use in laser dicing |
| EP1894981A1 (en) * | 2006-08-29 | 2008-03-05 | Nitto Denko Corporation | Adhesive sheet for water jet laser dicing |
-
1988
- 1988-10-21 JP JP63265302A patent/JPH02112258A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1009026A3 (en) * | 1998-12-11 | 2000-12-13 | Mitsubishi Denki Kabushiki Kaisha | Power semiconductor module |
| EP1139415A1 (en) * | 2000-03-30 | 2001-10-04 | Nitto Denko Corporation | Water-permeable adhesive tape for semiconductor processing |
| US7608328B2 (en) | 2000-03-30 | 2009-10-27 | Nitto Denko Corporation | Water-permeable adhesive tape |
| JP2003034780A (en) * | 2001-04-23 | 2003-02-07 | Furukawa Electric Co Ltd:The | Pressure sensitive adhesive tape for use in laser dicing |
| EP1894981A1 (en) * | 2006-08-29 | 2008-03-05 | Nitto Denko Corporation | Adhesive sheet for water jet laser dicing |
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