CN109862700B - Automatic circuit board feeding method and system - Google Patents
Automatic circuit board feeding method and system Download PDFInfo
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- CN109862700B CN109862700B CN201910095317.0A CN201910095317A CN109862700B CN 109862700 B CN109862700 B CN 109862700B CN 201910095317 A CN201910095317 A CN 201910095317A CN 109862700 B CN109862700 B CN 109862700B
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Abstract
The invention discloses an automatic circuit board feeding method and system, wherein the automatic circuit board feeding method comprises the following steps: controlling a material grabbing device to grab the substrate to be baked, which is placed on the material loading platform; controlling the substrate to be baked to rotate to a non-horizontal state; and placing the substrate to be baked into a clamping position of a clamping frame so as to clamp the substrate to be baked in the clamping frame. The feeding method can realize the automatic placing of the substrate to be baked into the clamping frame, thereby improving the automation and mechanization degree of feeding, improving the processing efficiency of the baking and manufacturing process of the circuit board, reducing the labor intensity of operators and reducing the labor cost. After the substrate to be baked is rotated to a non-horizontal state, the substrate to be baked is clamped in the clamping frame in a non-horizontal manner; the stress condition of the substrate to be baked in the clamping frame is improved, the phenomenon that the middle part of the substrate to be baked sags due to the gravity of the substrate to be baked can be avoided, and therefore the substrate to be baked is prevented from being bent and even damaged.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to an automatic circuit board feeding method and system.
Background
During the circuit board processing, the circuit board is usually baked. At present, in the baking manufacturing process of a circuit board, manual operation is mainly used, for example, when the circuit board is placed into an oven, a substrate to be baked needs to be manually placed in a clamping frame, and then the clamping frame provided with the substrate to be baked is placed in the oven; therefore, the machining efficiency is low, and the labor intensity of operators is high.
Disclosure of Invention
The invention mainly aims to provide an automatic feeding method of a circuit board, and aims to solve the technical problem of low manual feeding efficiency in the baking and manufacturing process of the circuit board.
In order to achieve the above object, the present invention provides an automatic feeding method for circuit boards, comprising:
controlling a material grabbing device to grab the substrate to be baked, which is placed on the material loading platform;
controlling the substrate to be baked to rotate to a non-horizontal state; and
and placing the substrate to be baked into a clamping position of a clamping frame so as to clamp the substrate to be baked in the clamping frame.
Optionally, when the substrate to be baked rotates to the non-horizontal state, a preset included angle is formed between the substrate to be baked and the horizontal plane, and the preset included angle is greater than or equal to 60 degrees and less than or equal to 90 degrees.
Optionally, the process of placing the substrate to be baked into the clamping position of the clamping frame includes:
controlling the substrate to be baked to rotate by a preset angle so that the surface of the substrate to be baked, which is away from the material grabbing device, faces towards the clamping frame;
and controlling the substrate to be baked to move towards the clamping frame so as to enable the substrate to be baked to be placed in the clamping position of the clamping frame.
Optionally, after the substrate to be baked is grabbed by the grabbing device and before the substrate to be baked is placed in the clamping position of the clamping frame, the method further includes:
and flattening the substrate to be baked.
Optionally, the method for flattening the substrate to be baked comprises:
controlling a plurality of flattening devices to respectively and correspondingly grasp a plurality of flattening positions on the substrate to be baked;
and controlling the flattening device to stretch the substrate to be baked in the direction far away from the stress center of the substrate to be baked so as to flatten the substrate to be baked.
Optionally, the feeding platform is a lifting platform, and multiple layers of stacked substrates to be baked are placed on the feeding platform;
the method for grabbing the substrate to be baked placed on the feeding platform by the grabbing device comprises the following steps:
controlling the material grabbing device to grab the substrate to be baked, which is placed on the uppermost layer of the material loading platform; and
and after the uppermost layer of the substrate to be baked on the feeding platform is grabbed, controlling the feeding platform to ascend to a preset height so as to change the next layer of the substrate to be baked into the uppermost layer of the substrate to be baked.
Optionally, the step of clamping the substrate to be baked in the clamping frame comprises:
when the substrate to be baked is placed in the clamping position of the clamping frame, the clamping hands of the clamping frame rotate inwards to clamp the periphery of the substrate to be baked.
The invention also provides an automatic circuit board feeding system, which comprises:
the feeding platform is used for placing a substrate to be baked;
a material grabbing device;
the clamping frame is provided with a clamping position and is used for clamping the substrate to be baked; and
the control system is used for controlling the material grabbing device to grab the substrate to be baked, which is placed on the material loading platform; the material grabbing device is also used for controlling the material grabbing device to drive the substrate to be baked to rotate so as to enable the substrate to be baked to rotate to be in a non-horizontal state; and the material grabbing device is also used for controlling the substrate to be baked to be placed in the clamping position of the clamping frame.
