JPH07122583A - Manufacture of semiconductor device and semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To expand a piece of tape, to which a semiconductor wafer is bonded, smoothly and securely between chips with regard to the manufacturing method of a semiconductor device including a step for supplying the chip obtained by dicing from the semiconductor wafer in the manufacture of a semiconductor. CONSTITUTION:A piece of tape 13, which is held with a wafer ring 12, is supported and fixed with a ring holder 24a and a clamper 25. The tape 13 is pushed to a bearing roller 32 of an expanding pawl 23 and elongated in this constitution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device including a step of supplying chips diced from a semiconductor wafer in semiconductor manufacturing.

In recent years, the number of semiconductor chips formed on one semiconductor wafer tends to increase due to the high integration and miniaturization of semiconductor chips. In dicing this semiconductor chip, it is necessary to prevent damage to adjacent semiconductor chips when picking up one chip from a semiconductor wafer.

[0003]

2. Description of the Related Art FIG. 4 is an explanatory view of a semiconductor wafer.
In FIG. 4A, a polyimide or acrylic tape 13 is bonded and fixed to the wafer ring 12 around the circumference of the wafer ring 12 for holding the semiconductor wafer 11.
Then, the semiconductor wafer 11 which has been subjected to a predetermined process is adhered and fixed onto the tape 13 in the wafer ring 12.

This semiconductor wafer 11 is cut along a scribe line by a dicing device. The cutting is a so-called full-cut method, in which the semiconductor wafer 11 is completely cut and the tape 13 is cut halfway to be separated into individual semiconductor chips 11a. Then, in this state, it is supplied to the die bonding apparatus.

In the die bonding apparatus, the tape 13
The upper semiconductor chips 11a are individually picked up and die-attached, for example, on a stage of a lead frame. At the time of picking up in this case, the tape 13 is extended as shown in FIG. 4B to secure the distance between the semiconductor chips 11a in order to protect the adjacent semiconductor chips from damage.

FIG. 5 shows an explanatory view of a conventional tape expansion method. In FIG. 5A, a cylindrical expansion claw 15 is provided on the base 14, and a frame-shaped vertically movable pressing portion 16 is arranged above the expansion claw 15.

Then, when the wafer ring 12 shown in FIG. 4A is positioned on the expansion claw 15 and the pressing portion 16 descends to press the wafer ring 12, the tape as shown in FIG. 5B is obtained. 13 is extended by the extension claw 15 and is shown in FIG.
As shown in (B), a gap is formed between the semiconductor chips 11a.

In this case, the tape 13 is formed by forming the outer peripheral portion of the tip of the expansion claw 15 into a curved shape (curvature R) and subjecting this portion to a smooth surface treatment to reduce friction.
It relieves the local stress on the top.

[0009]

However, the adhesive strength of the tape 13 is generally determined corresponding to the semiconductor wafer 11, and in the expansion method shown in FIG. 5, the adhesive strength between the wafer ring 12 and the tape 13 is determined. When the strength is insufficient or unstable, there is a problem that the tape 13 is peeled off from the wafer ring 12.

Further, although the tip of the expansion claw 15 has a curved shape, cracks may occur depending on the material of the tape 13,
There is a problem that smooth expansion cannot be performed.

Further, the tape 13 is stretched most at the portion of the expansion claw 15, and the tape 13 between the expansion claw 15 and the wafer ring 12 due to the frictional resistance with the expansion claw 15.
There is a problem that the tape 13 is easily peeled off from the wafer ring 12 due to an increase in the elongation rate of the tape.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a method of manufacturing a semiconductor device in which a tape to which a semiconductor wafer is bonded is smoothly and surely expanded between chips.

[0013]

In order to solve the above problems, a step of dicing a semiconductor wafer adhered and fixed to an adhesive member held by a holder and supplying each semiconductor chip for dicing In a method of manufacturing a semiconductor device including: a step of supporting and fixing a holding portion of the adhesive member in the holding portion to a pressing portion, and a step of arranging the adhesive member corresponding to an outer portion of the semiconductor wafer of the adhesive member. A gap is formed between the semiconductor chips by pressing the adhesive member while the rotating member is being rotated by the pressing portion against the expansion portion provided with the rotating member at the contact portion.

