JPS63284551A - Method for mounting photomask pellicle - Google Patents

Method for mounting photomask pellicle

Info

Publication number
JPS63284551A
JPS63284551A JP62119218A JP11921887A JPS63284551A JP S63284551 A JPS63284551 A JP S63284551A JP 62119218 A JP62119218 A JP 62119218A JP 11921887 A JP11921887 A JP 11921887A JP S63284551 A JPS63284551 A JP S63284551A
Authority
JP
Japan
Prior art keywords
pellicle
pressing force
photomask
mounting
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62119218A
Other languages
Japanese (ja)
Inventor
Shoji Yano
昭二 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62119218A priority Critical patent/JPS63284551A/en
Publication of JPS63284551A publication Critical patent/JPS63284551A/en
Pending legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To obtain a uniform mounting part which has no clearances, air bubbles, etc., with a small pressing force by executing pressurization dividedly plural times in the case of mounting a photomask pellicle frame to a photomask substrate via an adhesive agent under the pressing force exerted thereto. CONSTITUTION:The photomask substrate 4 is previously positioned and fixed and the pressing force of the prescribed magnitude is exerted to the pellicle frame 1 to hold the frame for a prescribed period of time and to adhere the same tentatively by the adhesive agent 3. The adhesive agent is thereby uniformly spread on the adhering surface. The pressing force is then once released and the pressing force for the purpose of remounting is exerted to the frame to hold the frame for the specified period of time, by which the mounting stage is completed. The clearances, air bubbles, etc., of the adhesive agent are eliminated and the uniform mounting part is obtd. by the second time of the pressing.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体の製造装置等に使用するフォトマス
ク基板にフォトマスクペリクルを装着する方法に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a photomask pellicle on a photomask substrate used in semiconductor manufacturing equipment and the like.

〔従来の技術〕[Conventional technology]

従来のフォトマスクペリクル装着方法を第2図(A) 
、 (B)に示す。以下、フォトマスクペリクルをrペ
リクルjと略す。なお第2図(A)はフォトマスク基板
にペリクルを装着した状態を示す側面断面図、第2図(
B)はフォトマスク基板にペリクルを装着する動作にお
ける力の加え方を示した側面図である。両図において、
1はべりタル枠、2はペリクル膜、3は接着剤、4はフ
ォトマスク基板、5はフォトマスクパターン、6はへオ
ドマスク位置決め固定治具である。
Figure 2 (A) shows the conventional photomask pellicle mounting method.
, shown in (B). Hereinafter, the photomask pellicle will be abbreviated as r pellicle j. Note that FIG. 2(A) is a side cross-sectional view showing a state in which a pellicle is attached to a photomask substrate, and FIG.
B) is a side view showing how to apply force in the operation of attaching a pellicle to a photomask substrate. In both figures,
1 is a vertical frame, 2 is a pellicle film, 3 is an adhesive, 4 is a photomask substrate, 5 is a photomask pattern, and 6 is a heodomask positioning fixture.

次に動作について説明する。まず、あらかしめフォトマ
スク基板4を位置決め固定し、ペリクル枠1に所定の押
圧力を加え、所定時間その力を保持しフォトマスク基板
4にペリクル枠1を接着剤3により装着する。
Next, the operation will be explained. First, the staking photomask substrate 4 is positioned and fixed, a predetermined pressing force is applied to the pellicle frame 1, and the force is maintained for a predetermined time to attach the pellicle frame 1 to the photomask substrate 4 with the adhesive 3.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のペリクル装着方法は以上のように構成されており
、ペリクル枠をフォトマスク基板に接着剤により装着す
る際、装着部をすきま、気泡等のない均一なものにする
には装着時に加える力を極めて大きくする必要がありま
た、装着時に加えられる過大な押圧力により、ペリクル
枠およびフォトマスク基板にひずみ等が生じ、均一な装
着部が得られないなどの問題点があった。
The conventional pellicle attachment method is structured as described above. When attaching the pellicle frame to the photomask substrate with adhesive, it is necessary to apply force during attachment to ensure that the attachment area is uniform without gaps or bubbles. The pellicle frame and the photomask substrate need to be extremely large, and the excessive pressing force applied during mounting causes distortions in the pellicle frame and the photomask substrate, resulting in problems such as the inability to obtain a uniform mounting portion.

