JPS63284551A - Method for mounting photomask pellicle - Google Patents
Method for mounting photomask pellicleInfo
- Publication number
- JPS63284551A JPS63284551A JP62119218A JP11921887A JPS63284551A JP S63284551 A JPS63284551 A JP S63284551A JP 62119218 A JP62119218 A JP 62119218A JP 11921887 A JP11921887 A JP 11921887A JP S63284551 A JPS63284551 A JP S63284551A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- pressing force
- photomask
- mounting
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000003825 pressing Methods 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体の製造装置等に使用するフォトマス
ク基板にフォトマスクペリクルを装着する方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a photomask pellicle on a photomask substrate used in semiconductor manufacturing equipment and the like.
従来のフォトマスクペリクル装着方法を第2図(A)
、 (B)に示す。以下、フォトマスクペリクルをrペ
リクルjと略す。なお第2図(A)はフォトマスク基板
にペリクルを装着した状態を示す側面断面図、第2図(
B)はフォトマスク基板にペリクルを装着する動作にお
ける力の加え方を示した側面図である。両図において、
1はべりタル枠、2はペリクル膜、3は接着剤、4はフ
ォトマスク基板、5はフォトマスクパターン、6はへオ
ドマスク位置決め固定治具である。Figure 2 (A) shows the conventional photomask pellicle mounting method.
, shown in (B). Hereinafter, the photomask pellicle will be abbreviated as r pellicle j. Note that FIG. 2(A) is a side cross-sectional view showing a state in which a pellicle is attached to a photomask substrate, and FIG.
B) is a side view showing how to apply force in the operation of attaching a pellicle to a photomask substrate. In both figures,
1 is a vertical frame, 2 is a pellicle film, 3 is an adhesive, 4 is a photomask substrate, 5 is a photomask pattern, and 6 is a heodomask positioning fixture.
次に動作について説明する。まず、あらかしめフォトマ
スク基板4を位置決め固定し、ペリクル枠1に所定の押
圧力を加え、所定時間その力を保持しフォトマスク基板
4にペリクル枠1を接着剤3により装着する。Next, the operation will be explained. First, the staking photomask substrate 4 is positioned and fixed, a predetermined pressing force is applied to the pellicle frame 1, and the force is maintained for a predetermined time to attach the pellicle frame 1 to the photomask substrate 4 with the adhesive 3.
従来のペリクル装着方法は以上のように構成されており
、ペリクル枠をフォトマスク基板に接着剤により装着す
る際、装着部をすきま、気泡等のない均一なものにする
には装着時に加える力を極めて大きくする必要がありま
た、装着時に加えられる過大な押圧力により、ペリクル
枠およびフォトマスク基板にひずみ等が生じ、均一な装
着部が得られないなどの問題点があった。The conventional pellicle attachment method is structured as described above. When attaching the pellicle frame to the photomask substrate with adhesive, it is necessary to apply force during attachment to ensure that the attachment area is uniform without gaps or bubbles. The pellicle frame and the photomask substrate need to be extremely large, and the excessive pressing force applied during mounting causes distortions in the pellicle frame and the photomask substrate, resulting in problems such as the inability to obtain a uniform mounting portion.
この発明は上記のような問題点を解消するためになされ
たもので、装着のため過大な押圧力を加えなくても接着
剤の広がりが均一な装着部を得ることのできるペリクル
装着方法を提供するものである。This invention was made in order to solve the above-mentioned problems, and provides a pellicle attachment method that can obtain a pellicle attachment part in which the adhesive spreads uniformly without applying excessive pressing force for attachment. It is something to do.
この発明に係るペリクル装着方法は、ペリクル枠をフォ
トマスク基板に接着剤を介して装着する際にペリクル枠
を所定の押圧力で所定時間押圧保持する仮装着工程と、
前記工程終了後、一旦前記押圧力を解除してから再度押
圧力を加えて一定時間押圧保持する装着工程とからなる
ものである。The pellicle attachment method according to the present invention includes a temporary attachment step of pressing and holding the pellicle frame with a predetermined pressing force for a predetermined time when attaching the pellicle frame to a photomask substrate via an adhesive;
After the above-mentioned process is completed, the mounting process consists of once releasing the above-mentioned pressing force, applying the pressing force again, and holding the pressing force for a certain period of time.
