JPS6481237A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6481237A
JPS6481237A JP62238328A JP23832887A JPS6481237A JP S6481237 A JPS6481237 A JP S6481237A JP 62238328 A JP62238328 A JP 62238328A JP 23832887 A JP23832887 A JP 23832887A JP S6481237 A JPS6481237 A JP S6481237A
Authority
JP
Japan
Prior art keywords
insulation resin
substrate
semiconductor chip
resin
circuiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62238328A
Other languages
Japanese (ja)
Inventor
Hitoshi Miyasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP62238328A priority Critical patent/JPS6481237A/en
Publication of JPS6481237A publication Critical patent/JPS6481237A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/285—Alignment aids, e.g. alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To suppress open-circuiting between electrodes due to release between resin and substrate or between semiconductor chips by including gap control agent within insulation resin to relax stress of semiconductor chip after curing of insulation resin. CONSTITUTION:By providing a protrusion electrode 3 at either wiring of a semiconductor chip 1 or that of a substrate 6, for example at a wiring 5 of the substrate 6, a gap control agent 2 is included within an insulation resin 4 in a semiconductor device bonded by the insulation resin 4. It allows a uniform height within the semiconductor chip to be maintained and load applied to each protrusion electrode to be held at a constant level for preventing open- circuiting between electrodes.
JP62238328A 1987-09-22 1987-09-22 Semiconductor device Pending JPS6481237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62238328A JPS6481237A (en) 1987-09-22 1987-09-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62238328A JPS6481237A (en) 1987-09-22 1987-09-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6481237A true JPS6481237A (en) 1989-03-27

Family

ID=17028574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62238328A Pending JPS6481237A (en) 1987-09-22 1987-09-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6481237A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127060U (en) * 1989-03-30 1990-10-19
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
JP2000036502A (en) * 1998-07-17 2000-02-02 Sony Corp Jointing material and its joint

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127060U (en) * 1989-03-30 1990-10-19
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
JP2000036502A (en) * 1998-07-17 2000-02-02 Sony Corp Jointing material and its joint

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