JPH11168074A - Dicing method of piezoelectric material substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform a full dicing operation by fixing a piezoelectric substrate with a method, wherein the bottom face of the single unit substrate to be diced is vacuum-sucked for each single unit substrate individually. SOLUTION: A plate 2 to be used for sucking of a substrate is provided with a plurality of substrate sucking holes 3, with which each single unit substrate 7 can be vacuum sucked individually. At this point, when a piezoelectric material substrate 1 is diced by a dicing blade 6 through vacuum-sucking of each single unit substrate 7 in the direction of vacuum suction, the single unit substrates 7 which are not dispersed because they are vacuum-sucked by the substrate sucking holes 3 and the substrates 7 can be fully diced. The piezoelectric material substrate 1 can be divided into single unit substrate 7 completely by full dicing, and working efficiency can be improved. Also, a plurality of substrate sucking plates 2 are prepared, and by having the interval of the substrate sucking holes conform with the single unit substrates 7, any size of single unit substrates can be fully diced by simply replacing the substrate sucking plate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for dicing a piezoelectric substrate.

[0002]

2. Description of the Related Art FIG. 2 shows a conventional dicing method.

In FIG. 2, 1 is a piezoelectric substrate, 2 is a plate for sucking a substrate, 3 is a hole for sucking a substrate, 4 is a dicing groove, 5 is a vacuum suction direction, 6 is a dicing blade, and 7 is a single substrate. , 8 are adhesive films.

As a conventional technique, an adhesive film 8 is attached to the back surface of the piezoelectric substrate 1, and full dicing is performed while leaving the thickness of the adhesive film 8. In this case, an operation of peeling off the single substrate 7 and the adhesive film 8 is required as a next step after full dicing.

[0005]

Conventionally, it has been necessary to peel off the adhesive film from the single substrate after full dicing.

According to the present invention, it is possible to eliminate the above-mentioned drawbacks and completely separate the piezoelectric substrate into a single substrate after full dicing of the piezoelectric substrate, so that the operation of peeling off the single substrate and the adhesive film becomes unnecessary. . Thereby, work efficiency is improved.

[0007]

According to the present invention, in order to achieve the above object, the bottom surface of a single substrate to be diced is individually vacuum-adsorbed to each single substrate and full dicing is performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.

FIG. 1 shows a method of dicing a piezoelectric substrate using the present invention.

In FIG. 1, reference numeral 1 denotes a piezoelectric substrate, 2 denotes a substrate suction plate, 3 denotes a substrate suction hole, 4 denotes a dicing groove, 5 denotes a vacuum suction direction, 6 denotes a dicing blade, and 7 denotes a single substrate. It is.

Next, these structures and functions will be described.

A plurality of substrate suction holes 3 are provided in the substrate suction plate 2 so that each single substrate 7 can be individually vacuum suctioned. Here, when the piezoelectric substrate 1 is diced by the dicing blade 6 by sucking each single substrate 7 in the vacuum suction direction 5, since each single substrate 7 is sucked in vacuum by the hole 3 for sucking the substrate, a full dicing process is performed. Full dicing is performed without dispersing each single substrate 7.

[0013]

As described above, according to the present invention, the piezoelectric substrate 1 can be completely divided into the single substrate 7 by full dicing, and the single substrate 7 and the adhesive film 8 as in the prior art can be separated. The work for peeling is not required, and the work efficiency can be improved. The distance between the holes for sucking the substrate varies depending on the dimensions of the single substrate 7, but a plurality of plates 2 for sucking the substrate are prepared, and the distance between the holes 3 for sucking the substrate is adjusted to the distance between the holes 3 for the single substrate. By doing so, it is possible to perform full dicing on a single substrate of any size simply by replacing the substrate suction plate 2.

[Brief description of the drawings]

FIG. 1 shows a method of dicing a piezoelectric substrate using the present invention.

FIG. 2 shows a conventional dicing method.

[Explanation of symbols]

1: piezoelectric substrate, 2: substrate suction plate, 3: substrate suction hole, 4: dicing groove, 5: vacuum suction direction, 6: dicing blade, 7: single substrate, 8: adhesive film.

Claims (1)

[Claims] In the dicing of a piezoelectric substrate, a single substrate to be divided is sucked from the bottom surface of the substrate individually to fix the piezoelectric substrate to a substrate suction plate.
A dicing method for a piezoelectric substrate, comprising performing full dicing of the piezoelectric substrate.