JPS6031918A - Adhesive sheet for dicing semiconductor wafer - Google Patents
Adhesive sheet for dicing semiconductor waferInfo
- Publication number
- JPS6031918A JPS6031918A JP58140087A JP14008783A JPS6031918A JP S6031918 A JPS6031918 A JP S6031918A JP 58140087 A JP58140087 A JP 58140087A JP 14008783 A JP14008783 A JP 14008783A JP S6031918 A JPS6031918 A JP S6031918A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive sheet
- grade
- dicing
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
イ 産業上の利用分針
この発明は＊＆の半導体素子を格子状配列でｆＮ威した
牛４体りエーハを半導体素子毎にｗ４＃割するＫ１１し
てグイシング時に牛導体りエーハを接着する半導体クエ
ーハダイシング用接着シートに関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Minute Hand This invention is a method for dividing *& semiconductor elements into fN in a lattice-like arrangement by dividing w4# for each semiconductor element. This invention relates to an adhesive sheet for semiconductor wafer dicing that adheres wafers.
！ 従来技術
″１’４体クエーハ（以下単にクエーノ・と祢す）を４
１故の半導体素子（以下率に素子と称す）毎に細分割す
るダイシング方法にはクエーハ倉グイシング用チャック
テーブル上に固定してクエーハ上の灸素子間をクエーー
厚さの１４〜／１（１）
まで切削し人後、このクエーハを接着シートにｊｌｌｔ
けてゴムｐ−り等を押し当てしてグレーキングする方法
中、クエーーを接着シートに貼少寸けてからクエーハ上
の各素子間をクエーハ厚さの４〜４まで切削して後、接
着シートを放射状に伸展させて９エーハを６ｊ１子毎に
分割する方法がある。このような谷ダイシンダ方沃はク
エーハｆ：各虜子毎に細分割する時に分割され九素子が
分割時０礪械的シヨツクで接着シートから外れて飛散し
た＊、ｔＳ接する−の４士が不都合にも重なってしま−
、素子を真′！Ｉ！吸着コレット等で吸看して放電＆等
の基板に固肴マクントする＠に吸着ミスやマクント不＊
＊ｔｉくことがあった。そζで最近はクエーハを接着シ
ートに貼りｌｔ＆ｔたままでクエーハを裏面まで完全に
刀シ裂く完全カット方式のメイシング方法が推奨される
傾向にある。! Conventional technology ``1' 4 bodies Quaha (hereinafter simply called Kueno) 4
In the dicing method of subdividing each semiconductor element (hereinafter referred to as an element), the quaternary is fixed on a chuck table for guising, and the moxibustion elements on the quay are separated by 14 to 1 (1) of the quay's thickness. ) After cutting it to the surface, attach this quake to an adhesive sheet.
In the method of graying by pressing rubber paste etc. on the adhesive sheet, cut the area between each element on the adhesive sheet to a thickness of 4 to 4 mm, and then glue. There is a method of extending the sheet radially and dividing the 9 acre into 6j 1 child units. This kind of valley die cinder problem is caused by the fact that when each cell is subdivided, the 9 elements are separated from the adhesive sheet due to the mechanical shock and scattered. It overlaps with
, the elements are true! I! Suction with a suction collet etc. to fix the discharge & etc. on the board.
*There were times when I felt bad. Therefore, recently there has been a trend toward recommending a complete cut macing method in which the quaha is pasted on an adhesive sheet and the quaha is completely cut to the back side with a knife.
即ち、完全カット方式のダイジングは例えば第７図乃至
第３図に示すように７枚のクエーハ（１）を接着シー）
（組上に貼シ寸け、接着シート（２）（ｊｌ）
金円形ステージ（ＩＩ）上に載せて周辺部をステージ（
３）の周面上に弾性リング（４）で固定しておいて、ク
エーハ［１）の各素子間を高速回転する円板形のグレー
ド（５）で順次完全カットする方法である。In other words, complete cut dicing involves gluing seven pieces of quafer (1) together as shown in Figures 7 to 3.
(Put the adhesive sheet (2) (jl) on the assembly, place it on the gold circular stage (II), and place the peripheral part on the stage (
3) is fixed with an elastic ring (4) on the circumferential surface of the Quafer [1], and a disk-shaped grade (5) rotating at high speed is used to sequentially completely cut between each element of the Quafer [1].