この発明におけるペリクル装着方法は、ペリクル枠をフ
ォトマスク基板に装着する際に仮装着工程と装着工程の
複数回の押圧力を加えることにより、接着剤の広がり作
用が装着のための押圧力の回数を重ねるごとに徐々に促
され、すきま、気泡等のない均一な状態の装着部を得る
ことができる。The pellicle mounting method of the present invention involves applying a pressing force multiple times during the temporary mounting process and the mounting process when mounting the pellicle frame on the photomask substrate, so that the spreading action of the adhesive is applied the number of times the pressing force is applied for mounting. As the layers are stacked, the mounting portion is gradually strengthened and the mounting portion is in a uniform state without gaps, bubbles, etc.
第1図(A) ’+ (B) 、 (C)はこの発明の
一実施例によるペリクル装着方法の図であり、その構成
としては第2図に示した従来のペリクル装着方法と同様
のものである。FIGS. 1A, 1B, and 1C are diagrams of a pellicle mounting method according to an embodiment of the present invention, and its configuration is similar to the conventional pellicle mounting method shown in FIG. It is.
次に上記のように構成されたこの発明によるペリクル装
着方法について説明する。まず、あらかじめフォトマス
ク基板4を位置決め固定し、ペリクル枠1に所定大きさ
の押圧力を加え、所定時間その押圧力を保持しフォトマ
スク基板4にペリクル枠1を接着剤3により装着する。Next, a pellicle mounting method according to the present invention configured as described above will be explained. First, the photomask substrate 4 is positioned and fixed in advance, a predetermined pressing force is applied to the pellicle frame 1, and the pressing force is maintained for a predetermined period of time to attach the pellicle frame 1 to the photomask substrate 4 with the adhesive 3.
この際、接着剤3が装着時に加えられる押圧力によって
ペリクル枠1とフォトマスク基板4の装着部全面に広が
り、仮装着工程を終了する。次いで一旦装着のための押
圧力を解除し、再度装着のための押圧力を加え、一定時
間保持し、装着工程を完了する。その際、−回目に加え
られた押圧力で接着部全面に接着剤が広がり、二回目に
加えた押圧力によって、接着剤の広がりをすきま、気泡
等なく均一にする。At this time, the adhesive 3 spreads over the entire surface of the mounting portion of the pellicle frame 1 and the photomask substrate 4 due to the pressing force applied during mounting, thereby completing the temporary mounting process. Next, the pressing force for mounting is once released, and the pressing force for mounting is applied again and held for a certain period of time to complete the mounting process. At this time, the pressing force applied the second time spreads the adhesive over the entire surface of the bonded part, and the pressing force applied the second time spreads the adhesive uniformly without gaps or bubbles.
以上のように、この発明によればペリクル枠をフォトマ
スク基板に装着する際に加える押圧力を複数回繰り返し
加えるようにしたので、比較的小さな押圧力ですきま、
気泡等のない均一な装着部が得られやすく、ペリクル外
部からの異物侵入を防止できる。As described above, according to the present invention, since the pressing force applied when attaching the pellicle frame to the photomask substrate is applied repeatedly multiple times, the gap can be reduced with a relatively small pressing force.
It is easy to obtain a uniform attachment part free of air bubbles, etc., and it is possible to prevent foreign matter from entering from outside the pellicle.
