JPS5750055B2 - - Google Patents
Info
- Publication number
- JPS5750055B2 JPS5750055B2 JP51043365A JP4336576A JPS5750055B2 JP S5750055 B2 JPS5750055 B2 JP S5750055B2 JP 51043365 A JP51043365 A JP 51043365A JP 4336576 A JP4336576 A JP 4336576A JP S5750055 B2 JPS5750055 B2 JP S5750055B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336576A JPS52127072A (en) | 1976-04-16 | 1976-04-16 | Wire bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336576A JPS52127072A (en) | 1976-04-16 | 1976-04-16 | Wire bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52127072A JPS52127072A (en) | 1977-10-25 |
| JPS5750055B2 true JPS5750055B2 (en) | 1982-10-25 |
Family
ID=12661815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4336576A Granted JPS52127072A (en) | 1976-04-16 | 1976-04-16 | Wire bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52127072A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5420990B2 (en) * | 2009-06-23 | 2014-02-19 | 東芝三菱電機産業システム株式会社 | Substrate fixing table and ultrasonic bonding apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS502465A (en) * | 1973-05-07 | 1975-01-11 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS502465U (en) * | 1973-05-12 | 1975-01-11 |
-
1976
- 1976-04-16 JP JP4336576A patent/JPS52127072A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS502465A (en) * | 1973-05-07 | 1975-01-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52127072A (en) | 1977-10-25 |