この４−＆グレード（５）とステージ（３）の間隔ｇは
接着シート（２）の厚さｔよｐ小さくて（ｔ−ｇ）は約
、２０μｍ４ｉ度に設定し、グレード（ム）をステージ
（８）Ｋ対して泪対＄鯛させ、グレード（旬は第３図に
示すようにクエーハ（１） ｔ−完全力込みするととも
に接着シート（２）を約−０μｍの深さまで刀込みして
いる。このような完全カクト力式によると切込み完了の
時点でクエーハｉ１＞は完全に各素子毎に分割されるの
で、接着シー） （２） ｅ ４１底δせル隊に素子が
外れたり重なる等のトラグルは発生しなｉが、接着シー
ト（２）は、次の問題があった・
従来の接着シート（２）はポリ塩化ビニール等の７レキ
シグルなシー） （２４）上に通常の接着剤（ｇｂル等
厚に被材したもので、接着剤（２ｂ）上にクエーハ（１
）が抑圧されて接着される・このクエーへ（五）をグレ
ード（５）で完全カットする除、グレード（ム）は、当
然、接′、４剤（２ｂ）ｉも順次カットしていく、この
時接着剤（２ｂ）には粘性がるるため、カント進行に伴
ってグレード（ｉ）の刃先に接着＃ｊ（１７））がｌｔ
４してグレードｆｌｉｔの切れ味が憾下し、グレード（
６）にＪＯわる′Ａ、荷が増してグレード（５）が破損
することがあった。またクエーハｕｌＯり削屑が接着剤
（２ｂ）に混って水数せず伐）、これがグレード（５）
倉不４合にも研摩する作用ｔしてグレード（ム）の愼損
金速めグレードの寿命ｔ’ｉｎくする要因になっていた
・
まｆｃ接４に則（ａｈ沖粘性でクエーハヵット時に索子
に外力が加わると索子が慎ずれを起してしまい索子にク
ラックが入ることがあったＩｍまた刀削）Ｒが接着剤に
混って素子上にＩＩ看してダイシング時の寸法精度ｔ−
患（してい友・まｆｉｅ待に索子が０． ｊ ｗａ角以
下と微小なものにおいては接着テープ（２）との氷着面
積が小さくて＊＃力が弱く、そのため上記横ずれが目立
って発生し易く、且つカッティング時の愼楓的ショック
で接着テープ（りから剥れる確率が高くｔ険で６つた。The distance g between the grade (5) and the stage (3) is smaller than the thickness t of the adhesive sheet (2), and (t-g) is set to approximately 20 μm4i degrees, and the grade (mu) is set to the stage. (8) Let the red sea bream fall on the surface of the sea bream. According to such a complete cut force formula, when the cut is completed, the quadrature i1> is completely divided into each element, so there is a possibility that the elements will come off or overlap on the e41 bottom delta group. However, the adhesive sheet (2) had the following problems. Conventional adhesive sheet (2) is made of polyvinyl chloride, etc. (24), and the conventional adhesive sheet (24) is not adhesive. Adhesive (2b) is coated with the same thickness as Quafer (2b).
) is suppressed and glued.To this quay, except for completely cutting (5) with grade (5), for grade (mu), of course, the contact ′ and the 4 agents (2b) and i are also sequentially cut. At this time, the adhesive (2b) becomes viscous, so as the cant progresses, the adhesive #j (17)) is attached to the cutting edge of grade (i).
4, the sharpness of the grade flit deteriorated, and the grade (
In 6), grade (5) was sometimes damaged due to increased load. In addition, Quaha ulO shavings are mixed with the adhesive (2b) and cut without water), which is grade (5).
It also has a polishing effect on the 4-coat joint, which is a factor that shortens the service life of the grade (mu). When an external force is applied, the cables may shift and cracks may occur in the cables.In addition, R may be mixed with the adhesive and placed on the element, resulting in poor dimensional accuracy during dicing. −
In cases where the cord is minute (less than 0.j wa angle), the icing area with the adhesive tape (2) is small and the force is weak, so the above-mentioned lateral deviation is noticeable. It is easy to occur, and there is a high probability that it will peel off from the adhesive tape due to the shocking shock when cutting.
八 発側の目的
本発明は上記５６主力ツト方式でダイシングする時の問
題点に鑑み、これを解決し得る接着シートを提供するこ
とｔ−的とする。8. Purpose of the Invention In view of the problems encountered when dicing using the 56 main force method described above, it is an object of the present invention to provide an adhesive sheet that can solve these problems.
