JPS6337018B2 - - Google Patents

Info

Publication number
JPS6337018B2
JPS6337018B2 JP58148550A JP14855083A JPS6337018B2 JP S6337018 B2 JPS6337018 B2 JP S6337018B2 JP 58148550 A JP58148550 A JP 58148550A JP 14855083 A JP14855083 A JP 14855083A JP S6337018 B2 JPS6337018 B2 JP S6337018B2
Authority
JP
Japan
Prior art keywords
tape
ring
thin plate
adhesive tape
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58148550A
Other languages
Japanese (ja)
Other versions
JPS6038897A (en
Inventor
Minoru Ametani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP58148550A priority Critical patent/JPS6038897A/en
Publication of JPS6038897A publication Critical patent/JPS6038897A/en
Publication of JPS6337018B2 publication Critical patent/JPS6337018B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesive Tape Dispensing Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 この発明は例えば集積回路形成用の基盤となる
シリコンウエハのような円形状などの薄板と、こ
の薄板のキヤリヤ治具となる円形環状などのリン
グを1枚の粘着フイルムに貼着する方法に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention is a method of combining a circular thin plate, such as a silicon wafer, which serves as a base for forming an integrated circuit, and a ring, such as a circular ring, which serves as a carrier jig for the thin plate, into a single adhesive film. This relates to the method of attaching the paper to the .

従来では上記のようなリング状のキヤリヤ治具
に対するフイルムの貼着と、フイルムに対するシ
リコンウエハなどの貼着は手作業で行ない、リン
グの周囲からはみ出したフイルムの切り取りも手
作業で行なつていたのできわめて手数がかかり、
かつ皺ができないように張ることは困難で、熟練
を要するなどの問題があつた。
Previously, the attachment of the film to the ring-shaped carrier jig as described above and the attachment of silicon wafers, etc. to the film were done by hand, and the film protruding from around the ring was also cut by hand. Therefore, it is extremely time-consuming.
In addition, it was difficult to apply the material without wrinkles, and it required skill.

この発明は上記のようなリングにフイルムを貼
着するとともに薄板をフイルムに貼着する作業お
よびフイルムをリングに沿つて切断する作業など
を連続して能率よく行なう方法を提供することを
目的とするもので、フイルム状の粘着テープを一
定のピツチで間欠的に移動する間に薄板およびリ
ングを順次貼着し、かつテープをリングに沿つて
切取つていく一連の工程からなるものである。
An object of the present invention is to provide a method for efficiently and continuously performing the operations of attaching a film to a ring as described above, attaching a thin plate to the film, and cutting the film along the ring. It consists of a series of steps in which thin plates and rings are successively attached while a film-like adhesive tape is moved intermittently at a fixed pitch, and the tape is cut along the rings.

以下にこの発明の方法を添付図面に示す実施例
に基づいて説明する。
The method of the present invention will be described below based on embodiments shown in the accompanying drawings.

図において、1はシリコンウエハのような薄板
で第2図の例では円板状であるが、その他に円板
の一部を直線状に切除したものや四角形、三角形
などのものがある。
In the figure, reference numeral 1 denotes a thin plate such as a silicon wafer, and in the example shown in FIG. 2, it is disk-shaped, but there are also disks with a portion cut out in a straight line, squares, triangles, etc.

このような薄板1を第1図のようにマガジン2
に一定の間隔で積上げる。このマガジン2は受台
3上に載つており、受台3はユニツト化されたス
クリユージヤツキ式、ラツクピニオン式、シリン
ダ式などの昇降機構4により一定のピツチで間欠
的に下降し、最下端のものから1枚づつ送出し手
段5により取出される。
A thin plate 1 like this is placed in a magazine 2 as shown in Fig. 1.
Stack them up at regular intervals. This magazine 2 is placed on a pedestal 3, and the pedestal 3 is lowered intermittently at a constant pitch by a unitized elevating mechanism 4 such as a screw jack type, rack and pinion type, or cylinder type. The sheets are taken out one by one by the feeding means 5.

送出し手段5は駆動プーリ6により第1図矢印
方向に連続駆動される無端搬送ベルト7を有し、
マガジン2が1ピツチ下ると最下段の薄板1がベ
ルト7上に載つて取出されるものであるが、図示
以外の機構のものを用いてもよい。
The feeding means 5 has an endless conveyor belt 7 that is continuously driven by a drive pulley 6 in the direction of the arrow in FIG.
When the magazine 2 is lowered one pitch, the lowermost thin plate 1 is placed on the belt 7 and taken out, but a mechanism other than that shown in the drawings may be used.

また、図示省略してあるが、薄板1に方向決定
用の切欠がある場合、マガジンの前方に複数の縦
の回転棒などからなる位置決め手段を設けて切欠
の前向きなどの一定の方向に修正する。
Although not shown, if the thin plate 1 has a notch for determining the direction, positioning means such as a plurality of vertical rotating rods is provided in front of the magazine to correct the notch to a fixed direction such as facing forward. .

