HK44486A - A semiconductor device,and a process for producing such a device - Google Patents

A semiconductor device,and a process for producing such a device

Info

Publication number
HK44486A
HK44486A HK44486A HK44486A HK44486A HK 44486 A HK44486 A HK 44486A HK 44486 A HK44486 A HK 44486A HK 44486 A HK44486 A HK 44486A HK 44486 A HK44486 A HK 44486A
Authority
HK
Hong Kong
Prior art keywords
producing
semiconductor device
semiconductor
Prior art date
Application number
HK44486A
Inventor
Atsushi Sasayama
Kenji Hirashima
Kazuki Urita
Kazuo Kanbayashi
Nobukatsu Tanaka
Yoshimi Hagiwara
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK44486A publication Critical patent/HK44486A/en

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Classifications

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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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HK44486A 1980-09-17 1986-06-19 A semiconductor device,and a process for producing such a device HK44486A (en)

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JP12798180A JPS5753947A (en) 1980-09-17 1980-09-17 Transistor and electronic device containing it

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JPS59218759A (en) * 1983-05-27 1984-12-10 Toshiba Corp Semiconductor device
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
DE3505086A1 (en) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Power semiconductor module with a plastic casing
GB2174538A (en) * 1985-04-24 1986-11-05 Stanley Bracey Semiconductor package
IT1221585B (en) * 1987-05-18 1990-07-12 S G S Microelettronica Spa Ora MODULAR CIRCUIT WITH MULTIPLE CONDUCTORS IN RESIN CAPSULATE, AND RELATIVE MANUFACTURING PROCEDURE
JPH0750753B2 (en) * 1987-08-21 1995-05-31 株式会社東芝 Transistor device
JPH02201949A (en) * 1989-01-30 1990-08-10 Toshiba Corp Package of semiconductor device
JPH0810744B2 (en) * 1989-08-28 1996-01-31 三菱電機株式会社 Semiconductor device
US5109268A (en) * 1989-12-29 1992-04-28 Sgs-Thomson Microelectronics, Inc. Rf transistor package and mounting pad
FI88452C (en) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Design to improve cooling of a power transistor
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
JPH0798460A (en) * 1992-10-21 1995-04-11 Seiko Instr Inc Semiconductor device and light valve device
EP0650193A3 (en) * 1993-10-25 1996-07-31 Toshiba Kk Semiconductor device and method for manufacturing the same.
EP0703612B1 (en) * 1994-09-20 1998-11-25 STMicroelectronics S.r.l. Method for electrically insulating heat sinks in electronic power devices
JPH1065085A (en) * 1996-06-28 1998-03-06 Siemens Ag Lead frame for use in power package
ES2123435B1 (en) * 1996-10-29 1999-09-16 Mecanismos Aux Ind THERMAL DISSIPATION SYSTEM IN A PRINTED CIRCUIT OF 800 MICRONS.
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
GB2334814A (en) * 1998-02-25 1999-09-01 Motorola Inc Moulded electronic device package with a heat sink
US6160710A (en) * 1998-04-03 2000-12-12 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
DE10144324A1 (en) * 2001-09-10 2003-03-27 Delphi Tech Inc Electrical module
DE102009050178B3 (en) * 2009-10-21 2011-05-26 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module having a three-dimensional surface contour having substrate and manufacturing method thereof
CN117153567A (en) * 2017-06-30 2023-12-01 京瓷Avx元器件公司 Heat dissipation in balancing circuits for supercapacitor modules

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US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
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JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
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JPS54101268A (en) * 1978-01-27 1979-08-09 Hitachi Ltd Semiconductor device
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package

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GB2084796B (en) 1984-09-05
MY8600545A (en) 1986-12-31
DE3136796A1 (en) 1982-07-15
JPS5753947A (en) 1982-03-31

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