JPS6473650A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6473650A
JPS6473650A JP23022187A JP23022187A JPS6473650A JP S6473650 A JPS6473650 A JP S6473650A JP 23022187 A JP23022187 A JP 23022187A JP 23022187 A JP23022187 A JP 23022187A JP S6473650 A JPS6473650 A JP S6473650A
Authority
JP
Japan
Prior art keywords
resin
film
layer
semiconductor chip
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23022187A
Other languages
Japanese (ja)
Inventor
Yoshinori Kanno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP23022187A priority Critical patent/JPS6473650A/en
Publication of JPS6473650A publication Critical patent/JPS6473650A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent a passivation crack from occurring and moisture resistance from decreasing by composing a protective film of insulating resin layer formed by coating a semiconductor chip and an insulating resin film closely contacted on the resin layer. CONSTITUTION:An insulating resin layer 16 made, for example, of polyimide resin is formed on a whole area including a region of forming a bonding pad 13 on a semiconductor chip 13. Further, an insulating resin film 17 made of polyimide resin or the like is provided on the layer 16, and a protective film 18 is composed. The polyimide resin of the components has high purity containing only extremely small amount of impurities. The whole resin film 17 is brought into close contact with the layer 16. Thus, a semiconductor chip 12 formed with the film 18 is resin-sealed by a resin package 19 which contains as main ingredient, for example, epoxy resin and silica as a filler, thereby forming a desired semiconductor device.
JP23022187A 1987-09-14 1987-09-14 Semiconductor device Pending JPS6473650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23022187A JPS6473650A (en) 1987-09-14 1987-09-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23022187A JPS6473650A (en) 1987-09-14 1987-09-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6473650A true JPS6473650A (en) 1989-03-17

Family

ID=16904454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23022187A Pending JPS6473650A (en) 1987-09-14 1987-09-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6473650A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133161A (en) * 1989-10-19 1991-06-06 Toshiba Corp Semiconductor device
US5698904A (en) * 1993-09-03 1997-12-16 Rohm Co., Ltd. Packaging material for electronic components
EP2093634A2 (en) 2008-01-29 2009-08-26 Seiko Epson Corporation Satellite signal reception device and control method for a satellite signal reception device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133161A (en) * 1989-10-19 1991-06-06 Toshiba Corp Semiconductor device
US5698904A (en) * 1993-09-03 1997-12-16 Rohm Co., Ltd. Packaging material for electronic components
EP2093634A2 (en) 2008-01-29 2009-08-26 Seiko Epson Corporation Satellite signal reception device and control method for a satellite signal reception device

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