JPS62284707A - Wafer breaking device - Google Patents

Wafer breaking device

Info

Publication number
JPS62284707A
JPS62284707A JP12896086A JP12896086A JPS62284707A JP S62284707 A JPS62284707 A JP S62284707A JP 12896086 A JP12896086 A JP 12896086A JP 12896086 A JP12896086 A JP 12896086A JP S62284707 A JPS62284707 A JP S62284707A
Authority
JP
Japan
Prior art keywords
breaking device
wafer breaking
wafer
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12896086A
Inventor
Bunichi Kasai
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP12896086A priority Critical patent/JPS62284707A/en
Publication of JPS62284707A publication Critical patent/JPS62284707A/en
Application status is Pending legal-status Critical

Links

JP12896086A 1986-06-03 1986-06-03 Wafer breaking device Pending JPS62284707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12896086A JPS62284707A (en) 1986-06-03 1986-06-03 Wafer breaking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12896086A JPS62284707A (en) 1986-06-03 1986-06-03 Wafer breaking device

Publications (1)

Publication Number Publication Date
JPS62284707A true JPS62284707A (en) 1987-12-10

Family

ID=14997668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12896086A Pending JPS62284707A (en) 1986-06-03 1986-06-03 Wafer breaking device

Country Status (1)

Country Link
JP (1) JPS62284707A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243804A (en) * 2010-05-19 2011-12-01 Disco Abrasive Syst Ltd Dividing device for plate-like body
JP2012099558A (en) * 2010-10-29 2012-05-24 Akita Shindengen:Kk Device and method for dividing wafer
JP2012160711A (en) * 2011-02-01 2012-08-23 Samsung Electronics Co Ltd Wafer dicing press apparatus and semiconductor wafer dicing system using wafer dicing press apparatus
JP2016076546A (en) * 2014-10-03 2016-05-12 株式会社ディスコ Division device
JP2018117130A (en) * 2012-12-31 2018-07-26 サンエディソン・セミコンダクター・リミテッドSunEdison Semiconductor Limited Device for applying stress to semiconductor substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243804A (en) * 2010-05-19 2011-12-01 Disco Abrasive Syst Ltd Dividing device for plate-like body
JP2012099558A (en) * 2010-10-29 2012-05-24 Akita Shindengen:Kk Device and method for dividing wafer
JP2012160711A (en) * 2011-02-01 2012-08-23 Samsung Electronics Co Ltd Wafer dicing press apparatus and semiconductor wafer dicing system using wafer dicing press apparatus
US9252055B2 (en) 2011-02-01 2016-02-02 Samsung Electronics Co., Ltd. Wafer dicing press and method and semiconductor wafer dicing system including the same
JP2018117130A (en) * 2012-12-31 2018-07-26 サンエディソン・セミコンダクター・リミテッドSunEdison Semiconductor Limited Device for applying stress to semiconductor substrate
US10361097B2 (en) 2012-12-31 2019-07-23 Globalwafers Co., Ltd. Apparatus for stressing semiconductor substrates
JP2016076546A (en) * 2014-10-03 2016-05-12 株式会社ディスコ Division device

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