Further, in a semiconductor device in which this manufacturing method is mounted, a pressing portion, a support portion for supporting and fixing the holding portion of the adhesive member in the holding portion to the pressing portion, and the adhesive member by the pressing portion. It is made to be stretched, and it is arranged corresponding to the outer portion of the semiconductor wafer of the adhesive member, and is constituted by an expansion portion provided with a rotating member at the contact portion of the adhesive member.

[0015]

As described above, the adhesive member held by the holding unit is supported and fixed to the pressing unit by the supporting unit, and the adhesive member is extended by being pressed by the expansion unit to form a gap between the semiconductor chips. It is formed. That is, since the adhesive member is supported and fixed by the supporting portion, it is possible to prevent the adhesive member from peeling off from the holding portion regardless of the adhesive strength.

Further, since the rotating member is provided at the contacting portion of the adhesive member in the expanded portion, the stress applied when the adhesive member is stretched is diffused, and it is possible to spread it evenly.

As described above, it is possible to smoothly and surely expand the space between the chips to which the semiconductor wafer is bonded.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a block diagram of an embodiment of the present invention.
FIG. 1 shows a tape stretching device as a semiconductor manufacturing device in semiconductor manufacturing. In addition, in the figure, the semiconductor wafer portion is the same as that in FIG.

That is, in FIG. 1, a semiconductor wafer 11 is adhesively fixed to a tape 13 which is an adhesive member made of polyimide or acrylic and is adhesively held in a wafer ring 12 which is a donut-shaped holding portion. The device is diced into a predetermined number of semiconductor chips 11a (full-cut method).

In FIG. 1, the tape stretching device 21 has an expansion claw 23 (FIG. 2) which is an expansion part on a base 22.
Will be described). The expansion claw 23 is arranged so as to abut the outer portion of the tape 13 on the semiconductor wafer 11. Above the expansion claw 23, the ring holder 2 that is a frame-shaped pressing portion that can be moved up and down by an air cylinder or the like.
4 are arranged. A clamper 25, which is a support portion, is provided below the ring holder 24.

Here, FIG. 2 shows an explanatory view of the expansion claw of the present invention. 2 (A) and 2 (B) show different types of expansion claws. In FIG. 2 (A), the expansion claw 23 _A is provided at the tip of the cylindrical member 31 with the bearing roller 3 which is a rotating member.
Reference numeral 2 is a substantially annularly-arranged unit. The outer shape of the bearing roller 32 is a curved surface having a curvature R like the tip of the expansion claw in FIG. 5, and is rotatably provided in the annular inner and outer directions of the cylindrical member 31.

In this case, the gap between the bearing rollers 32 is smaller than the diameter of the bearing roller 32.

For example, when the target is a 6-inch semiconductor wafer 11, the expansion claw 23 _A is formed on the cylindrical member 31 with an inner diameter of about 200 mmφ. In FIG. 1, this expansion claw 23
_The case where _A is adopted is shown.

Further, the expansion claw 23 _B shown in FIG.
Along the square tube member 33, axially long bearing rollers 34 are arranged in a substantially annular shape. The outer shape of the bearing roller 34 is a curved surface having a curvature R as described above, and is rotatably provided in the annular inner and outer directions. In this case, the four corners are unnecessary and have a deleted shape.

Although the bearing rollers are arranged in a substantially circular shape or a quadrangular shape in FIGS. 2A and 2B, it goes without saying that they may be arranged in a polygonal shape.

Therefore, FIG. 3 shows an operation explanatory diagram of FIG. In FIG. 3A, first, the wafer ring 12 is held by the ring holder 24, and the holding portion of the wafer ring 12 and the tape 13 is supported and fixed to the ring holder 24 by the clamper 25.

