JPS6473650A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6473650A JPS6473650A JP23022187A JP23022187A JPS6473650A JP S6473650 A JPS6473650 A JP S6473650A JP 23022187 A JP23022187 A JP 23022187A JP 23022187 A JP23022187 A JP 23022187A JP S6473650 A JPS6473650 A JP S6473650A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- layer
- semiconductor chip
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent a passivation crack from occurring and moisture resistance from decreasing by composing a protective film of insulating resin layer formed by coating a semiconductor chip and an insulating resin film closely contacted on the resin layer. CONSTITUTION:An insulating resin layer 16 made, for example, of polyimide resin is formed on a whole area including a region of forming a bonding pad 13 on a semiconductor chip 13. Further, an insulating resin film 17 made of polyimide resin or the like is provided on the layer 16, and a protective film 18 is composed. The polyimide resin of the components has high purity containing only extremely small amount of impurities. The whole resin film 17 is brought into close contact with the layer 16. Thus, a semiconductor chip 12 formed with the film 18 is resin-sealed by a resin package 19 which contains as main ingredient, for example, epoxy resin and silica as a filler, thereby forming a desired semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23022187A JPS6473650A (en) | 1987-09-14 | 1987-09-14 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23022187A JPS6473650A (en) | 1987-09-14 | 1987-09-14 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6473650A true JPS6473650A (en) | 1989-03-17 |
Family
ID=16904454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23022187A Pending JPS6473650A (en) | 1987-09-14 | 1987-09-14 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6473650A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03133161A (en) * | 1989-10-19 | 1991-06-06 | Toshiba Corp | Semiconductor device |
US5698904A (en) * | 1993-09-03 | 1997-12-16 | Rohm Co., Ltd. | Packaging material for electronic components |
EP2093634A2 (en) | 2008-01-29 | 2009-08-26 | Seiko Epson Corporation | Satellite signal reception device and control method for a satellite signal reception device |
-
1987
- 1987-09-14 JP JP23022187A patent/JPS6473650A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03133161A (en) * | 1989-10-19 | 1991-06-06 | Toshiba Corp | Semiconductor device |
US5698904A (en) * | 1993-09-03 | 1997-12-16 | Rohm Co., Ltd. | Packaging material for electronic components |
EP2093634A2 (en) | 2008-01-29 | 2009-08-26 | Seiko Epson Corporation | Satellite signal reception device and control method for a satellite signal reception device |
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