Optionally, the method further comprises:
a plurality of spreading devices;
wherein the control system is further configured to: controlling a plurality of spreading devices to respectively grip a plurality of spreading positions on the substrate to be baked; and controlling the spreading device to stretch the substrate to be baked in a direction away from the stress center of the substrate to be baked so as to spread the substrate to be baked.
Optionally, the material grabbing device is a sucker type manipulator; and/or
The clamping frame comprises a bottom plate and a plurality of clamping hands distributed on the periphery of the bottom plate at intervals, and the clamping positions are surrounded by the plurality of clamping hands; the clamping hand is rotatably arranged on the bottom plate, so that the clamping hand clamps or loosens the substrate to be baked.
The feeding method can realize the automatic placing of the substrate to be baked into the clamping frame, thereby improving the automation and mechanization degree of feeding, improving the processing efficiency of the baking and manufacturing process of the circuit board, reducing the labor intensity of operators and reducing the labor cost.
In addition, the feeding method of the invention rotates the substrate to be baked to be in a non-horizontal state, and then clamps the substrate to be baked in the clamping frame in a non-horizontal manner; the stress condition of the substrate to be baked in the clamping frame is improved, the influence of the gravity of the substrate to be baked on the deformation of the substrate can be reduced, the phenomenon that the middle part of the substrate to be baked sags due to the gravity of the substrate to be baked can be avoided, and the substrate to be baked is prevented from being bent or even damaged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating an automatic circuit board loading method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the automatic circuit board loading system according to the first embodiment of the present invention;
FIG. 3 is a schematic diagram of the automatic circuit board loading system according to a second embodiment of the present invention;
FIG. 4 is a schematic diagram of the automatic circuit board loading system according to a third embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating operations of an automatic circuit board loading system according to a fourth embodiment of the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides an automatic feeding method of a circuit board; the invention has more obvious effect especially for thin or ultrathin circuit boards.
In an embodiment of the present invention, as shown in fig. 1 to 5, the automatic circuit board feeding method (hereinafter referred to as a feeding method) includes:
and S10, controlling the material grabbing device 10 to grab the substrate 200 to be baked, which is placed on the material loading platform 20.
Wherein, treat to roast base plate 200 and place on material loading platform 20, the material loading base plate is generally the level setting, treat that roast base plate 200 also adapts to and is the horizontality and places.
The material grabbing device 10 is a material grabbing mechanical arm; grab the structural style of material manipulator and have a lot of, as long as can realize the function of this application can.
Optionally, the material grabbing device 10 is a suction cup type manipulator. When the material grabbing device 10 grabs the substrate 200 to be baked, the material grabbing device 10 adsorbs a surface of the substrate 200 to be baked, which is away from the feeding platform 20, and the surface is a first surface of the substrate 200 to be baked.
Optionally, the feeding platform 20 is a lifting platform, the feeding platform 20 can be lifted, and multiple layers of stacked substrates 200 to be baked are placed on the feeding platform 20; specifically, step S10 includes:
s11, controlling the material grabbing device 10 to grab the substrate 200 to be baked, which is placed on the uppermost layer of the material loading platform 20; and
after the substrate 200 to be baked on the uppermost layer of the feeding platform 20 is grabbed, the feeding platform 20 is controlled to ascend by a preset height, so that the substrate 200 to be baked on the next layer becomes the substrate 200 to be baked on the uppermost layer. The preset height may be set according to the thickness of the substrate 200 to be baked.
Optionally, the feeding platform 20 may also be configured as a conveying platform, a position to be grasped is arranged on the feeding platform 20, and when the substrate 200 to be baked moves to the position to be grasped, the material grasping device 10 grasps the substrate 200 to be baked that moves to the position to be grasped.
And clamping the substrate 200 to be baked in the clamping frame 30 non-horizontally.
The process of clamping the substrate 200 to be baked in the clamping frame 30 in a non-horizontal manner includes:
and S20, controlling the substrate 200 to be baked to rotate to a non-horizontal state.
Specifically, S21, controlling the material grabbing device 10 to drive the substrate 200 to be baked to move, so that the substrate 200 to be baked is far away from the feeding platform 20; so as to avoid the interference of the loading platform 20 with the subsequent actions.
S22, controlling the material grabbing device 10 to drive the substrate 200 to be baked to rotate, so that the substrate 200 to be baked rotates to a non-horizontal state, so as to install the substrate 200 to be baked into the clamping frame 30 in the non-horizontal state.
