JPS5456356A - Dicing device - Google Patents
Dicing deviceInfo
- Publication number
- JPS5456356A JPS5456356A JP12235577A JP12235577A JPS5456356A JP S5456356 A JPS5456356 A JP S5456356A JP 12235577 A JP12235577 A JP 12235577A JP 12235577 A JP12235577 A JP 12235577A JP S5456356 A JPS5456356 A JP S5456356A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- base
- jig
- sucked
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To form a mechanism of not damaging the wafer at the time of removing the wafer after working in a dicing device provided with automatic handling mechanism.
CONSTITUTION: A wafer 10 is sucked to a Verneuil chuck 14 at the state of feeding. When an arm 15 moves and the wafer comes over a base 11, air jetting 20 is stopped and holding is released. The wafer is sucked to the base 11 and is subjected to grooving. After working, a mechanism 13 moves to push the edge of the wafer on the base 11 and transfer the same onto a jig 12. Even if washing solution intervenes between the bottom of the wafer and the face of the base, the wafer can move with extremely small force because the solution is of low viscosity, thus cracking of the wafer does not occur. The moisture between the bottom face of the wafer and the top face of the jig 12 is slight because of a multiplicity of deep grooves 17 on the top of the jig 12. The chuck 14 moves slightly above the wafer and carries the wafer to a desired position by holding the same in the absence of any contact with the bottom of the chuck owing to air jetting 20. Even at this time, the effect of the grooves 17 causes the wafer to be sucked and prevents the same from being cracked
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12235577A JPS5456356A (en) | 1977-10-14 | 1977-10-14 | Dicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12235577A JPS5456356A (en) | 1977-10-14 | 1977-10-14 | Dicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5456356A true JPS5456356A (en) | 1979-05-07 |
Family
ID=14833852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12235577A Pending JPS5456356A (en) | 1977-10-14 | 1977-10-14 | Dicing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5456356A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127341A (en) * | 1982-01-25 | 1983-07-29 | Hitachi Ltd | Automatic wafer handling apparatus |
| JPS58216835A (en) * | 1982-05-25 | 1983-12-16 | ウイント・ライツ・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング | Automatic conveyor for discoid body |
| JPS592135U (en) * | 1982-06-28 | 1984-01-09 | 株式会社東芝 | wafer rotation device |
| JPS5978633U (en) * | 1982-11-18 | 1984-05-28 | 日立電子エンジニアリング株式会社 | Wafer loading/unloading mechanism |
| JPS62102537A (en) * | 1985-10-29 | 1987-05-13 | Canon Inc | Substrate processor |
| JPH03505946A (en) * | 1988-06-17 | 1991-12-19 | アドヴァンスド、セミコンダクター・マテリアルズ・アメリカ・インコーポレーテッド | Wafer handling system with Bernoulli pickup |
| CN102738051A (en) * | 2012-06-19 | 2012-10-17 | 致茂电子(苏州)有限公司 | Automatic charging tray moving machine |
-
1977
- 1977-10-14 JP JP12235577A patent/JPS5456356A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58127341A (en) * | 1982-01-25 | 1983-07-29 | Hitachi Ltd | Automatic wafer handling apparatus |
| JPS58216835A (en) * | 1982-05-25 | 1983-12-16 | ウイント・ライツ・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング | Automatic conveyor for discoid body |
| JPH0325380B2 (en) * | 1982-05-25 | 1991-04-05 | Uiruto Raitsu Gmbh | |
| JPS592135U (en) * | 1982-06-28 | 1984-01-09 | 株式会社東芝 | wafer rotation device |
| JPS626690Y2 (en) * | 1982-06-28 | 1987-02-16 | ||
| JPS5978633U (en) * | 1982-11-18 | 1984-05-28 | 日立電子エンジニアリング株式会社 | Wafer loading/unloading mechanism |
| JPS62102537A (en) * | 1985-10-29 | 1987-05-13 | Canon Inc | Substrate processor |
| JPH0691150B2 (en) * | 1985-10-29 | 1994-11-14 | キヤノン株式会社 | Substrate processing method |
| JPH03505946A (en) * | 1988-06-17 | 1991-12-19 | アドヴァンスド、セミコンダクター・マテリアルズ・アメリカ・インコーポレーテッド | Wafer handling system with Bernoulli pickup |
| CN102738051A (en) * | 2012-06-19 | 2012-10-17 | 致茂电子(苏州)有限公司 | Automatic charging tray moving machine |
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