JPS5556638A - Apparatus for manufacturing semiconductor device - Google Patents

Apparatus for manufacturing semiconductor device

Info

Publication number
JPS5556638A
JPS5556638A JP13021878A JP13021878A JPS5556638A JP S5556638 A JPS5556638 A JP S5556638A JP 13021878 A JP13021878 A JP 13021878A JP 13021878 A JP13021878 A JP 13021878A JP S5556638 A JPS5556638 A JP S5556638A
Authority
JP
Japan
Prior art keywords
frame
elements
guide
film
film carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13021878A
Other languages
Japanese (ja)
Inventor
Hiroshi Aoyama
Susumu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13021878A priority Critical patent/JPS5556638A/en
Publication of JPS5556638A publication Critical patent/JPS5556638A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve adherence properties between a lead frame and a film carrier guide, by positioning the lead frame at a right bonding location by mounting a vacuum adsorptive mechanism to a film carrier guide portion.
CONSTITUTION: A holding plate 2 is placed on an XY table 4, and a plurality of semiconductor elements 1, onto which end portion surfaces bumps 6 are installed, are disposed onto the plate 2 by using wax 3 while parting the elements by means of grooves 5. A continuous film 7 made of an insulator with holes 8, which are slightly larger than the elements 1, is placed on these elements 1, and an inner lead 10 from a lead frame 9 formed to the film 7 is faced to the bump 6 exposed into the hole 8. A film carrier guide 12 is put on the frame 9, but the inside is hollowed as shown in 12a of the figure and adsorptive holes 16 with exhaust ports 17 are beforehand mounted at the both sides of a central hole, to which a bonding tool 11 falls, in the guide 12 at that time. Thus, the frame 9 is accurately positioned if frame-feeding the frame 9 by evacuating and releasing the inside of the guide 12.
COPYRIGHT: (C)1980,JPO&Japio
JP13021878A 1978-10-23 1978-10-23 Apparatus for manufacturing semiconductor device Pending JPS5556638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13021878A JPS5556638A (en) 1978-10-23 1978-10-23 Apparatus for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13021878A JPS5556638A (en) 1978-10-23 1978-10-23 Apparatus for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5556638A true JPS5556638A (en) 1980-04-25

Family

ID=15028904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13021878A Pending JPS5556638A (en) 1978-10-23 1978-10-23 Apparatus for manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5556638A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555304A (en) * 1991-08-27 1993-03-05 Matsushita Electron Corp Carrier table guide and its retaining device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555304A (en) * 1991-08-27 1993-03-05 Matsushita Electron Corp Carrier table guide and its retaining device

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