And S40, placing the substrate 200 to be baked into the clamping position of the clamping frame 30, so that the substrate 200 to be baked is clamped in the clamping frame 30.
Specifically, as shown in fig. 2e, 2f, 3e, 3f, 5f, and 5d, the material grabbing device 10 is controlled to drive the substrate 200 to be baked to move, so that the substrate 200 to be baked is placed in the clamping position of the clamping frame 30; after the substrate 200 to be baked is placed in the clamping position of the clamping frame 30, the clamping frame 30 clamps the substrate 200 to be baked in the clamping frame 30 in a non-horizontal manner.
Specifically, in this example, the inclination angle when the substrate 200 to be baked is rotated to the non-horizontal state is equal to the inclination angle when the substrate 200 to be baked is clamped in the clamp frame 30.
Finally, the clamping frame 30 holding the substrate 200 to be baked may be placed in an oven (not shown).
It can be understood that the feeding method of the present invention can realize the automatic placing of the substrate 200 to be baked into the clamping frame 30, thereby improving the automation and mechanization degree of feeding, so as to improve the processing efficiency in the baking manufacturing process of the circuit board, reduce the labor intensity of the operator, and reduce the labor cost.
In addition, in the feeding method of the present invention, after the substrate 200 to be baked is rotated to a non-horizontal state, the substrate 200 to be baked is clamped in the clamping frame 30 in a non-horizontal manner; the stress condition of the substrate 200 to be baked in the clamping frame 30 is improved, the influence of the gravity of the substrate 200 to be baked on the deformation of the substrate can be reduced, the sagging of the middle part of the substrate 200 to be baked caused by the gravity of the substrate can be avoided, and the bending and even the breakage of the substrate 200 to be baked can be avoided.
Further, when the substrate 200 to be baked rotates to the non-horizontal state, a preset included angle is formed between the substrate 200 to be baked and the horizontal plane, and the preset included angle is greater than or equal to 60 degrees and smaller than or equal to 90 degrees.
It will be appreciated that the predetermined angle is an acute or right angle. If the preset angle is too small, the stress condition of the substrate 200 to be baked in the clamping frame 30 is not obviously improved, or the improvement cannot achieve the expected effect; the stress analysis of the substrate 200 to be baked is easy to know, the larger the angle of the preset included angle is, the more obvious the stress condition of the substrate 200 to be baked in the clamping frame 30 is improved, and the smaller the influence of the gravity of the substrate on the deformation of the substrate is; when the preset included angle is 90 degrees, the improvement is most obvious, and at the moment, the substrate 200 to be baked is in a vertical state.
In this embodiment, the predetermined included angle is 90 degrees, that is, in S20, the substrate 200 to be baked is rotated to a vertical state. In this way, after the substrate 200 to be baked is rotated to the vertical state, the substrate 200 to be baked is vertically clamped in the clamping frame 30; the stress of the substrate 200 to be baked in the clamping frame 30 is further improved, the influence of the gravity of the substrate 200 to be baked on the deformation thereof can be further reduced, and the sagging of the middle part of the substrate 200 to be baked due to the gravity of the substrate can be further avoided, so that the substrate 200 to be baked can be further prevented from being bent or even damaged. Thereby improving the yield of the circuit board.
According to the structure of the material grabbing device 10 and the position of the material grabbing device 10, the process of non-horizontally clamping the substrate 200 to be baked in the clamping frame 30 is different, and the following description is given by taking the structure and the position of the material grabbing device 10 as an example; it will be appreciated that many more material handling devices 10, and methods of placing them, will be apparent to those skilled in the art from the following examples.
In the first embodiment, as shown in fig. 2, the material grabbing device 10 comprises a frame (not shown), a slide arm 11, a cantilever 12, a rotating arm 13 and a grabbing part 14, wherein the slide arm 11 is slidably mounted on the frame in the up-down direction; the cantilever 12 is suspended below the slide arm 11, and one end of the cantilever 12 is slidably mounted on the slide arm 11 along a transverse direction, wherein the transverse direction is a horizontal direction perpendicular to the up-down direction, such as a left-right direction in the drawing; one end of the rotating arm 13 is rotatably arranged at the other end of the cantilever 12; the grasping portion 14 is attached to the other end of the rotating arm 13.
As shown in fig. 2, the material grabbing device 10 is arranged above the feeding platform 20.
Based on this, as shown in fig. 2b-2e, the process of placing the substrate 200 to be baked into the clamping position of the clamping frame 30 includes:
and S20, controlling the substrate 200 to be baked to rotate to a non-horizontal state.
