JPS57176740A - Wafer conveying device - Google Patents

Wafer conveying device

Info

Publication number
JPS57176740A
JPS57176740A JP6123781A JP6123781A JPS57176740A JP S57176740 A JPS57176740 A JP S57176740A JP 6123781 A JP6123781 A JP 6123781A JP 6123781 A JP6123781 A JP 6123781A JP S57176740 A JPS57176740 A JP S57176740A
Authority
JP
Japan
Prior art keywords
wafer
pad
case
conveying device
adsorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6123781A
Other languages
Japanese (ja)
Inventor
Takashi Sano
Hisamoto Watanabe
Atsushi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Seiko Ltd filed Critical Hitachi Seiko Ltd
Priority to JP6123781A priority Critical patent/JPS57176740A/en
Publication of JPS57176740A publication Critical patent/JPS57176740A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To obtain a conveying device which can convey a wafer directly to a processing machine by providing wafer pushing means, thereby positioning the wafer in the containing case from the state of the wafer in the horizontal case. CONSTITUTION:In a wafer conveying device in which a containing case 1 having holes at the top and containing a plurality of wafers aligned vertically is laid down to set the wafer 2 horizontal for absorbing and conveying the wafer 2 from the hole direction, a wire spring 7 (urging means) contacted with the side edge of the wafer before adsorption is provided at the rear side of the moving direction (in a direction of an arrow along a rod 6) for allowing the adsorption pad 5 to cause adsorption. When the pad 5 moves horizontally, the spring 7 contacts with the side edge of the wafer, and when the pad 5 subsequently move, the wafer 2 is positioned on the bottom of the case 1 (tapered part 1') to urge with slight elastic force. Thereafter, the wafer 2 is attracted and transferred by the pad 5, and is positioned accurately on a chuck 4.
JP6123781A 1981-04-24 1981-04-24 Wafer conveying device Pending JPS57176740A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6123781A JPS57176740A (en) 1981-04-24 1981-04-24 Wafer conveying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6123781A JPS57176740A (en) 1981-04-24 1981-04-24 Wafer conveying device

Publications (1)

Publication Number Publication Date
JPS57176740A true JPS57176740A (en) 1982-10-30

Family

ID=13165414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6123781A Pending JPS57176740A (en) 1981-04-24 1981-04-24 Wafer conveying device

Country Status (1)

Country Link
JP (1) JPS57176740A (en)

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