JPS61222146A - Sheet for supporting semiconductor wafer - Google Patents
Sheet for supporting semiconductor waferInfo
- Publication number
- JPS61222146A JPS61222146A JP60024851A JP2485185A JPS61222146A JP S61222146 A JPS61222146 A JP S61222146A JP 60024851 A JP60024851 A JP 60024851A JP 2485185 A JP2485185 A JP 2485185A JP S61222146 A JPS61222146 A JP S61222146A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- sheet
- semiconductor wafer
- wafer
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体ウェハの切断に用いる、ことができる半
導体ウェハ支持用シートに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor wafer support sheet that can be used for cutting semiconductor wafers.
従来の技術
半導体装置の製造に際しては、多数個の半導体装置が作
り込まれた半導体ウェハを前記半導体装置ごとに切断し
て多数個のチップを得るために前記半導体ウェハを半導
体ウェハ支持用シートにはり付け、次に前記半導体ウェ
ハをダイジグする方法がとられる。BACKGROUND ART When manufacturing semiconductor devices, a semiconductor wafer on which a large number of semiconductor devices are fabricated is cut into individual semiconductor devices, and the semiconductor wafer is glued onto a semiconductor wafer support sheet in order to obtain a large number of chips. A method is used in which the semiconductor wafer is attached and then die-jigged.
第２図は半導体ウェハをはり付ける従来の半導体ウェハ
支持用シートの断面図である。FIG. 2 is a sectional view of a conventional semiconductor wafer support sheet to which a semiconductor wafer is attached.
シート基材１は樹脂などからなり、その上に半導体ウェ
ハを固定するだめの粘着剤２が塗布されている。The sheet base material 1 is made of resin or the like, and an adhesive 2 for fixing the semiconductor wafer is applied thereon.
発明が解決しようとする問題点
しかしながら、上記のような構成では、半導体ウェハ支
持用シートを半導体ウェハの裏面に接着する際、半導体
装置が形成されている半導体ウヱハ表面側を何らかの方
法で支持または固定し、半導体ウェハ支持用シートの粘
着層が形成された面とは反対の面を、ヘラあるいはロー
ラなとでこする必要がある。Problems to be Solved by the Invention However, in the above configuration, when bonding the semiconductor wafer support sheet to the back surface of the semiconductor wafer, the front surface side of the semiconductor wafer on which semiconductor devices are formed must be supported or fixed in some way. However, it is necessary to rub the surface of the semiconductor wafer support sheet opposite to the surface on which the adhesive layer is formed with a spatula or roller.
このとき半導体ウェハの表面に加えられた圧力のために
前記半導体ウェハに歪を生じて、リーク電流が増加する
など、半導体装置の特性が劣化したり、さらに半導体装
置が破壊される、などの問題が生ずる。At this time, the pressure applied to the surface of the semiconductor wafer causes distortion in the semiconductor wafer, leading to problems such as increased leakage current, deterioration of the characteristics of the semiconductor device, and even destruction of the semiconductor device. occurs.
問題点を解決するための手段
上記問題点を解決するために、本発明の半導体ウニ″支
持用シートは１シート基材の一方の面に粘着剤が塗布さ
れるとともに、多数個の貫通孔が形成されて構成されて
いる。Means for Solving the Problems In order to solve the above problems, the semiconductor sea urchin'' support sheet of the present invention has one sheet base material coated with an adhesive and a large number of through holes. formed and composed.
作 用
この構成によって、半導体ウェハ支持用シートの粘着層
の上に載置された半導体ウェハを、半導体支持用シート
の貫通孔より前記半導体支持用シートに真空吸引するこ
とにより半導体ウェハが固定でき、したがって、半導体
ウェハ表面の半導体装置の活性層に圧力を加えることな
く、半導体ウェハを半導体支持用シートに接着すること
ができる０
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。Function: With this configuration, the semiconductor wafer placed on the adhesive layer of the semiconductor wafer support sheet can be fixed by vacuum suction to the semiconductor support sheet through the through hole of the semiconductor support sheet. Therefore, the semiconductor wafer can be bonded to the semiconductor support sheet without applying pressure to the active layer of the semiconductor device on the surface of the semiconductor wafer.Example Hereinafter, an example of the present invention will be described with reference to the drawings. do.
本発明の半導体支持用シートは、第１図に図示するよう
にシート基材１の一方の面に、粘着剤が塗布されて粘着
層２が形成され、さらに粘着層２とシート基材１を貫通
する孔３が多数個形成されている。As shown in FIG. 1, the semiconductor support sheet of the present invention has an adhesive layer 2 formed by applying an adhesive to one side of a sheet base material 1, and further includes an adhesive layer 2 and a sheet base material 1. A large number of through holes 3 are formed.
この半導体ウェハ支持用シートへの半導体ウェハの接着
は次のようにして行なう。The semiconductor wafer is bonded to the semiconductor wafer support sheet in the following manner.
まず、半導体支持用シートをシート基材１を下側にし、
真空吸引孔４を持つ半導体ウェハ切断装置吸着台６に置
く。First, place the semiconductor support sheet with the sheet base material 1 facing downward,
A semiconductor wafer cutting device having a vacuum suction hole 4 is placed on a suction table 6 .