Specifically, S20 includes:
and S21, controlling the material grabbing device 10 to drive the substrate 200 to be baked to move, so that the substrate 200 to be baked is far away from the feeding platform 20.
Specifically, as shown in fig. 2b, the slide arm 11 is controlled to move upward to drive the substrate 200 to be baked to move upward, so that the substrate 200 to be baked is far away from the feeding platform 20.
And S22, controlling the material grabbing device 10 to drive the substrate 200 to be baked to rotate, so that the substrate 200 to be baked rotates to a non-horizontal state.
Specifically, as shown in fig. 2c, the control rotating arm 13 drives the substrate 200 to be baked to rotate to a side close to the clamping frame 30, so that the surface of the substrate 200 to be baked, which is away from the material grabbing device 10, faces the clamping frame 30, and at the same time, the substrate 200 to be baked rotates to a vertical state.
Alternatively, if the center of the substrate 200 to be baked does not correspond to the center of the clamping position of the clamping frame 30 after the substrate 200 to be baked rotates to the vertical state, the slide arm 11 may be controlled to move in the vertical direction, so that the center of the substrate 200 to be baked corresponds to the center of the clamping position of the clamping frame 30, and the substrate 200 to be baked may be conveniently placed in the clamping position. Of course, this step may also be designed in advance, so that after the substrate 200 to be baked is rotated to the vertical state, the center of the substrate 200 to be baked corresponds to the center of the clamping position of the clamping frame 30.
S40, placing the substrate 200 into the clamping position of the clamping frame 30, so that the substrate 200 is clamped in the clamping frame 30.
Specifically, as shown in fig. 2e, the cantilever 12 is controlled to drive the substrate 200 to be baked to move toward the clamping frame 30, so that the substrate 200 to be baked is placed in the clamping position; after the substrate 200 to be baked is placed in the clamping position of the clamping frame 30, the clamping frame 30 vertically clamps the substrate 200 to be baked in the clamping frame 30.
In the second embodiment, as shown in fig. 3, the structure of the material grabbing device 10 is basically the same as that of the material grabbing device 10 in the first embodiment. The difference in this embodiment from the first embodiment is in step S21.
In this embodiment, the specific process of step S21 is: the cantilever 12 is controlled to move towards a side close to the clamping frame 30 to drive the substrate 200 to be baked to move towards a side close to the clamping frame 30, so that the substrate 200 to be baked is far away from the loading platform 20.
The remaining steps are substantially the same, see fig. 3a-3f for details, which need not be repeated here.
In the third embodiment, as shown in fig. 4, the material gripping device 10 in this embodiment is different from the material gripping device 10 in the first embodiment in that the cantilever 12 can rotate, that is, the cantilever 12 is rotatably suspended from the slide arm 11. The difference in this embodiment from the first embodiment is in steps S22 and S40.
In this embodiment, as shown in fig. 4a, the specific process of step S22 is: the rotating arm 13 is controlled to drive the substrate 200 to be baked to rotate in a direction not close to the clamping frame 30;
in this embodiment, as shown in fig. 4b, the specific process of step S40 is:
and S41, controlling the substrate 200 to be baked to rotate by a preset angle, so that the surface of the substrate 200 to be baked, which is away from the material grabbing device 10, faces the clamping frame 30.
Specifically, the cantilever 12 is controlled to rotate, that is, the substrate 200 to be baked is controlled to rotate around the cantilever 12, so that the surface of the substrate 200 to be baked, which is away from the material grabbing device 10, faces the clamping frame 30;
and S42, controlling the substrate 200 to be baked to move towards the clamping frame 30, so that the substrate 200 to be baked is placed in the clamping position of the clamping frame 30.
Specifically, the cantilever 12 is controlled to drive the substrate 200 to be baked to move towards the direction close to the clamping frame 30, so that the substrate 200 to be baked is placed in the clamping position; when the substrate 200 to be baked is placed in the clamping position of the clamping frame 30, the clamping frame 30 vertically clamps the substrate 200 to be baked in the clamping frame 30.
In a fourth embodiment, as shown in fig. 5, the material grabbing device 10 comprises a base 15, a supporting arm 16, a telescopic arm 17, a rotating arm 18 and a grabbing part 14, wherein the supporting arm 16 is installed on the base 15, one end of the telescopic arm 17 is connected to the tail end of the supporting arm 16, one end of the rotating arm 18 is rotatably installed at the other end of the telescopic arm 17, and the grabbing part 14 is installed at the other end of the rotating arm 18.