10は前記昇降機構4、送出し手段5などを取
付けた機台で、その上部側方には機箱11を設け
る。
Reference numeral 10 denotes a machine base to which the elevating mechanism 4, delivery means 5, etc. are attached, and a machine box 11 is provided on the upper side of the machine base.

12,13は機箱11と機台10に設けた上下
のローラで、第1図の矢印方向に間欠駆動され
る。
12 and 13 are upper and lower rollers provided on the machine box 11 and the machine stand 10, and are intermittently driven in the direction of the arrow in FIG.

また、第4図のように機台10に設けた巻軸1
4から引出された粘着テープ15がガイドローラ
16を経てローラ13上へ導かれる。このテープ
15は片面に粘着面を設けたポリエチレンなどの
フイルムで、粘着面を上にしてロラ13上に向か
う。
In addition, as shown in FIG.
Adhesive tape 15 pulled out from 4 is guided onto roller 13 via guide roller 16. This tape 15 is a film made of polyethylene or the like with an adhesive surface on one side, and is directed onto the roller 13 with the adhesive surface facing up.

また、機箱11には巻軸18と巻取軸19を設
け、ポリエチレンフイルムなどからなる保護テー
プ20を巻軸18に巻き、巻軸18から引出した
保護テープ20をローラ12の下側に巻いて巻取
軸19に巻取らせるが、前記のローラ12は機箱
11に設けた揺動レバーなどに取付けてバネによ
りローラ13上へ押し付ける。
Further, the machine box 11 is provided with a winding shaft 18 and a winding shaft 19, a protective tape 20 made of polyethylene film or the like is wound around the winding shaft 18, and the protective tape 20 pulled out from the winding shaft 18 is wound around the lower side of the roller 12. The film is wound onto a winding shaft 19, and the roller 12 is attached to a swing lever provided on the machine box 11 and pressed onto a roller 13 by a spring.

前記送出し手段5により送出された薄板1はロ
ーラ13上の粘着テープ15とローラ12の下部
の保護テープ20で挾まれてテープ15上に粘着
される。ローラ13,12はゴムローラであるか
ら、保護テープ20がない場合、万一薄板1が割
れるとその破片がローラ12の表面に突きささ
り、つぎの薄板1の表面に傷をつけるおそれがあ
る。しかし実施例のように保護テープ20があれ
ば破片は保護テープ20に附着して巻取られるの
で上記のようなおそれはない。
The thin plate 1 sent out by the sending means 5 is sandwiched between the adhesive tape 15 on the roller 13 and the protective tape 20 on the lower part of the roller 12, and is stuck onto the tape 15. Since the rollers 13 and 12 are rubber rollers, in the absence of the protective tape 20, if the thin plate 1 were to break, the fragments would stick to the surface of the roller 12, and there is a risk of damaging the surface of the next thin plate 1. However, if the protective tape 20 is used as in the embodiment, the fragments will be attached to the protective tape 20 and wound up, so there is no such fear as described above.

第2図の平面図において、22はキヤリヤ治具
のようなリング23のマガジンで、図示省略して
あるが、第1図に示す薄板のマガジン2とほぼ同
様の構造であり、受台3と同様の受台に載つて1
ピツチ毎に間欠的に下降するもので、図示省略し
てある駆動機構で駆動される押出部材24により
最下端のものから間欠的に矢印方向に押出されて
aの位置となる。
In the plan view of FIG. 2, reference numeral 22 denotes a magazine with a ring 23 like a carrier jig.Although not shown, it has almost the same structure as the thin plate magazine 2 shown in FIG. 1 on a similar pedestal
It is intermittently lowered for each pitch, and is intermittently pushed out in the direction of the arrow from the lowest end by a pushing member 24 driven by a drive mechanism (not shown) to the position a.

aの位置のリング23は例えば第3図のような
移送手段25によりテープ切断手段26上へ移送
する。
The ring 23 at position a is transferred onto the tape cutting means 26 by a transfer means 25 as shown in FIG. 3, for example.

この移送手段25は機箱11に固定したガイド
アーム27に沿つて送りネジなどで進退する移送
台29と、この台29にエアシリンダなどにより
昇降するよう取付けた吸引器30からなつてい
る。この吸引器30は中空でリング状の底部突出
部に多数の吸引孔を設け、吸引器30内をフレキ
シブルチユーブ(図示省略)により、図示省略し
てある真空吸引装置に連結して、第3図のように
機台10上のリング23を吸着して上昇し、鎖線
の位置へ移動して下降し、テープ切断手段26上
のテープ15上へリング23を下降させて吸引を
解除して上昇し、元の位置へ復帰する運動を行な
うようにする。
This transfer means 25 consists of a transfer table 29 that moves forward and backward along a guide arm 27 fixed to the machine box 11 using a feed screw or the like, and a suction device 30 that is attached to this table 29 so as to be raised and lowered by an air cylinder or the like. This suction device 30 has a hollow ring-shaped bottom protrusion with a large number of suction holes, and the inside of the suction device 30 is connected to a vacuum suction device (not shown) through a flexible tube (not shown), as shown in FIG. As shown in the figure, the ring 23 on the machine stand 10 is sucked and raised, moved to the position indicated by the chain line and lowered, and the ring 23 is lowered onto the tape 15 on the tape cutting means 26 to release the suction and rise. , perform the movement to return to the original position.

