JPS564233A - Continuous handling apparatus for wafer - Google Patents

Continuous handling apparatus for wafer

Info

Publication number
JPS564233A
JPS564233A JP7919279A JP7919279A JPS564233A JP S564233 A JPS564233 A JP S564233A JP 7919279 A JP7919279 A JP 7919279A JP 7919279 A JP7919279 A JP 7919279A JP S564233 A JPS564233 A JP S564233A
Authority
JP
Japan
Prior art keywords
wafer
handler
tip
cartridge
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7919279A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Masakuni Akiba
Kunio Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7919279A priority Critical patent/JPS564233A/en
Publication of JPS564233A publication Critical patent/JPS564233A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Abstract

PURPOSE:To avoid the damage on the wafer surface and sticking of foreign matters by enclosing a wafer in a cartridge with the surface of the wafer being upward in a loader and unloader portions, carrying the wafer with the back of the wafer being upward, and placing the wafer an a processing portion. CONSTITUTION:A pusher 11 is inserted into the shelf of a cartridge 10, and a wafer W is pushed out. The surface of the wafer is facing upward, and a pusher tip 15 attracts the one edge of the back of the wafer. The tip 15 turns by 180 deg., and a tip 19 of a handler 18 attracts the back. In this state, the wafer W is carried to a recess 8 of an upper suceptor 5 in a reaction furnace 1. The handler 18 descends and releases the attraction, the wafer is placed on the recess 8, and the handler is returned. The cartridge changes the height to the position of the next shelf. The suceptor rotates one step, and the next recess comes to the wafer descending position. At the unloader portion, the handling is carried out in the reverse order. In this method, the heat treating is automatically performed without damaging and contaminating the wafer surface to be machined, and the yield rate can be improved.
JP7919279A 1979-06-25 1979-06-25 Continuous handling apparatus for wafer Pending JPS564233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7919279A JPS564233A (en) 1979-06-25 1979-06-25 Continuous handling apparatus for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7919279A JPS564233A (en) 1979-06-25 1979-06-25 Continuous handling apparatus for wafer

Publications (1)

Publication Number Publication Date
JPS564233A true JPS564233A (en) 1981-01-17

Family

ID=13683104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7919279A Pending JPS564233A (en) 1979-06-25 1979-06-25 Continuous handling apparatus for wafer

Country Status (1)

Country Link
JP (1) JPS564233A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170519A (en) * 1981-03-27 1982-10-20 Western Electric Co Device and method for coating molecle beam
JPS59119847A (en) * 1982-12-27 1984-07-11 Seiichiro Sogo Device for transferring silicon wafer and the like
JPH01135015A (en) * 1987-11-20 1989-05-26 Fuji Electric Co Ltd Semiconductor wafer treating device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124870A (en) * 1976-04-13 1977-10-20 Nec Corp Automatic wafer feeder
JPS5932368A (en) * 1982-08-12 1984-02-21 Toshiba Electric Equip Corp High frequency transistor inverter device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124870A (en) * 1976-04-13 1977-10-20 Nec Corp Automatic wafer feeder
JPS5932368A (en) * 1982-08-12 1984-02-21 Toshiba Electric Equip Corp High frequency transistor inverter device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170519A (en) * 1981-03-27 1982-10-20 Western Electric Co Device and method for coating molecle beam
JPS59119847A (en) * 1982-12-27 1984-07-11 Seiichiro Sogo Device for transferring silicon wafer and the like
JPS635899B2 (en) * 1982-12-27 1988-02-05 Kurotani Nobuko
JPH01135015A (en) * 1987-11-20 1989-05-26 Fuji Electric Co Ltd Semiconductor wafer treating device
JPH0652721B2 (en) * 1987-11-20 1994-07-06 富士電機株式会社 Semiconductor wafer processing equipment

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