Wherein the support arm 16 is rotatably mounted to the base 15 such that the telescopic arm 17 is rotatable about the support arm 16; the telescopic arm 17 is telescopically arranged so that the arm length of the telescopic arm 17 can be changed.
As shown in fig. 5, the material grabbing device 10 is disposed between the feeding platform 20 and the clamping frame 30.
Based on this, in this embodiment, as shown in fig. 5, the process of placing the substrate 200 to be baked into the clamping position of the clamping frame 30 includes:
and S20, controlling the substrate 200 to be baked to rotate to a non-horizontal state.
Specifically, S20 includes:
and S21, controlling the material grabbing device 10 to drive the substrate 200 to be baked to move, so that the substrate 200 to be baked is far away from the feeding platform 20.
Specifically, as shown in fig. 5b, the telescopic arm 17 is controlled to contract to drive the substrate 200 to be baked to move toward the clamping frame 30, so that the substrate 200 to be baked is far away from the feeding platform 20.
And S22, controlling the material grabbing device 10 to drive the substrate 200 to be baked to rotate, so that the substrate 200 to be baked rotates to a non-horizontal state.
Specifically, as shown in fig. 5c, the rotating arm 13 is controlled to drive the substrate 200 to be baked to rotate to a side away from the clamping frame 30, so that the substrate 200 to be baked rotates to a vertical state; when the substrate 200 to be baked rotates to the vertical state, the surface of the substrate 200 to be baked, which is away from the material grabbing device 10, faces away from the clamping frame 30.
S40, placing the substrate 200 into the clamping position of the clamping frame 30, so that the substrate 200 is clamped in the clamping frame 30.
Specifically, in this embodiment, as shown in fig. 5d-5f, the specific process of step S40 is:
s41, controlling the substrate 200 to be baked to rotate by a preset angle, so that the surface of the substrate 200 to be baked, which is away from the material grabbing device 10, faces the clamping frame 30; wherein the preset angle is 180 degrees.
Specifically, the supporting arm 16 is controlled to rotate, that is, the substrate 200 to be baked is controlled to rotate around the supporting arm 16, so that the surface of the substrate 200 to be baked, which faces away from the material grabbing device 10, faces the clamping frame 30;
and S42, controlling the substrate 200 to be baked to move towards the clamping frame 30, so that the substrate 200 to be baked is placed in the clamping position of the clamping frame 30.
Further, as shown in fig. 2d, 3d, and 5e, after the material grabbing device 10 is controlled to grab the substrate 200 to be baked, which is placed on the material loading platform 20 in step S10, and before the substrate 200 to be baked is placed in the clamping position of the clamping frame 30 in step S40, the material loading method further includes:
and S30, flattening the substrate to be baked 200.
Thus, the substrate 200 to be baked is placed in the clamping frame 30 after being flattened, so that the stress condition of the substrate 200 to be baked in the clamping frame 30 can be further improved, the risk of bending and even breaking of the substrate 200 to be baked can be further reduced, and the yield of the circuit board can be improved.
Further, the method for flattening the substrate 200 to be baked includes:
s31, controlling a plurality of spreading devices (not shown) to correspondingly grip a plurality of spreading positions (not shown) on the substrate 200 to be baked.
Wherein, the spreading device is a spreading manipulator.
Optionally, the number of the spreading devices is two, and the two spreading positions are correspondingly disposed and located on two opposite sides of the substrate 200 to be baked respectively. Specifically, the two leveling devices are controlled to respectively hold two leveling positions located on two opposite sides of the substrate 200 to be baked.
Optionally, the number of the spreading devices may also be four, and four spreading positions are correspondingly provided, and the four spreading positions are respectively located at four sides or four corners of the substrate 200 to be baked.
Of course, the number of spreading devices can be set to other numbers, and need not be described in detail here.
And S20, controlling the flattening device to stretch the substrate 200 to be baked in a direction away from the stress center of the substrate 200 to be baked, so that the substrate 200 to be baked is flattened.
The stress center of the substrate 200 to be baked can be determined by the number of stresses applied to the substrate 200 to be baked and the corresponding stress direction, and need not be described in detail herein.
In the embodiment, the step S30 can be set between the steps S10 and S20, or between the steps S20 and S40, that is, the step of flattening the substrate 200 can be performed before the substrate 200 is rotated to the non-horizontal state, or after the substrate 200 is rotated to the non-horizontal state.
Of course, the step of leveling the substrate 200 may be included, that is, the step of leveling the substrate 200 may be provided once between steps S10 and S20, and the step of leveling the substrate 200 may be provided once between steps S20 and S40.
