JPS5565431A - Semiconductor heating core tube - Google Patents

Semiconductor heating core tube

Info

Publication number
JPS5565431A
JPS5565431A JP13886178A JP13886178A JPS5565431A JP S5565431 A JPS5565431 A JP S5565431A JP 13886178 A JP13886178 A JP 13886178A JP 13886178 A JP13886178 A JP 13886178A JP S5565431 A JPS5565431 A JP S5565431A
Authority
JP
Japan
Prior art keywords
cylinder
gas leading
thermometry
gas
core tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13886178A
Other languages
Japanese (ja)
Inventor
Fumio Tobioka
Kazuya Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13886178A priority Critical patent/JPS5565431A/en
Publication of JPS5565431A publication Critical patent/JPS5565431A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To simplify thermometry and enable thermometry also from a gas leading- in cylinder by providing a gas leading-in cylinder of core tube for wafer heat treatment eccentrically to a cylinder of heat resisting material.
CONSTITUTION: A core tube 11 for semiconductor wafer heat treatment is composed of a cylinder 11a of heat-resisting material, a gas leading-in tube 11b and a flange 11c and the inside of the cylinder 11a is made an atmosphere heating semiconductor with gas out of a gas leading-in. One end of said cylinder 11a is made open and at another end a gas leading-in cylinder 11b is formed extrusively so that it may stand in a straight line with the inside surface of a part of the cylinder 11a eccentrically and through a passage, connecting a flange 11c with a gas source 2 for forming a heating atmosphere. Further it is so made as to enable a thermocouplemeter 3 to be inserted from the flange on the gas leading-in cylinder side to perform thermometry from an open end of the cylinder 11a and also to enable thermometry from the gas leading-in cylinder side.
COPYRIGHT: (C)1980,JPO&Japio
JP13886178A 1978-11-13 1978-11-13 Semiconductor heating core tube Pending JPS5565431A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13886178A JPS5565431A (en) 1978-11-13 1978-11-13 Semiconductor heating core tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13886178A JPS5565431A (en) 1978-11-13 1978-11-13 Semiconductor heating core tube

Publications (1)

Publication Number Publication Date
JPS5565431A true JPS5565431A (en) 1980-05-16

Family

ID=15231843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13886178A Pending JPS5565431A (en) 1978-11-13 1978-11-13 Semiconductor heating core tube

Country Status (1)

Country Link
JP (1) JPS5565431A (en)

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