JPS556872A - Bonding method of semiconductor element - Google Patents

Bonding method of semiconductor element

Info

Publication number
JPS556872A
JPS556872A JP7954078A JP7954078A JPS556872A JP S556872 A JPS556872 A JP S556872A JP 7954078 A JP7954078 A JP 7954078A JP 7954078 A JP7954078 A JP 7954078A JP S556872 A JPS556872 A JP S556872A
Authority
JP
Japan
Prior art keywords
semiconductor element
adsorptive
jig
vacuum
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7954078A
Other languages
Japanese (ja)
Inventor
Yoshio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7954078A priority Critical patent/JPS556872A/en
Publication of JPS556872A publication Critical patent/JPS556872A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To improve operation efficiency, by admitting an adsorptive surface convex portion of a jig for bonding a semiconductor for vacuum adsorbing a semiconductor element into a concave portion of the semiconductor element and by positioning the convex portion, by adsorbing the semiconductor element, by carrying the jig to a bonding portion and by joining the element and the bonding portion.
CONSTITUTION: A projection 7 is mounted on an adsorptive surface of a semiconductor element of a vacuum adsorptive jig 6. A hole 8 conforming to the projection 7 is drilled to a semiconductor element 9 so that the adsorptive surface of the semiconductor element of the vacuum adsorptive jig 6 not contact with a surface of the semiconductor element. The operation efficiency of semiconductor element bonding is improved because the use of such a vacuum adsorptive jig 6 eliminated the need for exchanging vacuum jigs even if the semiconductor element change.
COPYRIGHT: (C)1980,JPO&Japio
JP7954078A 1978-06-29 1978-06-29 Bonding method of semiconductor element Pending JPS556872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7954078A JPS556872A (en) 1978-06-29 1978-06-29 Bonding method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7954078A JPS556872A (en) 1978-06-29 1978-06-29 Bonding method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS556872A true JPS556872A (en) 1980-01-18

Family

ID=13692822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7954078A Pending JPS556872A (en) 1978-06-29 1978-06-29 Bonding method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS556872A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024079975A1 (en) * 2022-10-14 2024-04-18 株式会社新川 Device for manufacturing semiconductor device and method for suctioning member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024079975A1 (en) * 2022-10-14 2024-04-18 株式会社新川 Device for manufacturing semiconductor device and method for suctioning member

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