In the present embodiment, as shown in fig. 2d, 3d and 5e, in order to further reduce the influence of the gravity of the substrate 200 to be baked and consider the cost issue, step S30 is disposed between steps S20 and S40. Thus, the risk of bending and even breaking of the substrate 200 to be baked can be further reduced, and the yield of the circuit board can be improved.
Optionally, the clamping frame 30 includes a bottom plate 31 and a plurality of clamping hands 32 distributed at intervals around the bottom plate 31, and the plurality of clamping hands 32 enclose a clamping position (not shown); the clamping hands 32 are rotatably mounted on the bottom plate 31, so that the clamping hands 32 clamp or release the substrate 200 to be baked.
Specifically, the step of clamping the substrate 200 to be baked in the clamping frame 30 includes:
when the substrate 200 is placed in the clamping position of the clamping frame 30, the clamping hands 32 of the clamping frame 30 rotate inward to clamp the periphery of the substrate 200. Wherein, it is understood that the inward direction is directed to a side near the substrate 200 to be baked.
Thus, the surface of the substrate 200 to be baked can be prevented from being damaged by the clamping frame 30.
Further, as shown in fig. 2f, 3f and 5g, after step S40, the feeding method further includes:
and S50, controlling the material grabbing device 10 to reset so as to repeat the steps S10-S40. Therefore, automatic continuous feeding can be realized.
The resetting process of the gripping device 10 does not need to be described in detail here, with reference to the figures.
The invention also provides an automatic circuit board feeding system (hereinafter referred to as a feeding system). As shown in fig. 2-5, the feeding system 100 includes:
a loading platform 20 for placing the substrate 200 to be baked;
a material grabbing device 10;
a clamping frame 30 having clamping positions (not shown) for clamping the substrate 200 to be baked; and
the control system is used for controlling the material grabbing device 10 to grab the substrate 200 to be baked, which is placed on the material loading platform 20; the material grabbing device 10 is also used for controlling the material grabbing device 10 to drive the substrate 200 to be baked to rotate so as to enable the substrate 200 to be baked to rotate to a non-horizontal state; and is also used for controlling the material grabbing device 10 to place the substrate 200 to be baked into the clamping position of the clamping frame 30.
It can be understood that the feeding system 100 of the present invention can realize the automatic placing of the substrate 200 to be baked into the clamping frame 30, thereby improving the automation and mechanization degree of feeding, so as to improve the processing efficiency of the baking process of the circuit board, reduce the labor intensity of the operator, and reduce the labor cost.
Moreover, the feeding system 100 of the present invention rotates the substrate 200 to be baked to a non-horizontal state, and then clamps the substrate 200 to be baked in the clamping frame 30 in a non-horizontal manner; the stress condition of the substrate 200 to be baked in the clamping frame 30 is improved, the influence of the gravity of the substrate 200 to be baked on the deformation of the substrate can be reduced, the sagging of the middle part of the substrate 200 to be baked caused by the gravity of the substrate can be avoided, and the bending and even the breakage of the substrate 200 to be baked can be avoided.
Optionally, the material grabbing device 10 is a suction cup type manipulator. When the material grabbing device 10 grabs the substrate 200 to be baked, the material grabbing device 10 adsorbs a surface of the substrate 200 to be baked, which is away from the loading platform 20, and the surface is a first surface of the substrate 200 to be baked.
In the first embodiment of the material grabbing device 10, as shown in fig. 2 and 3, the material grabbing device 10 comprises a frame (not shown), a slide arm 11, a cantilever 12, a rotating arm 13 and a grabbing part 14, wherein the slide arm 11 is slidably mounted on the frame in the up-down direction; the cantilever 12 is suspended below the slide arm 11, and one end of the cantilever 12 is slidably mounted on the slide arm 11 along a transverse direction, wherein the transverse direction is a horizontal direction perpendicular to the up-down direction, such as the left-right direction in the figure; one end of the rotating arm 13 is rotatably mounted at the other end of the cantilever 12; the grasping portion 14 is attached to the other end of the rotating arm 13.
In the second embodiment of the material grabbing device 10, as shown in fig. 4, the material grabbing device 10 comprises a frame (not shown), a slide arm 11, a cantilever 12, a rotating arm 13 and a grabbing part 14, wherein the slide arm 11 is slidably mounted on the frame in the up-down direction; the cantilever 12 is suspended below the slide arm 11, and one end of the cantilever 12 is slidably mounted on the slide arm 11 along a transverse direction, wherein the transverse direction is a horizontal direction perpendicular to the up-down direction, such as a left-right direction in the drawing; wherein, in particular, the cantilever 12 is also rotatably suspended from the slide arm 11; one end of the rotating arm 13 is rotatably arranged at the other end of the cantilever 12; the grasping portion 14 is attached to the other end of the rotating arm 13.
