JPS5758330A - Wafer transferring apparatus - Google Patents

Wafer transferring apparatus

Info

Publication number
JPS5758330A
JPS5758330A JP13259780A JP13259780A JPS5758330A JP S5758330 A JPS5758330 A JP S5758330A JP 13259780 A JP13259780 A JP 13259780A JP 13259780 A JP13259780 A JP 13259780A JP S5758330 A JPS5758330 A JP S5758330A
Authority
JP
Japan
Prior art keywords
wafer
attitude
carrier
transferring
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13259780A
Other languages
Japanese (ja)
Other versions
JPS6312379B2 (en
Inventor
Mitsutake Nagashima
Shigeru Futagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP13259780A priority Critical patent/JPS5758330A/en
Publication of JPS5758330A publication Critical patent/JPS5758330A/en
Publication of JPS6312379B2 publication Critical patent/JPS6312379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Registering Or Overturning Sheets (AREA)

Abstract

PURPOSE:To process many wafers n a short time without fail, by constituting a transferring and replacing means of wafer carrier jigs, a wafer transferring means, a wafer carrying device, a wafer attitude changing means, and a handling means. CONSTITUTION:The carrier jigs 1a-1d on which many wafers are mounted are moved to an upper right part shown in the Figure by the movement of a carrier jig transfer table 10. The attitude of the carrier jigs are changed as shown by the jig 1d. Under this state, the wafers are horizontally transferred to carrying tables 15a and 15b of the wafer carrying device 5, by the wafer transferring means 4. The wafter 23 which is horizontally carried on the tables 15a and 15b is raised to upright attitude by about 90 deg. by the wafer attitude changing means 6. The wafer 23 raised upright by 90 deg. is placed on a wafer processor 7 mounted on positioning blocks 24a and 24b by the handing means, with the periphery at the bottom side of the wafer being handled.
JP13259780A 1980-09-24 1980-09-24 Wafer transferring apparatus Granted JPS5758330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13259780A JPS5758330A (en) 1980-09-24 1980-09-24 Wafer transferring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13259780A JPS5758330A (en) 1980-09-24 1980-09-24 Wafer transferring apparatus

Publications (2)

Publication Number Publication Date
JPS5758330A true JPS5758330A (en) 1982-04-08
JPS6312379B2 JPS6312379B2 (en) 1988-03-18

Family

ID=15085055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13259780A Granted JPS5758330A (en) 1980-09-24 1980-09-24 Wafer transferring apparatus

Country Status (1)

Country Link
JP (1) JPS5758330A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942038U (en) * 1982-09-10 1984-03-17 三和システムエンジニアリング株式会社 Belt conveyor for transporting hybrid ICs
JPS59188652A (en) * 1983-02-28 1984-10-26 タマラツク・サイエンテイフイツク・カンパニ−・インコ−ポレ−テツド Automatic system for exposing and processing double side printed circuit panel
US6122911A (en) * 1998-09-28 2000-09-26 Honda Giken Kogyo Kabushiki Kaisha Exhaust manifold pipe weld assembly
US6199376B1 (en) 1998-09-28 2001-03-13 Honda Giken Kogyo Kabushiki Kaisha Extension of exhaust manifold conduit into exhaust pipe
US6209319B1 (en) 1998-09-28 2001-04-03 Honda Giken Kogyo Kabushiki Kaisha Pipe assembly having inner and outer pipes
WO2013178786A2 (en) * 2012-06-01 2013-12-05 Dtg International Gmbh Apparatus for and method of aligning and transporting workpieces

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599739A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Wafer treating method and its equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599739A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Wafer treating method and its equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942038U (en) * 1982-09-10 1984-03-17 三和システムエンジニアリング株式会社 Belt conveyor for transporting hybrid ICs
JPS59188652A (en) * 1983-02-28 1984-10-26 タマラツク・サイエンテイフイツク・カンパニ−・インコ−ポレ−テツド Automatic system for exposing and processing double side printed circuit panel
US6122911A (en) * 1998-09-28 2000-09-26 Honda Giken Kogyo Kabushiki Kaisha Exhaust manifold pipe weld assembly
US6199376B1 (en) 1998-09-28 2001-03-13 Honda Giken Kogyo Kabushiki Kaisha Extension of exhaust manifold conduit into exhaust pipe
US6209319B1 (en) 1998-09-28 2001-04-03 Honda Giken Kogyo Kabushiki Kaisha Pipe assembly having inner and outer pipes
WO2013178786A2 (en) * 2012-06-01 2013-12-05 Dtg International Gmbh Apparatus for and method of aligning and transporting workpieces
WO2013178786A3 (en) * 2012-06-01 2014-03-06 Dtg International Gmbh Apparatus for and method of aligning and transporting workpieces

Also Published As

Publication number Publication date
JPS6312379B2 (en) 1988-03-18

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