JPS553608A - Supplying method for plurality of article - Google Patents

Supplying method for plurality of article

Info

Publication number
JPS553608A
JPS553608A JP7417478A JP7417478A JPS553608A JP S553608 A JPS553608 A JP S553608A JP 7417478 A JP7417478 A JP 7417478A JP 7417478 A JP7417478 A JP 7417478A JP S553608 A JPS553608 A JP S553608A
Authority
JP
Japan
Prior art keywords
holes
jig
region
plate
disks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7417478A
Other languages
Japanese (ja)
Inventor
Joichiro Kageyama
Kenji Azuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP7417478A priority Critical patent/JPS553608A/en
Publication of JPS553608A publication Critical patent/JPS553608A/en
Pending legal-status Critical Current

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  • Manipulator (AREA)

Abstract

PURPOSE: Charging rate of the fixed number of articles arranged in the article mounting region can be improved to almost 100% by placing a plurality of holders, under operating state, sequentially on the articles and shifting them to the desired supply position after vacuum attraction.
CONSTITUTION: After mounting an arrangement plate 11 including respective article mounting regions A and B on a vibrating machine 10, a group of accommodation holes 13 which are adapted to receive solder disks 12 are disposed in these regions A and B. In this case, holes 13 must coinside with an arrangement of pellet accommodation grooves 16 in a jig on which the pellets are to be mounted. The solder disks 12 mounted on the plate 11 are then fitted into the holes 13 by vibrating the plate 11. At this stage, remove the disks which are not entered into the holes 13 and then bring a holding jig 17 having vacuum suction portion 18 corresponding to the holes 13 to the region A. Thereafter, the jig 17 is moved to the region B to attract the remainders which are not picked up in the reion A, and vacuum is released after transferring it to the pellets 14 which the accommodation holes 16 on the jig 15.
COPYRIGHT: (C)1980,JPO&Japio
JP7417478A 1978-06-21 1978-06-21 Supplying method for plurality of article Pending JPS553608A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7417478A JPS553608A (en) 1978-06-21 1978-06-21 Supplying method for plurality of article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7417478A JPS553608A (en) 1978-06-21 1978-06-21 Supplying method for plurality of article

Publications (1)

Publication Number Publication Date
JPS553608A true JPS553608A (en) 1980-01-11

Family

ID=13539524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7417478A Pending JPS553608A (en) 1978-06-21 1978-06-21 Supplying method for plurality of article

Country Status (1)

Country Link
JP (1) JPS553608A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850751A (en) * 1981-09-22 1983-03-25 Shinkawa Ltd Replacing method for die
JPS62246466A (en) * 1986-03-21 1987-10-27 ユナイテツド・テクノロジ−ズ・コ−ポレイシヨン Method of arranging grain of single layer on surface of article
JP6927542B1 (en) * 2020-12-11 2021-09-01 公立大学法人 富山県立大学 Pin transfer device, pin transfer method and processing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850751A (en) * 1981-09-22 1983-03-25 Shinkawa Ltd Replacing method for die
JPS6243542B2 (en) * 1981-09-22 1987-09-14 Shinkawa Kk
JPS62246466A (en) * 1986-03-21 1987-10-27 ユナイテツド・テクノロジ−ズ・コ−ポレイシヨン Method of arranging grain of single layer on surface of article
JP6927542B1 (en) * 2020-12-11 2021-09-01 公立大学法人 富山県立大学 Pin transfer device, pin transfer method and processing device
WO2022123871A1 (en) * 2020-12-11 2022-06-16 公立大学法人富山県立大学 Pin transfer device, pin transfer method, and processing device
JP2022093203A (en) * 2020-12-11 2022-06-23 公立大学法人 富山県立大学 Pin transfer device, pin transfer method, and processing device
TWI788051B (en) * 2020-12-11 2022-12-21 公立大學法人富山縣立大學 Pin transfer device, pin transfer method, and processing device

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