In a third embodiment of the material grabbing device 10, as shown in fig. 5, the material grabbing device 10 comprises a base 15, a supporting arm 16, a telescopic arm 17, a rotating arm 18 and a grabbing part 14, wherein the supporting arm 16 is mounted on the base 15, one end of the telescopic arm 17 is connected to the tail end of the supporting arm 16, one end of the rotating arm 18 is rotatably mounted on the other end of the telescopic arm 17, and the grabbing part 14 is mounted on the other end of the rotating arm 18. Wherein the support arm 16 is rotatably mounted to the base 15 such that the telescopic arm 17 is rotatable about the support arm 16; the telescopic arm 17 is telescopically arranged so that the arm length of the telescopic arm 17 can be changed.
Optionally, the feeding platform 20 is a lifting platform, the feeding platform 20 can be lifted, and multiple stacked layers of the to-be-baked substrates 200 are placed on the feeding platform 20. Specifically, after the uppermost substrate 200 to be baked on the feeding platform 20 is grabbed, the feeding platform 20 is controlled to ascend by a preset height, so that the next substrate 200 to be baked becomes the uppermost substrate 200 to be baked. The preset height may be set according to the thickness of the substrate 200 to be baked.
Optionally, the feeding platform 20 may also be configured as a conveying platform, a position to be grasped is arranged on the feeding platform 20, and when the substrate 200 to be baked moves to the position to be grasped, the material grasping device 10 grasps the substrate 200 to be baked, which moves to the position to be grasped.
Of course, the loading platform 20 may be configured in other structural forms, and therefore, a detailed description thereof is not required.
Optionally, the clamping frame 30 includes a bottom plate 31 and a plurality of clamping hands 32 distributed at intervals around the bottom plate 31, and the plurality of clamping hands 32 enclose a clamping position (not shown); the clamping handle 32 is rotatably mounted on the bottom plate 31, so that the clamping handle 32 clamps or releases the substrate 200 to be baked. Specifically, when the substrate 200 to be baked is placed in the clamping position of the clamping frame 30, the clamping fingers 32 of the clamping frame 30 rotate inward to clamp the periphery of the substrate 200 to be baked.
Thus, the surface of the substrate 200 to be baked can be prevented from being damaged by the clamping frame 30.
Further, as shown in fig. 2 to 5, the feeding system 100 further includes:
a plurality of spreading devices;
wherein the control system is further configured to: controlling a plurality of the leveling devices to respectively grip a plurality of leveling positions on the substrate 200 to be baked; and controlling the flattening device to stretch the substrate 200 to be baked in a direction away from the stress center of the substrate 200 to be baked, so that the substrate 200 to be baked is flattened.
Optionally, the number of the spreading devices is two, and the two spreading positions are correspondingly disposed and located on two opposite sides of the substrate 200 to be baked respectively. Specifically, the two leveling devices are controlled to respectively hold two leveling positions located on two opposite sides of the substrate 200 to be baked.
Optionally, the number of the spreading devices may also be four, and four spreading positions are correspondingly provided, and the four spreading positions are respectively located at four sides or four corners of the substrate 200 to be baked.
Of course, the number of spreading devices can be set to other numbers, and need not be described in detail here.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. An automatic circuit board feeding method is characterized by comprising the following steps:
controlling a material grabbing device to grab the substrate to be baked, which is placed on the material loading platform;
controlling the substrate to be baked to rotate to a non-horizontal state; and
placing the substrate to be baked into a clamping position of a clamping frame so as to clamp the substrate to be baked in the clamping frame, wherein the inclination angle of the substrate to be baked when the substrate to be baked is rotated to a non-horizontal state is equal to the inclination angle of the substrate to be baked when the substrate to be baked is clamped in the clamping frame;
when the substrate to be baked rotates to the non-horizontal state, a preset included angle is formed between the substrate to be baked and the horizontal plane, and the preset included angle is larger than or equal to 60 degrees and smaller than or equal to 90 degrees;
after grabbing the material device and snatching the base plate of waiting to bake, and will wait to bake before the base plate is put into the clamping position of double-layered frame, still include:
flattening the substrate to be baked;
the clamping frame comprises a bottom plate and a plurality of clamping hands distributed on the periphery of the bottom plate at intervals, and the clamping positions are surrounded by the plurality of clamping hands; the clamping hand is rotatably arranged on the bottom plate, so that the clamping hand clamps or releases the substrate to be baked;
when the substrate to be baked is placed in the clamping position of the clamping frame, the clamping hands of the clamping frame rotate inwards to clamp the periphery of the substrate to be baked.
