JPS61121453A - Braking and expanding process of fragile thin sheet - Google Patents

Abstract

PURPOSE:To make it feasible to perform braking and expanding process simultaneously preventing any damage to fine pattern on wafer surface from occuring by a method wherein a sheet bonded with wafers is pressurized with fruid from backside of the wafer bonded surface. CONSTITUTION:Scribed or diced wafers are bonded on the surface of a bonding sheet 2 and while the sheet 2 is held by ring 7 to be located on the position wherein wafers are encircled by the sheet holding ring 7, the space sealed with the sheet 2 is filled with compressed air. Then chips 6 are braked by stress concentration on braling line due to the expansion of sheet 2 as well as the even pressure on the backside of sheet 2 and simultaneously the sheet 2 is expanded spherically. Next an expanding and holding ring -10 is lifted to make the chip bonding plane flat. Through these procedures, braking and expanding process may be performed efficiently bringing nothing into contact with the wafer surfaces since the backside of wafer bonded surface of bonding sheet 2 is pressurized with compressed air.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to breaking and expanding a brittle thin plate (hereinafter referred to as a wafer) that has been subjected to scribing or dicing processing in a method of manufacturing semiconductor devices or surface acoustic wave filters. It is about the method.

BACKGROUND OF THE INVENTION Conventionally, this type of machining fP: C, break and expand have been performed as separate operations.

That is, as shown in FIG. 3(m), the surface of the wafer 1 opposite to the scribed or diced surface is bonded to the adhesive sheet 2, the processed surface is further covered with the protective sheet 3, and the rubber Place it on an elastic plate 4 such as a board. Then, force is applied from the adhesive sheet 2 side using a roller 5 or the like to perform braking by concentrating stress on the breaking line.

The wafer 1 is broken into chips by moving the roller 6 under pressure not only in the direction shown but also in a direction perpendicular thereto.

Next, as shown in FIG. The sheet is pushed up by the flat plate 8 to stretch the sheet, and in this state, the sheet and the flat plate 8 are held on the outer circumferential surface of the flat plate 8 with an O-ring 9, etc., and expanded and I/
'do.

Problems to be Solved by the Invention In these cases, as shown in FIG. Moreover, there is also the problem that fine wafer fragments generated during breaking during the process of applying pressure with rollers can get between the protective plate 3 and the pattern surface of the wafer, damaging the pattern. there was.

Furthermore, the fact that breaking and expanding were performed as separate operations was not a good idea in terms of equipment cost and workability.

The present invention eliminates the drawbacks of such conventional methods, prevents damage to fine patterns on the wafer surface, and
The overall purpose is to combine two tasks into one and streamline them.

Means for Solving the Problems In order to achieve this object, the present invention applies pressure to a sheet with a wafer pasted thereon using fluid from the side opposite to the wafer pasting side, thereby making the sea urchin pasted on the sheet.・・Braking is performed by applying stress intensively to the breaking line portion of the wafer without bringing other objects into contact with the surface, and then the entire expansion is performed.

Effect: With this configuration, the fine pattern on the wafer surface is not damaged in any way, and the process yield of surface acoustic wave filters and the like on which patterns are formed can be significantly improved without the surface being covered with a protective coating. , further −
A streamlining effect can be obtained by consolidating two tasks in a slow operation.

Embodiment One embodiment of the present invention will now be described with reference to FIG. 1. In FIG. 1, the same parts as in FIG. 2 are given the same numbers. FIG. 1 (Bl is a diagram showing a state in which the expanded notebook 2 shown in FIG. ,
While holding this sheet 2 by the ring 7 so that the wafer is located in the area surrounded by the sheet holding ring 7, all the compressed air is fed into the space closed by the sheet 2, and the sheet 2 is The sheet 2 expands into a spherical shape at the same time as the chip 6 is broken due to the stress concentration on the breaking line due to the force caused by the stretching and the pressure being evenly applied to the back surface of the notebook 2.

Next, the expansion holding ring 10 is raised to make the chip attachment surface of the sheet 2 flat. In that state, the expansion retaining ring 10
A Q IJ ring 9 is attached to the groove provided in the seat 2 to hold the sheet 2 in the expanded state.

In this way, by applying pressure with pressurized air from the side of the adhesive sheet 2 opposite to the surface to which the sea urchin is attached, breaking and expanding can be performed without any contact with the surface of the sea urchin. Effects of the Invention As described above, according to the method of the present invention, it is possible to make chips without touching the patterned surface of the sea urchin, and the fine pattern on the surface of the sea urchin is free from damage such as pattern breakage and adhesion of dust. This has the effect that the two operations of breaking and expanding can be easily performed in series without giving any problems.

[Brief explanation of the drawing]

FIG. 1 (Al is a sectional view showing a wafer breaking/expanding method according to an embodiment of the method of the present invention; FIG.
Bl is a cross-sectional view showing the holding state at the end of expansion stage.
FIG. 3 is a cross-sectional view showing an expanding method. 2... Adhesive sheet, 6... Chip, 7
... Seat retaining ring, 9...0 ring, 10... Expansion retaining ring. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure (A) (B) Figure 2 (Hano (B)

Claims (1)

[Claims] The processed side of a scribed or diced brittle thin plate is pasted on one side of an adhesive sheet, and fluid pressure is applied to the other side of the adhesive sheet to brake the brittle thin plate. A method for breaking and expanding a brittle thin plate, which is characterized by concentrating stress on the lining portion to perform breaking and expanding at the same time.