JPS59139645A - Supporter for wafer - Google Patents
Supporter for waferInfo
- Publication number
- JPS59139645A JPS59139645A JP58012727A JP1272783A JPS59139645A JP S59139645 A JPS59139645 A JP S59139645A JP 58012727 A JP58012727 A JP 58012727A JP 1272783 A JP1272783 A JP 1272783A JP S59139645 A JPS59139645 A JP S59139645A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- main body
- tape
- support
- adhesive strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は半導体ウェーハの支持装置に関し、特にウェー
ハの切断やダイレクトピックアップを行なう場合に使用
する治具に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor wafer support device, and more particularly to a jig used for cutting or directly picking up a wafer.
半導体装置の製造工程にあっては、半導体ウェーハに形
成した回路素子を各単位毎に切断してペレット化すると
共に、切断された各ベレットを一つずつ取部上げてこれ
をパッケージベース上に固着する工程が必要とされる。In the manufacturing process of semiconductor devices, circuit elements formed on a semiconductor wafer are cut into units and made into pellets, and each cut pellet is picked up one by one and fixed onto a package base. A process is required.
この場合、近年では処理の自動化を図るために、ウェー
ハを支持装置上に支持させ、この支持状態のままでウェ
ーハの切断、ベレットの取部上げ（ピックアップ）を行
なう方法が採用されている。In this case, in recent years, in order to automate the process, a method has been adopted in which the wafer is supported on a support device, and the wafer is cut and the pellet is picked up while being supported.
第１図は、この種の工程を行なうためのウェーハ支持装
置１であシ、ウェーハ２の外径寸法よシも大きな内径寸
法を有する環状の本体３０片面に支持テープ４を貼着し
、かっこの支持テープの上面（内面）には取着テープ５
を用いてウェーハ２を支持させるようになっている。そ
して、ウェーハ２の切断時には支持装置１全体をダイシ
ング装置にセットしてウェーハ２を取着テープ５と共に
完全切断し、ベレットのピックアップ時には支持装置の
下方から各ベレットを１個ずつ突き上げると共に所定の
コレットにてそのベレットを上方から吸着させ、取着テ
ープ５がら剥すようにしてベレットを取部上げている。FIG. 1 shows a wafer support device 1 for carrying out this type of process. A support tape 4 is attached to one side of an annular main body 30 having an inner diameter larger than the outer diameter of a wafer 2. Attachment tape 5 is attached to the top (inner surface) of the support tape.
The wafer 2 is supported using the wafer 2. When cutting the wafer 2, the entire supporting device 1 is set in a dicing device to completely cut the wafer 2 together with the mounting tape 5. When picking up the pellets, each pellet is pushed up one by one from below the supporting device and placed in a predetermined collet. The pellet is suctioned from above with a holder, and the attaching tape 5 is peeled off to remove the pellet.
このため、この作業を有効に行なうためにはウェーハ２
を支持装置ｌに一時的に支持させる前記取着テープ５に
は接着ヵの弱いものが要求され、また取着テープ５を支
持装置、特に本体３に支持させる支持テープ４は前述し
た作業によっても支持が損なわれないような接着力の強
いものが要求されることになる。Therefore, in order to perform this work effectively, it is necessary to
The attachment tape 5 that temporarily supports the attachment tape 5 on the support device 1 is required to have a weak adhesive strength, and the support tape 4 that supports the attachment tape 5 on the support device, especially the main body 3, cannot be used by the above-mentioned work. A strong adhesive is required so that the support is not impaired.
したがって、前述した従来の支持装置では、強。Therefore, the above-mentioned conventional support device is not strong enough.
弱の各接着力を有する２種類のテープが必要とされると
共に、本体３に支持テープ４を貼る工程、ウェーハ２に
取着テープ５を貼る工程および両テープ４，５を貼シ合
わせる工程と３つの作業が必要とされる等、部ｎ点数が
多くなると共にウェーハ支持作業が面倒になるという不
具合がある。Two types of tapes having weak adhesive strength are required, and the process includes a step of attaching the support tape 4 to the main body 3, a step of attaching the attachment tape 5 to the wafer 2, and a step of attaching both tapes 4 and 5. There are problems in that the number of parts increases and the wafer supporting work becomes troublesome, such as three operations being required.
したがって本発明の目的はウェーハ支持用のテープを１
種類のものにして部品点数の低減化を図ると共に、ウェ
ーハ支持作業の簡略化を図ることができるウェーハ支持
装置を提供することにある。Therefore, an object of the present invention is to provide a tape for supporting wafers in one piece.