2. The automatic circuit board feeding method of claim 1, wherein the process of placing the substrate to be baked into the clamping position of the clamping frame comprises:
controlling the substrate to be baked to rotate by a preset angle so that the surface of the substrate to be baked, which is deviated from the material grabbing device, faces towards the clamping frame;
and controlling the substrate to be baked to move towards the clamping frame so as to enable the substrate to be baked to be placed in the clamping position of the clamping frame.
3. The automatic circuit board feeding method of claim 1, wherein the method for flattening the substrate to be baked comprises:
controlling a plurality of flattening devices to correspondingly grip a plurality of flattening positions on the substrate to be baked respectively;
and controlling the spreading device to stretch the substrate to be baked in a direction away from the stress center of the substrate to be baked so as to spread the substrate to be baked.
4. The automatic circuit board feeding method according to any one of claims 1 to 3, wherein the feeding platform is a lifting platform, and a plurality of layers of stacked substrates to be baked are placed on the feeding platform;
the method for grabbing the substrate to be baked placed on the feeding platform by the grabbing device comprises the following steps:
controlling the material grabbing device to grab the substrate to be baked, which is placed on the uppermost layer of the material loading platform; and
and after the uppermost layer of the substrate to be baked on the feeding platform is grabbed, controlling the feeding platform to ascend to a preset height so as to change the next layer of the substrate to be baked into the uppermost layer of the substrate to be baked.
5. The automatic circuit board feeding method according to any one of claims 1 to 3,
the step of clamping the substrate to be baked in the clamping frame comprises the following steps:
and when the substrate to be baked is placed in the clamping position of the clamping frame, the clamping hands of the clamping frame rotate inwards to clamp the periphery of the substrate to be baked.
6. The utility model provides a circuit board automatic feeding system which characterized in that includes:
the feeding platform is used for placing a substrate to be baked;
a material grabbing device;
the clamping frame is provided with a clamping position and is used for clamping the substrate to be baked; the clamping frame comprises a bottom plate and a plurality of clamping hands distributed on the periphery of the bottom plate at intervals, and the clamping positions are surrounded by the plurality of clamping hands; the clamping hand is rotatably arranged on the bottom plate, so that the clamping hand clamps or releases the substrate to be baked;
a flattening device; and
the control system is used for controlling the material grabbing device to grab the substrate to be baked, which is placed on the material loading platform;
the material grabbing device is also used for controlling the material grabbing device to drive the substrate to be baked to rotate so as to enable the substrate to be baked to rotate to a non-horizontal state; the material grabbing device is also used for controlling the substrate to be baked to be placed in a clamping position of the clamping frame; the material grabbing device is used for grabbing the substrate to be baked and placing the substrate to be baked into a clamping position of a clamping frame; the clamping frame is also used for controlling the clamping hands of the clamping frame to rotate inwards after the substrate to be baked is placed in the clamping position of the clamping frame so as to clamp the periphery of the substrate to be baked;
the inclination angle of the substrate to be baked when the substrate to be baked rotates to a non-horizontal state is equal to the inclination angle of the substrate to be baked when the substrate to be baked is clamped in the clamping frame; treat that roast base plate rotates when non-horizontality, treat that roast base plate and horizontal plane have and predetermine the contained angle, predetermine the contained angle and be greater than or equal to 60 degrees, and be less than or equal to 90 degrees.
7. The automatic circuit board feeding system according to claim 6, wherein said spreading means is plural;
wherein the control system is further configured to: controlling a plurality of spreading devices to respectively grasp a plurality of spreading positions on the substrate to be baked; and controlling the flattening device to stretch the substrate to be baked in the direction far away from the stress center of the substrate to be baked so as to flatten the substrate to be baked.
8. The automatic circuit board feeding system of claim 6, wherein said material grasping means is a suction cup type robot.
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|---|---|---|---|
| CN201910095317.0A CN109862700B (en) | 2019-01-30 | 2019-01-30 | Automatic circuit board feeding method and system |
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| CN201910095317.0A CN109862700B (en) | 2019-01-30 | 2019-01-30 | Automatic circuit board feeding method and system |
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| CN109862700A CN109862700A (en) | 2019-06-07 |
| CN109862700B true CN109862700B (en) | 2022-07-26 |
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| CN110480340B (en) * | 2019-08-29 | 2021-07-09 | 深圳创维－Rgb电子有限公司 | Automatic assembling device and assembling method for backlight module |
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| CN109862700A (en) | 2019-06-07 |
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