Then, when the ring holder 24 is lowered, it is brought into contact with the bearing roller 32 on the extended claw 23 (23 _A ) on the outer side portion of the tape 13 on the semiconductor wafer 11, as shown in FIG. 3B. Tape 1 by further pressing
3 is stretched radially. As a result, a gap is formed between the semiconductor chips 11a of the semiconductor wafer 11 (see FIG. 4B).

In this way, the tape 13 is attached to the wafer ring 1
Since the taper 13 is clamped by the clamper 25, the taper 13 is reliably supported and fixed regardless of the adhesive strength of the taper 13, and the tape 13 can be prevented from peeling off from the wafer ring 12.

In addition, the bearing roller 3 is stretched.
Since the tape 2 rotates, the stress applied to the tape 13 is diffused, and the tape 13 can be stretched radially in a uniform manner.
Concentration of stress on the joining portion of is reduced and peeling of the tape 13 can be prevented. That is, the tape 13 can be smoothly and surely expanded between chips.

Then, the semiconductor wafer 1 in such a state
1 is transferred to a die bonding apparatus, and the semiconductor chips 11a on the tape 13 are individually picked up and, for example, diced onto a stage of a lead frame. In this case, it is possible to prevent the adjacent semiconductor chip 11a from being damaged when the predetermined semiconductor chip 11a is picked up.

[0031]

As described above, according to the present invention, the adhesive member held by the holding unit is supported and fixed to the pressing unit by the supporting unit, and the adhesive member is pressed by the rotating member on the expansion unit. By stretching and forming a gap between the semiconductor chips, the adhesive member to which the semiconductor wafer is bonded can be smoothly and surely expanded between the chips.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is an explanatory view of the expansion claw of the present invention.

FIG. 3 is an operation explanatory diagram of FIG. 1.

FIG. 4 is an explanatory diagram of a semiconductor wafer.

FIG. 5 is an explanatory diagram of a conventional tape expansion method.

[Explanation of symbols]

11 Semiconductor Wafer 11a Semiconductor Chip 12 Wafer Ring 13 Tape 21 Tape Extending Device 22 Base 23, 23 _A , 23 _B Expansion Claw 24 Ring Holder 25 Clamper 31 Cylindrical Member 32, 34 Bearing Roller 33 Square Tube Member

Claims (3)

[Claims] 1. A step of dicing a semiconductor wafer (11) adhered and fixed to an adhesive member (13) held by a holder (12) and supplying each semiconductor chip (11a) for dicing. A method of manufacturing a semiconductor device including: a step of supporting and fixing a holding portion of the holding member (12) of the adhesive member (13) to a pressing portion (24); and the semiconductor wafer (11) of the adhesive member (13). ), Which is arranged corresponding to the outer part of the adhesive member (13), and the rotary member (32, 34) is provided at the contact portion of the adhesive member (13).
3, 23 _A , 23 _B ), while rotating the rotating member (32, 34) by the pressing portion (24), the adhesive member (1
3) Pressing to form a gap between the semiconductor chips (11a), the method for manufacturing a semiconductor device. 2. When dicing a semiconductor wafer (11) adhered and fixed to an adhesive member (13) held by a holding portion (12) and supplying each semiconductor chip (11a) for dicing. In a semiconductor manufacturing apparatus in which the adhesive member (13) is stretched to form a gap between the semiconductor chips (11a), a pressing portion (24) and a holding portion (12) of the adhesive member (13) are provided. Supporting part (25) for supporting and fixing the holding part to the pressing part (24)
And a pressure member (24) for extending the adhesive member (13), the adhesive member (13) being disposed corresponding to an outer portion of the semiconductor wafer (11). An expansion part (23, 23 _A , 23 _B ) provided with a rotating member (32, 34) at an abutting part of (13), and a semiconductor manufacturing apparatus characterized by the following. 3. The rotating member (32, 34) of the extension portion (23, 23 _A , 23 _B ) is provided with the extension portion (23, 23).
_A predetermined number of rollers (32, 3) arranged in an annular shape at a tip portion of _A , 23 _B ) and rotatable in the annular inner and outer directions.
4. The semiconductor manufacturing apparatus according to claim 2, which is constituted by 4).