JPS6243542B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a die repacking method performed in the manufacturing process of semiconductor devices.

In general, in semiconductor device manufacturing, a die is divided into a plurality of vertical and horizontal parts and placed on a wafer ring, and then picked up by a die pickup device and repacked into a tray. This die repacking method picks up and transfers the die from the wafer ring using a transfer collect.
Fill the tray. Each time the tray is loaded, the tray is driven one step to position the next compartment.

However, due to a defective die pick-up or the like, the die may not be accurately stored in the tray, and may end up climbing onto the partition of the tray. Conventionally, in such cases, it was necessary to manually reinsert the device into its normal position, which was extremely inefficient.

The present invention was made against this background.
To provide a die refilling method capable of accurately refilling and storing dies in a tray.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.
FIG. 1 is a perspective view of essential parts of a die pickup device used in the method of the present invention, and FIG. 2 is a perspective view of a tray drive section. The wafer ring 2 on which the die 1 is divided into a plurality of vertical and horizontal parts is
It is designed to be driven in the direction. A transfer collet 3 for sucking and transferring the die 1 is fixed to one end of a collet arm 4, and the other end of the collet arm 4 is fixed to a rotary shaft 6 provided on a support arm 5 so as to be movable up and down and pivotable.

A tray 10 that stores the die 1 that has been suctioned and transferred by the transfer collet 3 is attached to a jig holder 11.
As shown in FIG. 3, recesses 10a for accommodating the die 1 are formed at equal intervals vertically and horizontally. The jig holder 11 is fixed to a Y table 13 that is driven in the Y direction by a Y direction drive motor 12, and the Y table 13 is fixed to an X table 13 that is driven in the X direction by an X direction drive motor 14.
It is slidably mounted on the table 15. That is, by the Y table 13 and the X table 15
It constitutes an XY table.

Next, the method of the present invention will be explained. When the transfer collet 3 attracts the die 1 on the wafer ring 2, the rotating shaft 6 rotates and the die 1 attracted to the transfer collet 3 is located at a predetermined position above the tray 10. Subsequently, transfer collet 3 descends and transfers to tray 1.
The die 1 is placed in the recess 10a of the die 1. At this time, the die 1 may not fit into the recess 10a of the tray 10 accurately, resulting in the states shown in FIGS. 4a, b, and c. Therefore, the Y drive motor 12 and the X drive motor 1
4 simultaneously input forward and reverse pulse signals to give the XY tables 13 and 15 one or more reciprocating motions. As a result, the tray 10 reciprocates in an oblique direction and vibrates. This vibration causes Fig. 4 a, b,
The tray in the state shown in c is accurately stored in the recess 10a of the tray 10 as shown in d of the same figure. after that,
Next, the Y-direction drive motor 12 and the X-direction drive motor 14 are driven so that the recessed portion 10a to be accommodated is positioned at a predetermined position, and the tray 10 is driven one step. On the other hand, when the die 1 is sucked and transferred from the wafer ring 2 by the transfer collet 3,
The wafer ring 2 is moved by a drive means (not shown) so that the next die 1 to be attracted is positioned at a predetermined position.
is driven. Thereafter, the above operation is repeated to sequentially store the dies 1 in the tray 10.

In this way, each time the die 1 is stored in the tray 10, vibration is applied to the tray 10, so the fourth
As shown in FIG. e, all the dies 1 are accurately housed in the recess 10a of the tray 10. However, even with this, as shown in FIG.
There may be cases where the value does not fall exactly to 0. Therefore, when all the dies 1 are repacked into the tray 10, the Y-direction driving motor 12 and the X-direction driving motor 14 are reciprocated so as to finally give the tray 10 a vibration with a longer period than the vibration described above. As a result, it is completely retracted as shown in FIG. 4e.

In the above embodiment, both the Y-direction drive motor 12 and the X-direction drive motor 14 are driven to give vibration to the tray 10, but only one of them may be driven. but,
It is more effective to drive both at the same time. Furthermore, the vibration locus is not limited to a reciprocating straight line; for example, the Y-direction driving motor 12 and the It may also be moved in a circular manner. Further, in the above embodiment, the tray 10 is vibrated each time a die 1 is stored in the tray 10, but the vibration may be applied only after all the dies 1 are stored in the tray 10.

As is clear from the above explanation, according to the method of the present invention, the die is accurately stored in the tray.
Work efficiency is significantly improved. In addition, there is no need to add any special equipment to give vibration to the tray.
Since a pulse motor is used to operate the tray,
The cost of the equipment does not increase. Furthermore, since vibration is applied using a pulse motor, the period, amplitude, frequency, and direction of vibration can be set freely.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the main parts of the die pickup device used in the method of the present invention, FIG. 2 is a perspective view of the tray drive unit, FIG. 3 is an enlarged perspective view of the tray, and FIGS.
f is a plan view and a side view of a state in which the tray is repacked with dies. 1...Die, 3...Transfer collet, 10...Tray, 12...Y direction drive motor, 14...X
Directional drive motor.

Claims (1)

[Claims] 1. A tray with recesses formed at equal intervals vertically and horizontally to accommodate the dies, and an XY tray to position and place the tray.
A table, a Y-direction drive motor and an X-direction drive motor that drive the XY table in the Y direction and the After the die is stored in the recess of the tray, the Y-direction drive motor and the
In the step-driven die repacking method,
After the die is stored in the tray in the transfer collet, forward and reverse pulses are input to at least one of the Y-direction drive motor and the X-direction drive motor to vibrate the tray and drive the die. A die refilling method characterized by aligning and storing dies in a tray.