Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP13629976ApriorityCriticalpatent/JPS5361267A/en
Publication of JPS5361267ApublicationCriticalpatent/JPS5361267A/en
PURPOSE: To prevent the cracking of wafers during treatment process by forming dicing grooves in wafers in a state of supporting the wafer to become a production substrate with other wafer and making inspection.
COPYRIGHT: (C)1978,JPO&Japio
JP13629976A1976-11-151976-11-15Production of semiconductor device
PendingJPS5361267A
(en)