この発明は上記のような問題点を解消するためになされ
たもので、装着のため過大な押圧力を加えなくても接着
剤の広がりが均一な装着部を得ることのできるペリクル
装着方法を提供するものである。
This invention was made in order to solve the above-mentioned problems, and provides a pellicle attachment method that can obtain a pellicle attachment part in which the adhesive spreads uniformly without applying excessive pressing force for attachment. It is something to do.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るペリクル装着方法は、ペリクル枠をフォ
トマスク基板に接着剤を介して装着する際にペリクル枠
を所定の押圧力で所定時間押圧保持する仮装着工程と、
前記工程終了後、一旦前記押圧力を解除してから再度押
圧力を加えて一定時間押圧保持する装着工程とからなる
ものである。
The pellicle attachment method according to the present invention includes a temporary attachment step of pressing and holding the pellicle frame with a predetermined pressing force for a predetermined time when attaching the pellicle frame to a photomask substrate via an adhesive;
After the above-mentioned process is completed, the mounting process consists of once releasing the above-mentioned pressing force, applying the pressing force again, and holding the pressing force for a certain period of time.

〔作用〕[Effect]

この発明におけるペリクル装着方法は、ペリクル枠をフ
ォトマスク基板に装着する際に仮装着工程と装着工程の
複数回の押圧力を加えることにより、接着剤の広がり作
用が装着のための押圧力の回数を重ねるごとに徐々に促
され、すきま、気泡等のない均一な状態の装着部を得る
ことができる。
The pellicle mounting method of the present invention involves applying a pressing force multiple times during the temporary mounting process and the mounting process when mounting the pellicle frame on the photomask substrate, so that the spreading action of the adhesive is applied the number of times the pressing force is applied for mounting. As the layers are stacked, the mounting portion is gradually strengthened and the mounting portion is in a uniform state without gaps, bubbles, etc.

〔発明の実施例〕[Embodiments of the invention]

第1図(A) ’+ (B) 、 (C)はこの発明の
一実施例によるペリクル装着方法の図であり、その構成
としては第2図に示した従来のペリクル装着方法と同様
のものである。
FIGS. 1A, 1B, and 1C are diagrams of a pellicle mounting method according to an embodiment of the present invention, and its configuration is similar to the conventional pellicle mounting method shown in FIG. It is.

次に上記のように構成されたこの発明によるペリクル装
着方法について説明する。まず、あらかじめフォトマス
ク基板4を位置決め固定し、ペリクル枠1に所定大きさ
の押圧力を加え、所定時間その押圧力を保持しフォトマ
スク基板4にペリクル枠1を接着剤3により装着する。
Next, a pellicle mounting method according to the present invention configured as described above will be explained. First, the photomask substrate 4 is positioned and fixed in advance, a predetermined pressing force is applied to the pellicle frame 1, and the pressing force is maintained for a predetermined period of time to attach the pellicle frame 1 to the photomask substrate 4 with the adhesive 3.