第1図(Δ)+ (B)、 (C)はこの発明の一実施
例によるペリクル装着方法を示す図であり、(八)図は
フォトマスク基板にペリクルを装着した状態を示す側面
断面図、(B)図はフォトマスク基板にペリクルを装着
する際の一回目の加え方を示した側面図、(C)図は同
様に二回目の加え方を示した側面図である。第2図(A
) 、 (B)は従来のペリクル装着方法を示す図であ
り、(A)図はフォトマスク基板にペリクルを装着した
状態を示す側面断面図、(B)図はフォトマスク基板に
ペリクルを装着する際の力の加え方を示した側面図であ
る。
1・・・ペリクル枠、2・・・ペリクル膜、3・・・接
着剤、4・・・フォトマスク基板、5・・・フォトマス
クパターン、6・・・フォトマスク位置決め固定治具。
なお図中、同一符号は同一または相当部分を示す。FIGS. 1(Δ)+(B) and (C) are diagrams showing a pellicle mounting method according to an embodiment of the present invention, and FIG. 1(8) is a side cross-sectional view showing a state in which a pellicle is mounted on a photomask substrate. , (B) is a side view showing the first addition of the pellicle to the photomask substrate, and (C) is a side view showing the second addition. Figure 2 (A
), (B) are diagrams showing a conventional pellicle attachment method, (A) is a side sectional view showing a state in which a pellicle is attached to a photomask substrate, and (B) is a diagram showing a state in which a pellicle is attached to a photomask substrate. FIG. 3 is a side view showing how to apply force. DESCRIPTION OF SYMBOLS 1... Pellicle frame, 2... Pellicle film, 3... Adhesive, 4... Photomask substrate, 5... Photomask pattern, 6... Photomask positioning fixture. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
リクル枠とを備えたフォトマスクペリクルを前記フォト
マスク基板に装着するフォトマスクペリクル装着方法に
おいて、前記フォトマスク基板を位置決め固定し、該基
板に接着剤を介して前記ペリクル枠を所定の押圧力で所
定時間押圧保持する仮装着工程と、前記工程終了後一旦
前記押圧力を解除してから再度押圧力を加え一定時間保
持する装着工程とからなるフォトマスクペリクル装着方
法。In the photomask pellicle mounting method of mounting a photomask pellicle including a transparent pellicle film and a pellicle frame mounted on the photomask substrate on the photomask substrate, the photomask substrate is positioned and fixed, and the photomask substrate is bonded to the substrate. It consists of a temporary attachment step in which the pellicle frame is pressed and held for a predetermined period of time with a predetermined pressure force through an agent, and an attachment step in which the pressure force is once released after the completion of the step, and then the pressing force is applied again and held for a certain period of time. How to attach a photomask pellicle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62119218A JPS63284551A (en) | 1987-05-15 | 1987-05-15 | Method for mounting photomask pellicle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62119218A JPS63284551A (en) | 1987-05-15 | 1987-05-15 | Method for mounting photomask pellicle |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63284551A true JPS63284551A (en) | 1988-11-21 |
Family
ID=14755880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62119218A Pending JPS63284551A (en) | 1987-05-15 | 1987-05-15 | Method for mounting photomask pellicle |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63284551A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0752621A1 (en) * | 1995-07-05 | 1997-01-08 | Shin-Etsu Chemical Co., Ltd. | Frame-supported pellicle for photomask protection |
JP2008191656A (en) * | 2007-01-31 | 2008-08-21 | Internatl Business Mach Corp <Ibm> | Pellicle and method (pellicle film optimized for immersion lithography system with na>1) |
US20150129103A1 (en) * | 2013-11-11 | 2015-05-14 | Shin-Etsu Chemical Co., Ltd. | Method for bonding a pellicle, and a bonding apparatus used in this method |
-
1987
- 1987-05-15 JP JP62119218A patent/JPS63284551A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0752621A1 (en) * | 1995-07-05 | 1997-01-08 | Shin-Etsu Chemical Co., Ltd. | Frame-supported pellicle for photomask protection |
US5723860A (en) * | 1995-07-05 | 1998-03-03 | Shin-Etsu Chemical Co., Ltd. | Frame-supported pellicle for photomask protection |
JP2008191656A (en) * | 2007-01-31 | 2008-08-21 | Internatl Business Mach Corp <Ibm> | Pellicle and method (pellicle film optimized for immersion lithography system with na>1) |
US20150129103A1 (en) * | 2013-11-11 | 2015-05-14 | Shin-Etsu Chemical Co., Ltd. | Method for bonding a pellicle, and a bonding apparatus used in this method |
JP2015094800A (en) * | 2013-11-11 | 2015-05-18 | 信越化学工業株式会社 | Method of pasting pellicle and pasting device used in the same |
CN104635420A (en) * | 2013-11-11 | 2015-05-20 | 信越化学工业株式会社 | A method for bonding a dustproof pellicle, and a bonding apparatus used in this method |
US9645487B2 (en) * | 2013-11-11 | 2017-05-09 | Shin-Etsu Chemical Co., Ltd. | Method for bonding a pellicle, and a bonding apparatus used in this method |
KR20210128984A (en) * | 2013-11-11 | 2021-10-27 | 신에쓰 가가꾸 고교 가부시끼가이샤 | A method for bonding a pellicle, and a bonding apparatus used in this method |
EP2871521B1 (en) * | 2013-11-11 | 2023-06-07 | Shin-Etsu Chemical Co., Ltd | Method for bonding a pellicle to a stencil |
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