JPS6481237A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6481237A
JPS6481237A JP23832887A JP23832887A JPS6481237A JP S6481237 A JPS6481237 A JP S6481237A JP 23832887 A JP23832887 A JP 23832887A JP 23832887 A JP23832887 A JP 23832887A JP S6481237 A JPS6481237 A JP S6481237A
Authority
JP
Japan
Prior art keywords
insulation resin
substrate
semiconductor chip
resin
circuiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23832887A
Other languages
Japanese (ja)
Inventor
Hitoshi Miyasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP23832887A priority Critical patent/JPS6481237A/en
Publication of JPS6481237A publication Critical patent/JPS6481237A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10165—Alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Abstract

PURPOSE:To suppress open-circuiting between electrodes due to release between resin and substrate or between semiconductor chips by including gap control agent within insulation resin to relax stress of semiconductor chip after curing of insulation resin. CONSTITUTION:By providing a protrusion electrode 3 at either wiring of a semiconductor chip 1 or that of a substrate 6, for example at a wiring 5 of the substrate 6, a gap control agent 2 is included within an insulation resin 4 in a semiconductor device bonded by the insulation resin 4. It allows a uniform height within the semiconductor chip to be maintained and load applied to each protrusion electrode to be held at a constant level for preventing open- circuiting between electrodes.
JP23832887A 1987-09-22 1987-09-22 Semiconductor device Pending JPS6481237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23832887A JPS6481237A (en) 1987-09-22 1987-09-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23832887A JPS6481237A (en) 1987-09-22 1987-09-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6481237A true JPS6481237A (en) 1989-03-27

Family

ID=17028574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23832887A Pending JPS6481237A (en) 1987-09-22 1987-09-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6481237A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127060U (en) * 1989-03-30 1990-10-19
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
JP2000036502A (en) * 1998-07-17 2000-02-02 Sony Corp Bonding material and bonded object

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127060U (en) * 1989-03-30 1990-10-19
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
JP2000036502A (en) * 1998-07-17 2000-02-02 Sony Corp Bonding material and bonded object

Similar Documents

Publication Publication Date Title
EP0473796A4 (en) Semiconductor device having a plurality of chips
MY105095A (en) Semiconductor device having an improved lead arrangement and method for manufacturing the same.
EP0168828A3 (en) Semiconductor device having wiring layers and method for manufacturing the same
EP0154337A3 (en) Transistor circuit for semiconductor device with hysteresis operation and manufacturing method therefor
DE3583998D1 (en) POLYIMIDE PRECURSOR RESIN COMPOSITION AND SEMICONDUCTOR COMPONENT USING THE SAME.
KR870005450A (en) Semiconductor device without electrical short circuit through semiconductor layer and method for manufacturing the same
SG41087G (en) Semiconductor integrated circuit devices and method of manufacturing the same
JPS55111151A (en) Integrated circuit device
JPS6417455A (en) Semiconductor device
JPS57199228A (en) Wire bonding pad device
JPS6481237A (en) Semiconductor device
MY105031A (en) Resin-sealed type semiconductor device and method for manufacturing the same.
JPS56140632A (en) Method for giving strain to semiconductor wafer
DE3380104D1 (en) Substrate structure of semiconductor device and method of manufacturing the same
JPS5651851A (en) Semiconductor device
JPS6412565A (en) Semiconductor integrated circuit
IT8248113A0 (en) APPARATUS AND PROCEDURE FOR THE PRODUCTION OF HYPERPURE SEMICONDUCTOR MATERIALS
JPS5292267A (en) Silicone composition
JPS54975A (en) Semiconductor device
EP0325408A3 (en) Semiconductor device having an interconnection layer
KR100266348B1 (en) Semiconductor device and method for manufacturing the same
JPS57173953A (en) Semiconductor device
JPS5226189A (en) Semi-conductor unit of multilayer wiring structure
JPS6473650A (en) Semiconductor device
JPS5441666A (en) Semiconductor integrated circuit element