JPS5513941A - Semiconductor wafer with traget for prove - Google Patents

Semiconductor wafer with traget for prove

Info

Publication number
JPS5513941A
JPS5513941A JP8690078A JP8690078A JPS5513941A JP S5513941 A JPS5513941 A JP S5513941A JP 8690078 A JP8690078 A JP 8690078A JP 8690078 A JP8690078 A JP 8690078A JP S5513941 A JPS5513941 A JP S5513941A
Authority
JP
Japan
Prior art keywords
chips
semiconductor wafer
prove
wafer
traget
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8690078A
Other languages
Japanese (ja)
Inventor
Kyoichi Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKYO EREKUTORON KENKYUSHO KK
Tokyo Electron Ltd
Original Assignee
TOKYO EREKUTORON KENKYUSHO KK
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKYO EREKUTORON KENKYUSHO KK, Tokyo Electron Ltd filed Critical TOKYO EREKUTORON KENKYUSHO KK
Priority to JP8690078A priority Critical patent/JPS5513941A/en
Publication of JPS5513941A publication Critical patent/JPS5513941A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To perform a positioning for the proving accurately by providing a substantially crossed target for alignment in a chip on the circumference to be dumped of the chips sectioned by a scribe line of the semiconductor wafer.
CONSTITUTION: A scribe line 5 is given transversely and vertically to a semiconductor wafer 1 and the quality of the chips is determined by proving each of the chips surrounded with these lines. In this case, if the wafer 1 mounted on the stand may be inclined, a prove would not make an accurate contact with the face of a velet 4. In order to overcome this defect, a crossed target 2 is provided in the chip 4 on the circumferential protion to be dumped without utilizing as an IC element of the chips 4, to perform the positioning of X - Y direction for the wafer 1 accurately.
COPYRIGHT: (C)1980,JPO&Japio
JP8690078A 1978-07-17 1978-07-17 Semiconductor wafer with traget for prove Pending JPS5513941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8690078A JPS5513941A (en) 1978-07-17 1978-07-17 Semiconductor wafer with traget for prove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8690078A JPS5513941A (en) 1978-07-17 1978-07-17 Semiconductor wafer with traget for prove

Publications (1)

Publication Number Publication Date
JPS5513941A true JPS5513941A (en) 1980-01-31

Family

ID=13899700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8690078A Pending JPS5513941A (en) 1978-07-17 1978-07-17 Semiconductor wafer with traget for prove

Country Status (1)

Country Link
JP (1) JPS5513941A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145326A (en) * 1980-12-29 1982-09-08 Censor Patent Versuch Method and device for forming pattern on wafer by photosensing semiconductor wafer
JPS57204957U (en) * 1981-06-25 1982-12-27
JPH01242613A (en) * 1988-03-23 1989-09-27 Nippon Kayaku Co Ltd Urethane (meth)acrylate mixture and resin composition and coating agent for optical fiber using this mixture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145326A (en) * 1980-12-29 1982-09-08 Censor Patent Versuch Method and device for forming pattern on wafer by photosensing semiconductor wafer
JPS57204957U (en) * 1981-06-25 1982-12-27
JPS633321Y2 (en) * 1981-06-25 1988-01-27
JPH01242613A (en) * 1988-03-23 1989-09-27 Nippon Kayaku Co Ltd Urethane (meth)acrylate mixture and resin composition and coating agent for optical fiber using this mixture

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