JPS57155742A - Wafer prober - Google Patents

Wafer prober

Info

Publication number
JPS57155742A
JPS57155742A JP4030281A JP4030281A JPS57155742A JP S57155742 A JPS57155742 A JP S57155742A JP 4030281 A JP4030281 A JP 4030281A JP 4030281 A JP4030281 A JP 4030281A JP S57155742 A JPS57155742 A JP S57155742A
Authority
JP
Japan
Prior art keywords
wafer
probe needles
inspection
chuck
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4030281A
Other languages
Japanese (ja)
Inventor
Mutsuyo Kanetani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4030281A priority Critical patent/JPS57155742A/en
Publication of JPS57155742A publication Critical patent/JPS57155742A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

PURPOSE:To dissolve poor inspection accompanying with the poor contact of probe needles and to improve the yield of a wafer by a method wherein a sample is permitted to press to the probe needles when the probe needles are contacted with a pellet (sample). CONSTITUTION:A wafer W is mounted and held on a chuck 1 by vacuum attraction for positioning so that the wafer may face to probe needles 3. A pellet plate 2 is moved downwards to have the probe needles 3 contacted with the wafer for turning on electricity and predetermined inspection is executed. When the wafer is good, the position of the wafer is displaced to proceed to the next inspection. When the wafer is not good, the chuck 1 is moved upwards by keeping the wafer intact and the wafer W is strongly pressed to the probe needles to increase contact pressure and poor contact by existing dust and an oxide film is eliminated for reinspection. In this way, exact inspection can be exected and the yield of the wafer is improved.
JP4030281A 1981-03-23 1981-03-23 Wafer prober Pending JPS57155742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4030281A JPS57155742A (en) 1981-03-23 1981-03-23 Wafer prober

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4030281A JPS57155742A (en) 1981-03-23 1981-03-23 Wafer prober

Publications (1)

Publication Number Publication Date
JPS57155742A true JPS57155742A (en) 1982-09-25

Family

ID=12576814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4030281A Pending JPS57155742A (en) 1981-03-23 1981-03-23 Wafer prober

Country Status (1)

Country Link
JP (1) JPS57155742A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142526A (en) * 1983-12-29 1985-07-27 Toshiba Corp Measurement of electrical characteristics of semiconductor element
JPS63110672A (en) * 1986-10-28 1988-05-16 Sumitomo Electric Ind Ltd Measurement of semiconductor pressure sensor
JPS63110671A (en) * 1986-10-28 1988-05-16 Sumitomo Electric Ind Ltd Measurement of semiconductor pressure sensor
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
JPH05326655A (en) * 1992-07-22 1993-12-10 Tokyo Electron Ltd Measuring method of semiconductor wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142526A (en) * 1983-12-29 1985-07-27 Toshiba Corp Measurement of electrical characteristics of semiconductor element
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
JPS63110672A (en) * 1986-10-28 1988-05-16 Sumitomo Electric Ind Ltd Measurement of semiconductor pressure sensor
JPS63110671A (en) * 1986-10-28 1988-05-16 Sumitomo Electric Ind Ltd Measurement of semiconductor pressure sensor
JPH0413867B2 (en) * 1986-10-28 1992-03-11 Sumitomo Electric Industries
JPH0413868B2 (en) * 1986-10-28 1992-03-11 Sumitomo Electric Industries
JPH05326655A (en) * 1992-07-22 1993-12-10 Tokyo Electron Ltd Measuring method of semiconductor wafer

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