JPS6412565A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To enable a defect analysis of the cause of breakdown or the like of an inner circuit by a method wherein an electrostatic impression recording section containing a fuse section is provided adjacently to a bonding pad and one side of a circuit record, and charge, which is induced when electrostatic is applied onto the bonding pad, is made to flow toward the face section. CONSTITUTION:A circuit wiring 2 of which one end is connected with an inner circuit and a bonding pad 3 which is connected with the other end of the wiring 2 and also bonded with a corresponding lead terminal are provided on a semiconductor chip 1 of a semiconductor integrated circuit. And, a reception end section 41 of conductor material such as Al or the like and a fuse section 42 of conductive material, of which one end is connected with the reception end 41, are provided closely to the bonding pad 3 on the chip 1. A terminal end section 43 is connected with the fuse section 42, where an electrostatic impression recording section is composed of three sections. Then, charge, which is induced when electrostatic is applied onto the bonding pad section 3, is made to flow through the fuse section 42, so that a defect analysis of the inner circuit is performed through fusion of the fuse section 42.