二 発明の楕」戊
本発明は完全カット方式のクエーハグイシングｊ４ｉ接
着シートにイ幼なもので、紫外線透過性シートに紫外線
硬化性のｌｓｔ脂系換肴剤に＃！着したことを特徴とす
る。この接着シートを使りたクエーハダイシングは前記
接着シートの接着剤上にクエーハｔ−ＡＪｉＤ寸ける工
程、前記接着剤に紫外４１ｉｔ照射して接着剤を硬化さ
せる工程、前記接着剤が完全硬化した状急でクエーハを
グレードで完全切込みする工程で行えばよい。このよう
に本発明の債曾シートの接着剤を紫外線硬化させてダイ
シングを行うと、グレードで硬化接着剤ｔ−１７Ｊ制し
た屑は粉状慝で水成し、グレード↑クエーハに＋ｔ４す
る恐れが黒くなる。また、接着剤の硬化によりクエー／
’Ｄ薔素子は接庸シ（！５）
一トに強固に固着されるので〃込み時に横ずれに起す危
険も脇（なる、従って、本発明の接着シートを使用する
ことによ）上記完全カット方式のクエーハダイシング上
の各問題点が４ｆｉ＜解決され借る。2. The present invention is a complete cutting type Quahaguishing J4I adhesive sheet, an ultraviolet-transparent sheet, and an ultraviolet-curable lst oil-based replacement agent. It is characterized by being worn. Quaha dicing using this adhesive sheet includes a step of dicing Quaha t-AJiD on the adhesive of the adhesive sheet, a step of curing the adhesive by irradiating the adhesive with ultraviolet light of 41 it, and a step of curing the adhesive by irradiating the adhesive with ultraviolet light of 41 it. If the situation arises, it can be done in the process of completely cutting in the Quafer with a grade. In this way, when the adhesive of the bond sheet of the present invention is cured by ultraviolet rays and dicing is performed, there is a risk that the scraps of the cured adhesive t-17J will become powdery and watery, resulting in grade ↑+t4. It turns black. In addition, due to the curing of the adhesive,
Since the 'D rose element is firmly fixed to the adhesive sheet (!5), there is no risk of it slipping laterally when it is inserted.Therefore, by using the adhesive sheet of the present invention, the above-mentioned complete cut Each problem in the Quar dicing method is solved.
ホ 実施例
＠ｐ図乃至第４図にて本発明の接着シート（６）を使り
た完全〃ット方式りエーハダイシングの貞施例倉説例す
る。接４シート（６）はポリ塩化ビニール等の紫外線透
過性シート（６りの片面に紫外線照射にて硬化する樹脂
系接着剤（６ｂ）を嗜厚に彼看形成し九もので−先ず第
ダ図に示すように硬化前の接着剤（６ｂ）の中央部上に
７枚のりニー−ｔｔ）ｔ−砧す寸ける。またシート固定
用のリング（７）ｔ−シート周辺部上の接着剤（ａｈ）
ｉｃ砧９寸ける・而して後、ｆＩＪ図に示すように接着
シート＋８１ ｔ″クエーハｆｌを下にして紫外線灯（
８）の下方に配置してシート（６９を通し接着剤（ｓｂ
％全面に紫外線＋ｊ＋ ｔ−照射し、接着剤（６すを硬
化させる。Example ＠ Figures P to 4 show examples of complete AHA dicing using the adhesive sheet (6) of the present invention. The contact sheet (6) is made by carefully forming a resin adhesive (6b) that hardens under ultraviolet irradiation on one side of an ultraviolet-transparent sheet (6b) such as polyvinyl chloride. As shown in the figure, glue 7 sheets of glue onto the center of the adhesive (6b) before curing. Also, the ring for fixing the seat (7) T-Adhesive on the periphery of the seat (ah)
After removing the 9-inch IC, as shown in the fIJ diagram, place the adhesive sheet + 81 t'' Quaha fl facing down under an ultraviolet lamp (
8) and pass the adhesive (sb
% The entire surface is irradiated with ultraviolet rays +j+t- to cure the adhesive (6s).
