JPS54125975A - Anti-contamination method for wafer inside reaction tube - Google Patents
Anti-contamination method for wafer inside reaction tubeInfo
- Publication number
- JPS54125975A JPS54125975A JP3307378A JP3307378A JPS54125975A JP S54125975 A JPS54125975 A JP S54125975A JP 3307378 A JP3307378 A JP 3307378A JP 3307378 A JP3307378 A JP 3307378A JP S54125975 A JPS54125975 A JP S54125975A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- acceptor
- stage
- tube
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
Abstract
PURPOSE:To reduce the sliding area of the wafer to the reaction tube wall and thus to prevent contamination of the wafer by providing the stage featuring an extremely reduced contact area to the wafer tool at the area where the wafer tool is placed inside the reaction tube and then placing the wafer tool on the stage to carry out the surface treatment of the wafer. CONSTITUTION:Stage 2 formed with the quartz bar featuring a triangular cross- section is fixed to at least more than one fixed areas within reaction tube 1, and then wafer tool holding wafer 3 is put on flat-plane type acceptor 5 to be inserted up to the front of stage 2 avoiding a contact to the inner wall of tube 1. Then tool 4 is shifted from acceptor 5 onto stage 2 by means of bar 6 containing a hook at the tip, and then acceptor 5 is drawn out of tube 1 to perform the necessary surface treatment. After the surface treatment, acceptor 5 is inserted again into tube 1, and tool 4 on stage 2 is transferred to acceptor 5 again via bar 6 to then draw out acceptor 5 of tube 1. As a reslut, the sticking of the foreign matters attached on the tube wall can be reduced extremely onto the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3307378A JPS54125975A (en) | 1978-03-24 | 1978-03-24 | Anti-contamination method for wafer inside reaction tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3307378A JPS54125975A (en) | 1978-03-24 | 1978-03-24 | Anti-contamination method for wafer inside reaction tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54125975A true JPS54125975A (en) | 1979-09-29 |
Family
ID=12376537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3307378A Pending JPS54125975A (en) | 1978-03-24 | 1978-03-24 | Anti-contamination method for wafer inside reaction tube |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54125975A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4355974A (en) * | 1980-11-24 | 1982-10-26 | Asq Boats, Inc. | Wafer boat |
| US5582649A (en) * | 1996-02-29 | 1996-12-10 | The United States Of America As Represented By The Secretary Of The Air Force | Wafer transfer apparatus for use in a film deposition furnace |
| US5759273A (en) * | 1996-07-16 | 1998-06-02 | Micron Technology, Inc. | Cross-section sample staining tool |
-
1978
- 1978-03-24 JP JP3307378A patent/JPS54125975A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4355974A (en) * | 1980-11-24 | 1982-10-26 | Asq Boats, Inc. | Wafer boat |
| US5582649A (en) * | 1996-02-29 | 1996-12-10 | The United States Of America As Represented By The Secretary Of The Air Force | Wafer transfer apparatus for use in a film deposition furnace |
| US5759273A (en) * | 1996-07-16 | 1998-06-02 | Micron Technology, Inc. | Cross-section sample staining tool |
| US5906681A (en) * | 1996-07-16 | 1999-05-25 | Micron Technology, Inc. | Cross-section sample staining tool |
| US6106621A (en) * | 1996-07-16 | 2000-08-22 | Micron Technology, Inc. | Cross-section sample staining tool |
| US6139915A (en) * | 1996-07-16 | 2000-10-31 | Micron Technology, Inc. | Cross-section sample staining method |
| US6183813B1 (en) | 1996-07-16 | 2001-02-06 | Micron Technology, Inc. | Method of staining a semiconductor wafer with a semiconductor treatment chemical |
| US6475567B2 (en) | 1996-07-16 | 2002-11-05 | Micron Technology, Inc. | Method of staining semiconductor wafer samples with a semiconductor treatment chemical |
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