GB2084796B - Mounting and cooling arrangements for semiconductor devices - Google Patents

Mounting and cooling arrangements for semiconductor devices

Info

Publication number
GB2084796B
GB2084796B GB8128041A GB8128041A GB2084796B GB 2084796 B GB2084796 B GB 2084796B GB 8128041 A GB8128041 A GB 8128041A GB 8128041 A GB8128041 A GB 8128041A GB 2084796 B GB2084796 B GB 2084796B
Authority
GB
United Kingdom
Prior art keywords
mounting
semiconductor devices
cooling arrangements
arrangements
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8128041A
Other versions
GB2084796A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB2084796A publication Critical patent/GB2084796A/en
Application granted granted Critical
Publication of GB2084796B publication Critical patent/GB2084796B/en
Expired legal-status Critical Current

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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
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    • H01L2924/30—Technical effects
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    • H01L2924/30105—Capacitance
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    • H01L2924/30—Technical effects
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    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB8128041A 1980-09-17 1981-09-16 Mounting and cooling arrangements for semiconductor devices Expired GB2084796B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12798180A JPS5753947A (en) 1980-09-17 1980-09-17 Transistor and electronic device containing it

Publications (2)

Publication Number Publication Date
GB2084796A GB2084796A (en) 1982-04-15
GB2084796B true GB2084796B (en) 1984-09-05

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GB8128041A Expired GB2084796B (en) 1980-09-17 1981-09-16 Mounting and cooling arrangements for semiconductor devices

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JP (1) JPS5753947A (en)
DE (1) DE3136796A1 (en)
GB (1) GB2084796B (en)
HK (1) HK44486A (en)
MY (1) MY8600545A (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59101843A (en) * 1982-12-01 1984-06-12 Matsushita Electric Works Ltd Resin sealed type electronic component part
JPS59218759A (en) * 1983-05-27 1984-12-10 Toshiba Corp Semiconductor device
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
DE3505086A1 (en) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Power semiconductor module with a plastic casing
GB2174538A (en) * 1985-04-24 1986-11-05 Stanley Bracey Semiconductor package
IT1221585B (en) * 1987-05-18 1990-07-12 S G S Microelettronica Spa Ora MODULAR CIRCUIT WITH MULTIPLE CONDUCTORS IN RESIN CAPSULATE, AND RELATIVE MANUFACTURING PROCEDURE
JPH0750753B2 (en) * 1987-08-21 1995-05-31 株式会社東芝 Transistor device
JPH02201949A (en) * 1989-01-30 1990-08-10 Toshiba Corp Package of semiconductor device
JPH0810744B2 (en) * 1989-08-28 1996-01-31 三菱電機株式会社 Semiconductor device
US5109268A (en) * 1989-12-29 1992-04-28 Sgs-Thomson Microelectronics, Inc. Rf transistor package and mounting pad
FI88452C (en) * 1990-03-29 1993-05-10 Nokia Mobile Phones Ltd Design to improve cooling of a power transistor
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
JPH0798460A (en) * 1992-10-21 1995-04-11 Seiko Instr Inc Semiconductor device and light valve device
EP0650193A3 (en) * 1993-10-25 1996-07-31 Toshiba Kk Semiconductor device and method for manufacturing the same.
DE69414846T2 (en) * 1994-09-20 1999-05-20 Stmicroelectronics S.R.L., Agrate Brianza, Mailand/Milano Method for the electrical insulation of heat sinks in electronic power circuits
JPH1065085A (en) * 1996-06-28 1998-03-06 Siemens Ag Lead frame for use in power package
ES2123435B1 (en) * 1996-10-29 1999-09-16 Mecanismos Aux Ind THERMAL DISSIPATION SYSTEM IN A PRINTED CIRCUIT OF 800 MICRONS.
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
GB2334814A (en) * 1998-02-25 1999-09-01 Motorola Inc Moulded electronic device package with a heat sink
US6160710A (en) * 1998-04-03 2000-12-12 Ericsson Inc. Capacitive mounting arrangement for securing an integrated circuit package to a heat sink
DE10144324A1 (en) * 2001-09-10 2003-03-27 Delphi Tech Inc Electrical module
DE102009050178B3 (en) * 2009-10-21 2011-05-26 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module having a three-dimensional surface contour having substrate and manufacturing method thereof
CN110770861A (en) * 2017-06-30 2020-02-07 阿维科斯公司 Heat dissipation in balancing circuit for supercapacitor module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1283969B (en) * 1965-02-16 1968-11-28 Itt Ind Gmbh Deutsche Semiconductor component with an electrically insulating intermediate body between the semiconductor body and a housing part, and a method for its manufacture
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US3784884A (en) * 1972-11-03 1974-01-08 Motorola Inc Low parasitic microwave package
US4012765A (en) * 1975-09-24 1977-03-15 Motorola, Inc. Lead frame for plastic encapsulated semiconductor assemblies
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
IN148328B (en) * 1977-04-18 1981-01-17 Rca Corp
JPS54101268A (en) * 1978-01-27 1979-08-09 Hitachi Ltd Semiconductor device
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package

Also Published As

Publication number Publication date
JPS5753947A (en) 1982-03-31
DE3136796A1 (en) 1982-07-15
GB2084796A (en) 1982-04-15
MY8600545A (en) 1986-12-31
HK44486A (en) 1986-06-27

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940916