JPS647517A - Heat treatment device for semiconductor substrate - Google Patents

Abstract

PURPOSE:To exclude the influence of fine particles and the outside air by a method wherein an inner cylinder reaction tube, which can be put in and taken out, is provided in the reaction tube of the heat treatment device of a semiconductor substrate. CONSTITUTION:An inner cylinder reaction tube 3, which can be moved vertically along the inner wall surface of the reaction tube 2 by an inner cylinder elevating device, is provided in the reaction tube 2 which is fixed to a furnace body. The inner cylinder reaction tube 3 is lowered using an inner cylinder elevating device so that half the length of the inner cylinder reaction tube 3 comes out from the reaction tube 2, and the inner cylinder tube 3 is filled up with reaction gas 8 in the above-mentioned state. Then, the jig 6 supporting a semiconductor substrate 5 is inserted into the furnace body 1 passing through the inner cylinder reaction tube 3 using a jig elevating device 10. At this time, the semiconductor substrate 5 is not exposed to the outside air by unchanging the position of the inner cylinder tube 3. Also, the high temperature semiconductor substrate 5 can be taken out without exposing to the outside air by passing it in the inner cylinder tube 3 when the semiconductor substrate 5 is taken out from the furnace body 1.