これによりクエーハｆｌ）とリングけ）は接着シート（
６）
（６）に強固に接着一体化される。次に４ＪＩＪｇ図に
示すように接着シート（６）をシート（６ａ）を下にし
てダイシング用チ丁ツクテーブル（１０１上に賊せて固
定する。チャックチーグルＤＯ）は上面周辺部が少し低
く、この１４辺部上に接材シート（６）の周辺部とリン
グ（７）で押圧して固定する。その後チャックテーブル
（至）とグレード（５）を相対＄助させてクエーハ１１
）の各索子１−をグレード（５）で順次完全切込みする
。この完全カット時、グレード（６）は接材剤（６すｔ
も釣込んでいくが、接４剤（ａｂ）は粘性の黒い完全硬
化の状忠にあるので接材剤（６ｂ）の切削屑はクエーハ
ｆｌ）の切削屑と共に粉状となって飛散し、従ってグレ
ード１５） ｆ″クエーハ１１にすＪ削屑が寸誉して伐
ることや、切削屑がグレード＋５）ｔｌ−研磨する不都
合が黒くなり、グレード（５）の寿命が長くなる。また
クエーハ（すの固着強度が大きいため、索子の横ずれな
どがほぼ皆無となってカッティング時に素子にククツク
が入る等の事故が黒くなり、ｐｆＩｉすが向上する。As a result, the adhesive sheet (
6) It is strongly adhesively integrated with (6). Next, as shown in Figure 4JIJg, place the adhesive sheet (6) with the sheet (6a) facing down and fix it on the chip table (101) for dicing. The periphery of the adhesive sheet (6) and the ring (7) are pressed onto the 14 sides to fix it. After that, the chuck table (to) and the grade (5) were helped by relative $ and Quaha 11
) are sequentially completely cut at grade (5). At the time of this complete cut, grade (6) is adhesive (6st
However, since the adhesive 4 (ab) is in a viscous, black, completely cured state, the cutting waste from the adhesive (6b) becomes powder and scatters together with the cutting waste from the quaha fl). Therefore, the service life of grade (5) is extended, as the inconveniences such as the fact that the J shavings on grade 15) f'' Quaha 11 are cut into pieces, and the inconvenience of cutting swarf grade + 5) tl - polishing become black, and the service life of grade (5) is extended. Since the fixing strength of the wire is high, there is almost no lateral slippage of the rope, which reduces accidents such as cracks in the element during cutting, and improves pfI.
尚、接着シート（６）は、上記天施例に限らず、場合に
よっては、両面に層外縁硬化性樹脂を液材してもよ−・
へ 発鳴の効果
以上説明したように、本発明の接着シートを使用すれば
クエーハダイシング時のグレード破損、歩留り低下の谷
間ｍ、ａが礁凛（解決され、特に完全カット方式のクエ
ーハダイシングにお−てその実施効果は極めて大である
。Note that the adhesive sheet (6) is not limited to the above-mentioned embodiment, and depending on the case, the outer edge of the layer may be coated with a liquid material of hardening resin on both sides. By using this adhesive sheet, the problems of grade breakage and yield decline during quaternary dicing can be solved, and the implementation effect is extremely large, especially in complete-cut quater dicing.
１７図及び第２図は従来の接着シートを使りたクエーハ
ダイシング装置の平面図及びムーム線に設う断面図、第
３図は第２図の２３−Ｂ線に２５扉分拡大−面丙、第１
図乃至第に図は本発明の接着シートを使ったクエーハダ
イシング方決の一例を説明するための薔工握での断面図
である。Figures 17 and 2 are a plan view of a quaternary dicing device using a conventional adhesive sheet and a sectional view taken along the Moom line, and Figure 3 is an enlarged view of 25 doors at line 23-B in Figure 2. C, 1st
The figures are cross-sectional views of a rosette grip for explaining an example of a quaternary dicing method using the adhesive sheet of the present invention.
