JPS55102245A - Semiconductor wafer - Google Patents
Semiconductor waferInfo
- Publication number
- JPS55102245A JPS55102245A JP955979A JP955979A JPS55102245A JP S55102245 A JPS55102245 A JP S55102245A JP 955979 A JP955979 A JP 955979A JP 955979 A JP955979 A JP 955979A JP S55102245 A JPS55102245 A JP S55102245A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- regions
- probes
- semiconductor wafer
- constituting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To make the measurement possible by simultaneously contacting probes with a plurality of chip pads, so that the connecting pads in a plurality of chip- constituting regions, which contact at one point, form rotating symmetrical patterns.
CONSTITUTION: Chip-constituting regions 21 and 23, and 22 and 24 are provided with connecting pads 4 which form double rotating symmetrical patterns. For wafers wherein said chip-constituting regions 21 to 24 are repetitiously constituted, the regions 21 and 22; 21 and 23; 22 and 24; and 23 and 24 can be mesured by simultaneously contacting probes, respectively. Therefore, the measurement time including index time during which the probes are moved can be shortened.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP955979A JPS55102245A (en) | 1979-01-29 | 1979-01-29 | Semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP955979A JPS55102245A (en) | 1979-01-29 | 1979-01-29 | Semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55102245A true JPS55102245A (en) | 1980-08-05 |
Family
ID=11723632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP955979A Pending JPS55102245A (en) | 1979-01-29 | 1979-01-29 | Semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55102245A (en) |
-
1979
- 1979-01-29 JP JP955979A patent/JPS55102245A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE2964965D1 (en) | Semiconductor chip with improved ability for testing the large scale integrated circuits | |
| GB2014743B (en) | Four-quadrant multiprobe-edge sensor for semiconductor wafer probing | |
| JPS57136357A (en) | Large-scale integrated circuit device having external access integrated circuit for test and manufacture thereof | |
| JPS55102245A (en) | Semiconductor wafer | |
| JPS5440082A (en) | Semiconductor test device | |
| JPS5379378A (en) | Semoconductor davice and its production | |
| JPS5365069A (en) | Semiconductor wafer inspector | |
| JPS52115188A (en) | Prober | |
| JPS53108772A (en) | Production of semiconductor device | |
| JPS5571034A (en) | Measuring method for resistance distribution of compound semiconductor single crystal | |
| JPS5232186A (en) | Spherical surface processing device | |
| JPS5427772A (en) | Production of semiconductor devices | |
| JPS5413272A (en) | Measuring unit for semiconductor | |
| JPS5290275A (en) | Production of semiconductor device | |
| JPS5318972A (en) | Monitoring method of wafer positioning state by probes | |
| JPS5227378A (en) | Wafer test method | |
| JPS53128287A (en) | Production of semiconductor device | |
| JPS5358764A (en) | Bonding method of flip chip | |
| JPS5244162A (en) | Method of processing semiconductor wafer | |
| JPS51140471A (en) | Device for washing semiconductor wafer | |
| JPS5233482A (en) | Testing process of wafer characteristics | |
| JPS52122084A (en) | Inspection system for semiconductor substrates | |
| JPS52138849A (en) | Logic integrated circuit | |
| JPS5310279A (en) | Mesa type semiconductor device | |
| JPS5361267A (en) | Production of semiconductor device |