次に、半導体ウェハ６の活性層側と反対の面と、半導体
支持用シートの粘着層２とが向い合うように半導体ウェ
ハ６を半導体支持用シートに置く。Next, the semiconductor wafer 6 is placed on the semiconductor support sheet so that the surface of the semiconductor wafer 6 opposite to the active layer side faces the adhesive layer 2 of the semiconductor support sheet.
真空吸引孔４より真空吸着を行なえばシート貫通孔３を
通して半導体ウェハ６が粘着層２に接着されると共に、
半導体ウニへ〇と半導体支持用シートが真空吸着により
、半導体切断装置の吸着台６に固定される。By performing vacuum suction through the vacuum suction hole 4, the semiconductor wafer 6 is adhered to the adhesive layer 2 through the sheet through hole 3, and
The semiconductor support sheet and the semiconductor support sheet are fixed to the suction table 6 of the semiconductor cutting device by vacuum suction.
発明の効果
以上のように、本発明の半導体支持用シートを用いれば
、半導体ウェハ活性層に力を加えることなく、半導体ウ
ェハ支持用シートに半導体ウェハが接着され、半導体ウ
ェハを切断が行なえるために、接着による、特性の劣化
、半導体装置の破壊などがなくなる。Effects of the Invention As described above, by using the semiconductor support sheet of the present invention, the semiconductor wafer can be bonded to the semiconductor wafer support sheet and the semiconductor wafer can be cut without applying force to the semiconductor wafer active layer. Furthermore, deterioration of characteristics and destruction of semiconductor devices due to adhesion are eliminated.
このシートは支持用シートとして、あらゆる用途に応用
され、その効果は絶大である。This sheet can be used as a support sheet for a variety of purposes, and its effects are tremendous.
第１図は本発明の一実施例における半導体支持用シート
の使用方法を示す図、第２図は従来の半導体支持用シー
トの断面図である。
１・・・・・・シート基材、２・・・・・・シート粘着
層、３・・・・・・シート貫通孔、４・・・・・・真空
吸引孔、６・・・・・・半導体ウェハ切断装置吸着台、
６・・・・・・半導体ウェハ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名Ｗ＆
１ 図
第２図FIG. 1 is a diagram showing a method of using a semiconductor support sheet according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor support sheet. 1...Sheet base material, 2...Sheet adhesive layer, 3...Sheet through hole, 4...Vacuum suction hole, 6......・Semiconductor wafer cutting equipment suction table,
6... Semiconductor wafer. Name of agent: Patent attorney Toshio Nakao and one other person W&
1 Figure 2
Claims (1)
粘着剤および板状体を貫通する貫通孔が多数個設けられ
ていることを特徴とする半導体ウェハ支持用シート。1. A sheet for supporting a semiconductor wafer, characterized in that an adhesive is coated on one surface of a plate-like body, and a large number of through holes passing through the adhesive and the plate-like body are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60024851A JPS61222146A (en) | 1985-02-12 | 1985-02-12 | Sheet for supporting semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60024851A JPS61222146A (en) | 1985-02-12 | 1985-02-12 | Sheet for supporting semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61222146A true JPS61222146A (en) | 1986-10-02 |
Family
ID=12149714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60024851A Pending JPS61222146A (en) | 1985-02-12 | 1985-02-12 | Sheet for supporting semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61222146A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683947A (en) * | 1994-08-13 | 1997-11-04 | Robert Bosch Gmbh | Method for producing a component according to the anodic bonding method and component |
| JP2001085449A (en) * | 1999-09-10 | 2001-03-30 | Disco Abrasive Syst Ltd | Csp substrate holding member and table for csp substrate for placing the same thereon |
| WO2003041153A1 (en) * | 2001-11-07 | 2003-05-15 | Schlumberger Systèmes | Method of fixing a sealing object to a base object |
| JP2007059802A (en) * | 2005-08-26 | 2007-03-08 | Disco Abrasive Syst Ltd | Machining method of wafer, and pressure-sensitive adhesive tape used for the same |
| JP2007059829A (en) * | 2005-08-26 | 2007-03-08 | Disco Abrasive Syst Ltd | Machining method of wafer, and pressure-sensitive adhesive tape used for the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599741A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Affixing method of article onto adhesive tape |
-
1985
- 1985-02-12 JP JP60024851A patent/JPS61222146A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599741A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Affixing method of article onto adhesive tape |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5683947A (en) * | 1994-08-13 | 1997-11-04 | Robert Bosch Gmbh | Method for producing a component according to the anodic bonding method and component |
| JP2001085449A (en) * | 1999-09-10 | 2001-03-30 | Disco Abrasive Syst Ltd | Csp substrate holding member and table for csp substrate for placing the same thereon |
| WO2003041153A1 (en) * | 2001-11-07 | 2003-05-15 | Schlumberger Systèmes | Method of fixing a sealing object to a base object |
| CN100409421C (en) * | 2001-11-07 | 2008-08-06 | 雅斯拓股份有限公司 | Method of fixing a sealing object to a base object |
| JP2007059802A (en) * | 2005-08-26 | 2007-03-08 | Disco Abrasive Syst Ltd | Machining method of wafer, and pressure-sensitive adhesive tape used for the same |
| JP2007059829A (en) * | 2005-08-26 | 2007-03-08 | Disco Abrasive Syst Ltd | Machining method of wafer, and pressure-sensitive adhesive tape used for the same |
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