Claims (1)
剤を＊、ｌｉｔ杉威したことを特徴とする牛導体りエー
ハダイシング用接着シート・(1) Adhesive sheet for beef conductor dicing, featuring a UV-curable resin adhesive applied to a UV-transparent sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008783A JPH0616527B2 (en) | 1983-07-29 | 1983-07-29 | Adhesive sheet for semiconductor wafer dicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14008783A JPH0616527B2 (en) | 1983-07-29 | 1983-07-29 | Adhesive sheet for semiconductor wafer dicing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6031918A true JPS6031918A (en) | 1985-02-18 |
| JPH0616527B2 JPH0616527B2 (en) | 1994-03-02 |
Family
ID=15260649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14008783A Expired - Lifetime JPH0616527B2 (en) | 1983-07-29 | 1983-07-29 | Adhesive sheet for semiconductor wafer dicing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0616527B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61116504A (en) * | 1984-11-13 | 1986-06-04 | 山形日本電気株式会社 | Dicing method |
| JPS62176808A (en) * | 1986-01-31 | 1987-08-03 | 株式会社東芝 | Manufacture of pellet |
| JPS63317681A (en) * | 1987-06-18 | 1988-12-26 | Diafoil Co Ltd | Metallized film |
| JPH02249640A (en) * | 1989-03-24 | 1990-10-05 | Ube Ind Ltd | Metallized film and its manufacture |
| JPH03159737A (en) * | 1989-11-17 | 1991-07-09 | Ube Ind Ltd | Preparation of metallized polyimide film |
| CN1070111C (en) * | 1995-01-13 | 2001-08-29 | 佳能株式会社 | Liquid jet head, liquid jet device and liquid jet method |
| JP2002299295A (en) * | 2001-03-30 | 2002-10-11 | Disco Abrasive Syst Ltd | Machining method for workpiece |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135280A (en) * | 1977-04-30 | 1978-11-25 | Mitsubishi Electric Corp | Exfoliating unit of semiconductor chip |
| JPS558088A (en) * | 1978-07-03 | 1980-01-21 | Nec Corp | Pellettize method of semi conductor wafer |
| JPS5743408A (en) * | 1980-06-28 | 1982-03-11 | Licentia Gmbh | Moisture sensor formed as capacitor |
| JPS57141470A (en) * | 1981-02-27 | 1982-09-01 | Aiwa Co Ltd | Uv ray-curable adhesive |
| JPS57210641A (en) * | 1981-06-19 | 1982-12-24 | Hitachi Ltd | Supporting structure for wafer |
| JPS5830809A (en) * | 1981-08-17 | 1983-02-23 | Fuji Heavy Ind Ltd | Car height control method |
| JPS5893765A (en) * | 1981-11-30 | 1983-06-03 | Toobi:Kk | Ultraviolet-curable adhesive and ultraviolet-curable label |
| JPS5921038A (en) * | 1982-07-27 | 1984-02-02 | Nec Home Electronics Ltd | Releasing method for pellet |
| JPS59126648A (en) * | 1983-01-07 | 1984-07-21 | Nec Home Electronics Ltd | Method of pellet exfoliation |
-
1983
- 1983-07-29 JP JP14008783A patent/JPH0616527B2/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135280A (en) * | 1977-04-30 | 1978-11-25 | Mitsubishi Electric Corp | Exfoliating unit of semiconductor chip |
| JPS558088A (en) * | 1978-07-03 | 1980-01-21 | Nec Corp | Pellettize method of semi conductor wafer |
| JPS5743408A (en) * | 1980-06-28 | 1982-03-11 | Licentia Gmbh | Moisture sensor formed as capacitor |
| JPS57141470A (en) * | 1981-02-27 | 1982-09-01 | Aiwa Co Ltd | Uv ray-curable adhesive |
| JPS57210641A (en) * | 1981-06-19 | 1982-12-24 | Hitachi Ltd | Supporting structure for wafer |
| JPS5830809A (en) * | 1981-08-17 | 1983-02-23 | Fuji Heavy Ind Ltd | Car height control method |
| JPS5893765A (en) * | 1981-11-30 | 1983-06-03 | Toobi:Kk | Ultraviolet-curable adhesive and ultraviolet-curable label |
| JPS5921038A (en) * | 1982-07-27 | 1984-02-02 | Nec Home Electronics Ltd | Releasing method for pellet |
| JPS59126648A (en) * | 1983-01-07 | 1984-07-21 | Nec Home Electronics Ltd | Method of pellet exfoliation |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61116504A (en) * | 1984-11-13 | 1986-06-04 | 山形日本電気株式会社 | Dicing method |
| JPH0223324B2 (en) * | 1984-11-13 | 1990-05-23 | Yamagata Nippon Denki Kk | |
| JPS62176808A (en) * | 1986-01-31 | 1987-08-03 | 株式会社東芝 | Manufacture of pellet |
| JPS63317681A (en) * | 1987-06-18 | 1988-12-26 | Diafoil Co Ltd | Metallized film |
| JPH02249640A (en) * | 1989-03-24 | 1990-10-05 | Ube Ind Ltd | Metallized film and its manufacture |
| JPH03159737A (en) * | 1989-11-17 | 1991-07-09 | Ube Ind Ltd | Preparation of metallized polyimide film |
| CN1070111C (en) * | 1995-01-13 | 2001-08-29 | 佳能株式会社 | Liquid jet head, liquid jet device and liquid jet method |
| JP2002299295A (en) * | 2001-03-30 | 2002-10-11 | Disco Abrasive Syst Ltd | Machining method for workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0616527B2 (en) | 1994-03-02 |
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