JPS5599739A - Wafer treating method and its equipment - Google Patents

Wafer treating method and its equipment

Info

Publication number
JPS5599739A
JPS5599739A JP713379A JP713379A JPS5599739A JP S5599739 A JPS5599739 A JP S5599739A JP 713379 A JP713379 A JP 713379A JP 713379 A JP713379 A JP 713379A JP S5599739 A JPS5599739 A JP S5599739A
Authority
JP
Japan
Prior art keywords
wafers
equipment
treatment
heat treatment
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP713379A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Tetsuya Takagaki
Hisao Seki
Shiro Terasaki
Jun Suzuki
Hitoshi Horimuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP713379A priority Critical patent/JPS5599739A/en
Publication of JPS5599739A publication Critical patent/JPS5599739A/en
Pending legal-status Critical Current

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  • Weting (AREA)

Abstract

PURPOSE: To miniaturize the equipment, as well to improve working efficiency, by a mechanism wherein loading is made by cartridge unit, surface treatment is made by piece, heat treatment is made by batch and automatizing all works concerned.
CONSTITUTION: Wafers are picked up piece by piece from cartridge which contains wafers in plurality and are surface treated in a form of individual treatment, and surface treated wafers are put side by side on heat treatment jig in plurality and after this, the heat tretment jig is set into heat treatment equipment and thus, wafers are performed heat treatment in a form of batch treatment, then jig is taken out and wafers are transferred into vacant cartridge and are carry-out.
COPYRIGHT: (C)1980,JPO&Japio
JP713379A 1979-01-26 1979-01-26 Wafer treating method and its equipment Pending JPS5599739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP713379A JPS5599739A (en) 1979-01-26 1979-01-26 Wafer treating method and its equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP713379A JPS5599739A (en) 1979-01-26 1979-01-26 Wafer treating method and its equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP29056385A Division JPS61166038A (en) 1985-12-25 1985-12-25 Wafer processing equipment

Publications (1)

Publication Number Publication Date
JPS5599739A true JPS5599739A (en) 1980-07-30

Family

ID=11657569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP713379A Pending JPS5599739A (en) 1979-01-26 1979-01-26 Wafer treating method and its equipment

Country Status (1)

Country Link
JP (1) JPS5599739A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739430U (en) * 1980-08-14 1982-03-03
JPS5758330A (en) * 1980-09-24 1982-04-08 Citizen Watch Co Ltd Wafer transferring apparatus
JPS5764949A (en) * 1980-10-09 1982-04-20 Hitachi Ltd Continous processor
JPS5789234A (en) * 1980-11-25 1982-06-03 Shinkawa Ltd Positioning mechanism for lead frame
JPS57114250A (en) * 1981-01-08 1982-07-16 Nippon Telegr & Teleph Corp <Ntt> Automatic wafer feeding device
JPS58218115A (en) * 1982-06-14 1983-12-19 Sony Corp Heat treatment apparatus
JPS59101846A (en) * 1982-12-01 1984-06-12 Seiko Instr & Electronics Ltd Linear carrier for thin plate artical
JPS59101848A (en) * 1982-12-01 1984-06-12 Tokuda Seisakusho Ltd Vacuum processor
JPS6072241A (en) * 1983-09-28 1985-04-24 Mitsubishi Electric Corp Semiconductor wafer supplier
JPH02132840A (en) * 1988-02-12 1990-05-22 Tokyo Electron Ltd Manufacturing device
JPH08255823A (en) * 1988-02-12 1996-10-01 Tokyo Electron Ltd Processing device
WO2000003428A1 (en) * 1998-07-08 2000-01-20 Kabushiki Kaisha Watanabe Shoko Substrate transfer device and operating method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502168A (en) * 1973-05-16 1975-01-10
JPS5150569A (en) * 1974-10-29 1976-05-04 Kyushu Nippon Electric UEHAATATE KAESOCHI
JPS5285461A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Continuous treating apparatus for plate form objects
JPS52139378A (en) * 1976-05-17 1977-11-21 Hitachi Ltd Integrated treatment apparatus for semiconductor wafers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS502168A (en) * 1973-05-16 1975-01-10
JPS5150569A (en) * 1974-10-29 1976-05-04 Kyushu Nippon Electric UEHAATATE KAESOCHI
JPS5285461A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Continuous treating apparatus for plate form objects
JPS52139378A (en) * 1976-05-17 1977-11-21 Hitachi Ltd Integrated treatment apparatus for semiconductor wafers

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739430U (en) * 1980-08-14 1982-03-03
JPS5758330A (en) * 1980-09-24 1982-04-08 Citizen Watch Co Ltd Wafer transferring apparatus
JPS6312379B2 (en) * 1980-09-24 1988-03-18 Citizen Watch Co Ltd
JPS5764949A (en) * 1980-10-09 1982-04-20 Hitachi Ltd Continous processor
JPS627698B2 (en) * 1980-11-25 1987-02-18 Shinkawa Kk
JPS5789234A (en) * 1980-11-25 1982-06-03 Shinkawa Ltd Positioning mechanism for lead frame
JPH0113220B2 (en) * 1981-01-08 1989-03-03 Nippon Telegraph & Telephone
JPS57114250A (en) * 1981-01-08 1982-07-16 Nippon Telegr & Teleph Corp <Ntt> Automatic wafer feeding device
JPS58218115A (en) * 1982-06-14 1983-12-19 Sony Corp Heat treatment apparatus
JPS59101848A (en) * 1982-12-01 1984-06-12 Tokuda Seisakusho Ltd Vacuum processor
JPS59101846A (en) * 1982-12-01 1984-06-12 Seiko Instr & Electronics Ltd Linear carrier for thin plate artical
JPS635898B2 (en) * 1982-12-01 1988-02-05 Tokuda Seisakusho
JPS6072241A (en) * 1983-09-28 1985-04-24 Mitsubishi Electric Corp Semiconductor wafer supplier
JPH02132840A (en) * 1988-02-12 1990-05-22 Tokyo Electron Ltd Manufacturing device
JPH08255823A (en) * 1988-02-12 1996-10-01 Tokyo Electron Ltd Processing device
WO2000003428A1 (en) * 1998-07-08 2000-01-20 Kabushiki Kaisha Watanabe Shoko Substrate transfer device and operating method thereof
US6447217B1 (en) 1998-07-08 2002-09-10 Masayuki Toda Substrate transfer device and operating method thereof

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