It is an object of the present invention to provide a wafer support device that can reduce the number of parts and simplify the wafer support operation.
この目的を達成するために本発明は、接着力の弱い支持
テープを強接着力の接着材にて本体に貼着する一方、ウ
ェーハをこの支持テープに直接取着するようにしたもの
である。In order to achieve this object, the present invention is such that a support tape with weak adhesive strength is adhered to the main body using an adhesive with strong adhesive strength, and the wafer is directly attached to this support tape.
以下、本発明を図示の実施例によシ説明する。Hereinafter, the present invention will be explained with reference to illustrated embodiments.
第２図及び第３図は本発明の一実施例を示し、ウェーハ
支持装置１１は、ウェーハ１２の外径寸法よυも大きな
内径寸法を有する環状でかつ板状の本体１３を有してい
る。この本体１３は外周一部に切勿き１．３ａを有し、
ダイシングやピックアップ時の位置決め用に利用される
。前記本体１３の下面には円形の支持テープ１４をその
周辺部において貼着している。この支持テープ１４は弱
い接着力のものが使用されておシ、前記本体１３の下面
に付着した強い接着力を有する接着材１６によって本体
１３に貼着している。また、ウェーハ１２は前記本体１
３の中心位置において前記支持テープ１４上面に直接貼
着支持されている。2 and 3 show an embodiment of the present invention, in which the wafer support device 11 has an annular and plate-like main body 13 having an inner diameter larger than the outer diameter of the wafer 12. . This main body 13 has a cutout 1.3a on a part of the outer periphery,
Used for positioning during dicing and pickup. A circular support tape 14 is attached to the lower surface of the main body 13 around its periphery. This supporting tape 14 is made of a material with a weak adhesive strength, and is attached to the main body 13 by an adhesive 16 having a strong adhesive strength attached to the lower surface of the main body 13. Further, the wafer 12 is
3 is directly adhered and supported on the upper surface of the support tape 14.
なお、前記構成におけるウェーハ１２の支持作業工程を
第４図囚〜（Ｑに示す。図示のように、先ず本体１３の
下面に強い接着力の接着材１６を塗布しく４）、次いで
弱い接着力の支持テープ１４をその接着面を上に向けて
本体１３下面に接着し、前記接着材１６によシ強固に接
着する（Ｂ）。その上で、支持テープ１４の上面にウェ
ーハ１２を接着する（Ｑことによシ第２図、第３図に示
す構成を完成することができる。The process of supporting the wafer 12 in the above configuration is shown in FIGS. The supporting tape 14 is adhered to the lower surface of the main body 13 with its adhesive side facing upward, and firmly adhered with the adhesive 16 (B). Thereafter, the wafer 12 is bonded to the upper surface of the support tape 14 (Q, in particular, the structure shown in FIGS. 2 and 3 can be completed.
以上の構成によれば、支持テープ１４は強い接着力の接
着材によって本体１３に強固に取着される一方でウェー
ノ・１２を弱い接着力にて支持することになる。したが
って、ウェーノＳ１２のダイシング時に加えられる力が
ウェー７％乃至支持テープに作用しても支持テープ１４
が本体１３から脱落されることはなく、ウェーノーを強
固に支持してダイシングを完了させる。一方、ダイシン
グによ多形成された複数個のペレツ、トのピックアップ
時には、各ベレットは支持テープ１４から剥されること
になるが、支持テープ１４自身の接着力は弱いためにペ
レットのピックアップを容易に行なうことができる。こ
れによシ、１種類（１枚）のテープを使用するだけで所
定の要件を全て満足させることができ、従来装置に較べ
て部品点数の低減を図ることができる。According to the above configuration, the support tape 14 is firmly attached to the main body 13 by an adhesive with a strong adhesive force, while supporting the Waeno 12 with a weak adhesive force. Therefore, even if the force applied during dicing of Waeno S12 acts on the wafer 7% or the support tape, the support tape 14
does not fall off from the main body 13, and firmly supports the wafer to complete dicing. On the other hand, when picking up a plurality of pellets formed by dicing, each pellet is peeled off from the support tape 14, but since the adhesive force of the support tape 14 itself is weak, it is easy to pick up the pellets. can be done. As a result, all the predetermined requirements can be satisfied by using only one type (one piece) of tape, and the number of parts can be reduced compared to conventional devices.
