JPS53123665A - Mounting method for semiconductor element - Google Patents

Mounting method for semiconductor element

Info

Publication number
JPS53123665A
JPS53123665A JP3887177A JP3887177A JPS53123665A JP S53123665 A JPS53123665 A JP S53123665A JP 3887177 A JP3887177 A JP 3887177A JP 3887177 A JP3887177 A JP 3887177A JP S53123665 A JPS53123665 A JP S53123665A
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting method
mount
improving
efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3887177A
Other languages
Japanese (ja)
Inventor
Toshio Morishige
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3887177A priority Critical patent/JPS53123665A/en
Publication of JPS53123665A publication Critical patent/JPS53123665A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Abstract

PURPOSE: To mount an element accurately with improving the efficiency through the simplified operations, by using a powdery brazing material for connecting the semiconductor element to a base body.
COPYRIGHT: (C)1978,JPO&Japio
JP3887177A 1977-04-04 1977-04-04 Mounting method for semiconductor element Pending JPS53123665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3887177A JPS53123665A (en) 1977-04-04 1977-04-04 Mounting method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3887177A JPS53123665A (en) 1977-04-04 1977-04-04 Mounting method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS53123665A true JPS53123665A (en) 1978-10-28

Family

ID=12537265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3887177A Pending JPS53123665A (en) 1977-04-04 1977-04-04 Mounting method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS53123665A (en)

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