JPS6443419A - Supply device for hybrid integrated circuit substrate where duplex printing is effected - Google Patents

Abstract

PURPOSE:To automatically supply a substrate by sensing a spacer from a magazine just under an integrated circuit substrate and holding the spacer by a cripper in such a manner as to place the substrate to be transferred and loaded on a mesh conveyer in a supply device to a kiln. CONSTITUTION:Hybrid integrated circuit substrates 20 in a magazine are intermittently discharged onto a transport conveyer 21 and transported to an elevating locus corresponding position of a lift 13 by three at a time. On the other hand, a jig magazine 6 is moved to a position corresponding to the lift 3 by a conveyer 7, and a support table 17 is lifted to lift up a spacer in the magazine and position same just under an integrated circuit substrate 20. Subsequently, the substrate 20 is held through the spacer with a finger 39 by movement of a feeder 33 and lowering of a gripper 37. After that, the gripper 37 is lifted, the feeder 33 is moved, the gripper 37 is lowered, and the finger 39 is released to transfer and load the substrate 20 and the spacer on the mesh conveyer 2. Thus, a substrate can be automatically supplied.