JPS52127072A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS52127072A
JPS52127072A JP4336576A JP4336576A JPS52127072A JP S52127072 A JPS52127072 A JP S52127072A JP 4336576 A JP4336576 A JP 4336576A JP 4336576 A JP4336576 A JP 4336576A JP S52127072 A JPS52127072 A JP S52127072A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding apparatus
working
provision
eliminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4336576A
Other languages
Japanese (ja)
Other versions
JPS5750055B2 (en
Inventor
Nobuhito Yamazaki
Minoru Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Hitachi Ltd
Original Assignee
Shinkawa Ltd
Hitachi Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Hitachi Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP4336576A priority Critical patent/JPS52127072A/en
Publication of JPS52127072A publication Critical patent/JPS52127072A/en
Publication of JPS5750055B2 publication Critical patent/JPS5750055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the reliability in working by eliminating the difference in the bonding working levels by the provision of vertical positioning means on a positioning bed with the upper surface of a part substrate as a reference.
COPYRIGHT: (C)1977,JPO&Japio
JP4336576A 1976-04-16 1976-04-16 Wire bonding apparatus Granted JPS52127072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4336576A JPS52127072A (en) 1976-04-16 1976-04-16 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4336576A JPS52127072A (en) 1976-04-16 1976-04-16 Wire bonding apparatus

Publications (2)

Publication Number Publication Date
JPS52127072A true JPS52127072A (en) 1977-10-25
JPS5750055B2 JPS5750055B2 (en) 1982-10-25

Family

ID=12661815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4336576A Granted JPS52127072A (en) 1976-04-16 1976-04-16 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS52127072A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011005500A (en) * 2009-06-23 2011-01-13 Toshiba Mitsubishi-Electric Industrial System Corp Substrate fixing table and ultrasonic welding apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502465U (en) * 1973-05-12 1975-01-11
JPS502465A (en) * 1973-05-07 1975-01-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502465A (en) * 1973-05-07 1975-01-11
JPS502465U (en) * 1973-05-12 1975-01-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011005500A (en) * 2009-06-23 2011-01-13 Toshiba Mitsubishi-Electric Industrial System Corp Substrate fixing table and ultrasonic welding apparatus

Also Published As

Publication number Publication date
JPS5750055B2 (en) 1982-10-25

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