この際、接着剤3が装着時に加えられる押圧力によって
ペリクル枠1とフォトマスク基板4の装着部全面に広が
り、仮装着工程を終了する。次いで一旦装着のための押
圧力を解除し、再度装着のための押圧力を加え、一定時
間保持し、装着工程を完了する。その際、−回目に加え
られた押圧力で接着部全面に接着剤が広がり、二回目に
加えた押圧力によって、接着剤の広がりをすきま、気泡
等なく均一にする。
At this time, the adhesive 3 spreads over the entire surface of the mounting portion of the pellicle frame 1 and the photomask substrate 4 due to the pressing force applied during mounting, thereby completing the temporary mounting process. Next, the pressing force for mounting is once released, and the pressing force for mounting is applied again and held for a certain period of time to complete the mounting process. At this time, the pressing force applied the second time spreads the adhesive over the entire surface of the bonded part, and the pressing force applied the second time spreads the adhesive uniformly without gaps or bubbles.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によればペリクル枠をフォトマ
スク基板に装着する際に加える押圧力を複数回繰り返し
加えるようにしたので、比較的小さな押圧力ですきま、
気泡等のない均一な装着部が得られやすく、ペリクル外
部からの異物侵入を防止できる。
As described above, according to the present invention, since the pressing force applied when attaching the pellicle frame to the photomask substrate is applied repeatedly multiple times, the gap can be reduced with a relatively small pressing force.
It is easy to obtain a uniform attachment part free of air bubbles, etc., and it is possible to prevent foreign matter from entering from outside the pellicle.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(Δ)+ (B)、 (C)はこの発明の一実施
例によるペリクル装着方法を示す図であり、(八)図は
フォトマスク基板にペリクルを装着した状態を示す側面
断面図、(B)図はフォトマスク基板にペリクルを装着
する際の一回目の加え方を示した側面図、(C)図は同
様に二回目の加え方を示した側面図である。第2図(A
) 、 (B)は従来のペリクル装着方法を示す図であ
り、(A)図はフォトマスク基板にペリクルを装着した
状態を示す側面断面図、(B)図はフォトマスク基板に
ペリクルを装着する際の力の加え方を示した側面図であ
る。 1・・・ペリクル枠、2・・・ペリクル膜、3・・・接
着剤、4・・・フォトマスク基板、5・・・フォトマス
クパターン、6・・・フォトマスク位置決め固定治具。 なお図中、同一符号は同一または相当部分を示す。
FIGS. 1(Δ)+(B) and (C) are diagrams showing a pellicle mounting method according to an embodiment of the present invention, and FIG. 1(8) is a side cross-sectional view showing a state in which a pellicle is mounted on a photomask substrate. , (B) is a side view showing the first addition of the pellicle to the photomask substrate, and (C) is a side view showing the second addition. Figure 2 (A
), (B) are diagrams showing a conventional pellicle attachment method, (A) is a side sectional view showing a state in which a pellicle is attached to a photomask substrate, and (B) is a diagram showing a state in which a pellicle is attached to a photomask substrate. FIG. 3 is a side view showing how to apply force. DESCRIPTION OF SYMBOLS 1... Pellicle frame, 2... Pellicle film, 3... Adhesive, 4... Photomask substrate, 5... Photomask pattern, 6... Photomask positioning fixture. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 透明のペリクル膜と、フォトマスク基板に装着されるペ
リクル枠とを備えたフォトマスクペリクルを前記フォト
マスク基板に装着するフォトマスクペリクル装着方法に
おいて、前記フォトマスク基板を位置決め固定し、該基
板に接着剤を介して前記ペリクル枠を所定の押圧力で所
定時間押圧保持する仮装着工程と、前記工程終了後一旦
前記押圧力を解除してから再度押圧力を加え一定時間保
持する装着工程とからなるフォトマスクペリクル装着方
法。
In the photomask pellicle mounting method of mounting a photomask pellicle including a transparent pellicle film and a pellicle frame mounted on the photomask substrate on the photomask substrate, the photomask substrate is positioned and fixed, and the photomask substrate is bonded to the substrate. It consists of a temporary attachment step in which the pellicle frame is pressed and held for a predetermined period of time with a predetermined pressure force through an agent, and an attachment step in which the pressure force is once released after the completion of the step, and then the pressing force is applied again and held for a certain period of time. How to attach a photomask pellicle.
JP62119218A 1987-05-15 1987-05-15 Method for mounting photomask pellicle Pending JPS63284551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62119218A JPS63284551A (en) 1987-05-15 1987-05-15 Method for mounting photomask pellicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62119218A JPS63284551A (en) 1987-05-15 1987-05-15 Method for mounting photomask pellicle

Publications (1)

Publication Number Publication Date
JPS63284551A true JPS63284551A (en) 1988-11-21

Family

ID=14755880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62119218A Pending JPS63284551A (en) 1987-05-15 1987-05-15 Method for mounting photomask pellicle

Country Status (1)

Country Link
JP (1) JPS63284551A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0752621A1 (en) * 1995-07-05 1997-01-08 Shin-Etsu Chemical Co., Ltd. Frame-supported pellicle for photomask protection
JP2008191656A (en) * 2007-01-31 2008-08-21 Internatl Business Mach Corp <Ibm> Pellicle and method (pellicle film optimized for immersion lithography system with na>1)
US20150129103A1 (en) * 2013-11-11 2015-05-14 Shin-Etsu Chemical Co., Ltd. Method for bonding a pellicle, and a bonding apparatus used in this method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0752621A1 (en) * 1995-07-05 1997-01-08 Shin-Etsu Chemical Co., Ltd. Frame-supported pellicle for photomask protection
US5723860A (en) * 1995-07-05 1998-03-03 Shin-Etsu Chemical Co., Ltd. Frame-supported pellicle for photomask protection
JP2008191656A (en) * 2007-01-31 2008-08-21 Internatl Business Mach Corp <Ibm> Pellicle and method (pellicle film optimized for immersion lithography system with na>1)
US20150129103A1 (en) * 2013-11-11 2015-05-14 Shin-Etsu Chemical Co., Ltd. Method for bonding a pellicle, and a bonding apparatus used in this method
JP2015094800A (en) * 2013-11-11 2015-05-18 信越化学工業株式会社 Method of pasting pellicle and pasting device used in the same
CN104635420A (en) * 2013-11-11 2015-05-20 信越化学工业株式会社 A method for bonding a dustproof pellicle, and a bonding apparatus used in this method
US9645487B2 (en) * 2013-11-11 2017-05-09 Shin-Etsu Chemical Co., Ltd. Method for bonding a pellicle, and a bonding apparatus used in this method
KR20210128984A (en) * 2013-11-11 2021-10-27 신에쓰 가가꾸 고교 가부시끼가이샤 A method for bonding a pellicle, and a bonding apparatus used in this method
EP2871521B1 (en) * 2013-11-11 2023-06-07 Shin-Etsu Chemical Co., Ltd Method for bonding a pellicle to a stencil

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