JPS57145326A - Method and device for forming pattern on wafer by photosensing semiconductor wafer - Google Patents

Method and device for forming pattern on wafer by photosensing semiconductor wafer

Info

Publication number
JPS57145326A
JPS57145326A JP56203851A JP20385181A JPS57145326A JP S57145326 A JPS57145326 A JP S57145326A JP 56203851 A JP56203851 A JP 56203851A JP 20385181 A JP20385181 A JP 20385181A JP S57145326 A JPS57145326 A JP S57145326A
Authority
JP
Japan
Prior art keywords
wafer
forming pattern
semiconductor wafer
photosensing
photosensing semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56203851A
Other languages
Japanese (ja)
Inventor
Ee Maieru Heiberuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TSUENZOORU PATENT-UNTO FUEAZUUFUSUUANSHIYUTARUTO
Censor Patent und Versuchsanstalt
Original Assignee
TSUENZOORU PATENT-UNTO FUEAZUUFUSUUANSHIYUTARUTO
Censor Patent und Versuchsanstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/220,451 external-priority patent/US4376581A/en
Application filed by TSUENZOORU PATENT-UNTO FUEAZUUFUSUUANSHIYUTARUTO, Censor Patent und Versuchsanstalt filed Critical TSUENZOORU PATENT-UNTO FUEAZUUFUSUUANSHIYUTARUTO
Publication of JPS57145326A publication Critical patent/JPS57145326A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP56203851A 1980-12-29 1981-12-18 Method and device for forming pattern on wafer by photosensing semiconductor wafer Pending JPS57145326A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/220,451 US4376581A (en) 1979-12-20 1980-12-29 Method of positioning disk-shaped workpieces, preferably semiconductor wafers

Publications (1)

Publication Number Publication Date
JPS57145326A true JPS57145326A (en) 1982-09-08

Family

ID=22823590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56203851A Pending JPS57145326A (en) 1980-12-29 1981-12-18 Method and device for forming pattern on wafer by photosensing semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57145326A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151426A (en) * 1983-01-21 1984-08-29 フィリップス　エレクトロニクス　ネムローゼ　フェンノートシャップ Device for photolithographically treating thin substrate
JPS6085536A (en) * 1983-10-17 1985-05-15 Hitachi Ltd Wafer positioning device
JPS60257450A (en) * 1984-05-29 1985-12-19 エヌ・ベー・フイリツプス・フルーイランペンフアブリケン Mask pattern image forming apparatus
JPS62102537A (en) * 1985-10-29 1987-05-13 Canon Inc Substrate processor
JPS62199031A (en) * 1986-02-27 1987-09-02 Rohm Co Ltd Exposure device
JPS6323332A (en) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド Wafer transfer system
JPS63107139A (en) * 1986-10-24 1988-05-12 Nikon Corp Wafer pre-alignment system
JPS6431431A (en) * 1987-07-28 1989-02-01 Tokyo Electron Ltd Conveying method
JP2019212908A (en) * 2018-06-08 2019-12-12 バット ホールディング アーゲー Wafer transfer unit and wafer transfer system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122369A (en) * 1977-04-01 1978-10-25 Hitachi Ltd Automatic alignment unit for wafer
JPS5513941A (en) * 1978-07-17 1980-01-31 Tokyo Erekutoron Kk Semiconductor wafer with traget for prove

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122369A (en) * 1977-04-01 1978-10-25 Hitachi Ltd Automatic alignment unit for wafer
JPS5513941A (en) * 1978-07-17 1980-01-31 Tokyo Erekutoron Kk Semiconductor wafer with traget for prove

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0434812B2 (en) * 1983-01-21 1992-06-09 Fuiritsupusu Furuuiranpenfuaburiken Nv
JPS59151426A (en) * 1983-01-21 1984-08-29 フィリップス　エレクトロニクス　ネムローゼ　フェンノートシャップ Device for photolithographically treating thin substrate
JPS6085536A (en) * 1983-10-17 1985-05-15 Hitachi Ltd Wafer positioning device
JPS60257450A (en) * 1984-05-29 1985-12-19 エヌ・ベー・フイリツプス・フルーイランペンフアブリケン Mask pattern image forming apparatus
JPS62102537A (en) * 1985-10-29 1987-05-13 Canon Inc Substrate processor
JPH0691150B2 (en) * 1985-10-29 1994-11-14 キヤノン株式会社 Substrate processing method
JPS62199031A (en) * 1986-02-27 1987-09-02 Rohm Co Ltd Exposure device
JPH0588529B2 (en) * 1986-02-27 1993-12-22 Rohm Kk
JPH0458184B2 (en) * 1986-04-28 1992-09-16 Varian Associates
JPS6323332A (en) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド Wafer transfer system
JPS63107139A (en) * 1986-10-24 1988-05-12 Nikon Corp Wafer pre-alignment system
JPS6431431A (en) * 1987-07-28 1989-02-01 Tokyo Electron Ltd Conveying method
JP2506379B2 (en) * 1987-07-28 1996-06-12 東京エレクトロン株式会社 Conveying method and conveying device
JP2019212908A (en) * 2018-06-08 2019-12-12 バット ホールディング アーゲー Wafer transfer unit and wafer transfer system

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