また、一方では前記支持装置にウェー、ノ・を支持させ
る作業工程は、１枚の支持テープ１４を本体１３に貼着
する工程と、この支持テープ上にウェーハ１２を貼着す
る工程の２つの工程でおることから、従来よυも１工程
だけ低減でき、それだけつ工−ハ支持作業の簡略化を図
ることができるのである。On the other hand, the work process of supporting the wafer on the support device includes two steps: attaching one support tape 14 to the main body 13, and attaching the wafer 12 on this support tape. Since it is a process, υ can be reduced by one process compared to the conventional method, and the support work for the machine can be simplified accordingly.
ここで、接着力の強い接着材は支持テープの周辺に塗布
しておき、これを本体に接着させるようにしてもよい。Here, an adhesive with strong adhesive strength may be applied around the support tape and then adhered to the main body.
また１本体はウェーノ・よシ犬径寸法であればよく環状
のものに限定されない。Further, the main body is not limited to an annular shape as long as it has a diameter of 100 mm or 100 mm.
以上のように本発明のウェーノ・支持装置は、弱い接着
力の支持テープを強い接着力の接着材にて本体に貼着す
る一方、支持テープ上にウェーノ・を直接貼着した構成
としているので、従来装置に比較してテープ数の低減を
図ることができると共に、ウェーハの支持作業工程数を
低減して作業の簡略化を達成することができるという効
果を奏する。As described above, the waeno support device of the present invention has a structure in which a support tape with a weak adhesive force is attached to the main body using an adhesive with a strong adhesive force, and a waeno wafer is attached directly onto the support tape. This has the effect that the number of tapes can be reduced compared to the conventional apparatus, and the number of wafer supporting work steps can be reduced to simplify the work.
第１図は従来装置の断面図、
第２図は本発明装置の破断斜視図。
第３図はその断面図、
第４図（８）〜（Ｃ）は支持作業の工程図である。
１１・・・ウェーハ支持装置、１２・・・ウェーハ、１
３・・・本体、１４・・・支持テープ、１６・・・接着
材。
第 １ 図
第 ２ 図
／２
第 ３ 図
／／
／４
第 ４ 図
（４）
／ゲFIG. 1 is a sectional view of a conventional device, and FIG. 2 is a cutaway perspective view of the device of the present invention. FIG. 3 is a sectional view thereof, and FIGS. 4 (8) to (C) are process diagrams of supporting work. 11... Wafer support device, 12... Wafer, 1
3...Main body, 14...Supporting tape, 16...Adhesive material. Figure 1 Figure 2 /2 Figure 3 // /4 Figure 4 (4) /Ge
Claims (1)
におけるウェーハの支持装置であって、ウェーハよシ犬
径寸法の本体に接着力の弱い支持テープを接着力の強い
接着材にて貼着すると共に、この支持テープにはウェー
ハを直接貼着したことを特徴とするウェーハ支持装置。 ２、本体の下面に支持テープを貼着し、この支持テープ
の上面にウェーハを貼着してなる特許請求の範囲第１項
記載のウェーハ支持装置。[Scope of Claims] l. A wafer support device during each process of dicing and pellet pickup, in which a support tape with weak adhesive strength is attached to a main body with a diameter similar to that of the wafer using an adhesive with strong adhesive strength. A wafer support device characterized in that a wafer is attached directly to the support tape. 2. The wafer support device according to claim 1, wherein a support tape is attached to the lower surface of the main body, and a wafer is attached to the upper surface of this support tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58012727A JPS59139645A (en) | 1983-01-31 | 1983-01-31 | Supporter for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58012727A JPS59139645A (en) | 1983-01-31 | 1983-01-31 | Supporter for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59139645A true JPS59139645A (en) | 1984-08-10 |
Family
ID=11813465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58012727A Pending JPS59139645A (en) | 1983-01-31 | 1983-01-31 | Supporter for wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59139645A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0715341A1 (en) * | 1994-11-29 | 1996-06-05 | LINTEC Corporation | Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| EP0786802A3 (en) * | 1996-01-22 | 1999-06-09 | Texas Instruments Japan Ltd. | Wafer dicing/bonding sheet and process for producing semiconductor device |
| JP2021034492A (en) * | 2019-08-21 | 2021-03-01 | 株式会社ディスコ | Annular frame |
-
1983
- 1983-01-31 JP JP58012727A patent/JPS59139645A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0715341A1 (en) * | 1994-11-29 | 1996-06-05 | LINTEC Corporation | Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| EP0786802A3 (en) * | 1996-01-22 | 1999-06-09 | Texas Instruments Japan Ltd. | Wafer dicing/bonding sheet and process for producing semiconductor device |
| JP2021034492A (en) * | 2019-08-21 | 2021-03-01 | 株式会社ディスコ | Annular frame |
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