切断手段26は第3図のように機箱11に取付
けたエアシリンダ33で昇降するアーム34端に
設ける。アーム34端の下部にギヤモータ35を
固定し、このモータ35で旋回される旋回枠36
上に軸37を支点として揺動するカツタアーム3
8を取付け、このアーム38の先端に自由回転の
円板状カツタ39を取付けたもので、アーム38
の先端はバネ40により押上する。
The cutting means 26 is provided at the end of an arm 34 that is raised and lowered by an air cylinder 33 attached to the machine box 11, as shown in FIG. A gear motor 35 is fixed to the lower part of the end of the arm 34, and a rotating frame 36 is rotated by the motor 35.
The cutter arm 3 swings upward with the shaft 37 as a fulcrum.
8 is attached, and a freely rotating disc-shaped cutter 39 is attached to the tip of this arm 38.
The tip of is pushed up by a spring 40.

また、旋回枠36の中心に固定した垂直の軸4
1の上端に円板状の押え板42を回動自在に取付
け、この押え板42の外周上面に円形環状のゴム
43を取付けて旋回枠36の下部周囲に設けた複
数の脚に押え板42の下部周面に接するローラ4
4を設ける。
Also, a vertical shaft 4 fixed at the center of the rotating frame 36
A disc-shaped presser plate 42 is rotatably attached to the upper end of the rotation frame 36, and a circular annular rubber 43 is attached to the upper surface of the outer periphery of the presser plate 42. roller 4 in contact with the lower peripheral surface of
4 will be provided.

従つて薄板1を上面に粘着したテープ15の移
動に伴い、薄板1が切断手段26上にきて停止す
ると、前記のように移送手段25が作動してリン
グ23をテープ15上へ載せた条件で、エアシリ
ンダ33が作用し、アーム34が上昇して押え板
42上のゴム43と吸引器30でリング23とテ
ープ15を挾み、カツタ39がテープ15に切込
むとともにモータ35により軸41、旋回枠36
が回転してリング23の下面でテープ15を切断
する。旋回枠36が約2回転してテープ15を完
全に切断したとき、モータ35が停止し、シリン
ダ33によりアーム34が下り、吸引器30も復
帰する。
Therefore, as the tape 15 with the thin plate 1 adhered to its upper surface moves, when the thin plate 1 comes onto the cutting means 26 and stops, the transfer means 25 operates as described above and the ring 23 is placed on the tape 15. Then, the air cylinder 33 acts, the arm 34 rises, the rubber 43 on the holding plate 42 and the suction device 30 sandwich the ring 23 and the tape 15, the cutter 39 cuts into the tape 15, and the motor 35 moves the shaft 41. , rotating frame 36
rotates and cuts the tape 15 on the lower surface of the ring 23. When the rotating frame 36 rotates about two times to completely cut the tape 15, the motor 35 stops, the cylinder 33 lowers the arm 34, and the suction device 30 returns to its original position.

切断後のテープ15は第1図、第4図のように
切断手段26の前方でローラ45に誘導され、ガ
イドローラ46を経て巻取軸47に巻取られる。
従つて巻取られる粘着テープ15には第4図のよ
うに切断により孔32があいており、薄板1を貼
着したフイルム15′を張つたリング23はテー
プ15から離れてローラ48の下を通り、コンベ
ヤ49上へ移動するが、ローラ48やコンベヤ4
9は機箱11や機台10に取付けたものである。
The cut tape 15 is guided by a roller 45 in front of the cutting means 26 as shown in FIGS. 1 and 4, passed through a guide roller 46, and then wound onto a take-up shaft 47.
Therefore, the adhesive tape 15 to be wound up has a hole 32 formed by cutting as shown in FIG. It moves onto the conveyor 49, but the rollers 48 and the conveyor 4
9 is one attached to the machine box 11 or the machine stand 10.

第1図の51は前記のように薄板1、フイルム
15′を張つたリング23を収納するマガジンで
ある。このマガジン51は前記各マガジン2,2
2とほぼ類似するもので、適宜のユニツト化され
た昇降機構52により昇降される受台53上に載
り、コンベヤ49上を移動したきたリング23が
マガジン51内に1枚入る毎に受台53が1ピツ
チ上昇する。
Reference numeral 51 in FIG. 1 is a magazine that stores the ring 23 on which the thin plate 1 and film 15' are stretched as described above. This magazine 51 includes each of the magazines 2, 2.
2, it is placed on a pedestal 53 that is raised and lowered by a suitable unitized lifting mechanism 52, and every time one ring 23 moves on a conveyor 49 enters the magazine 51, the pedestal 53 increases by one pitch.

この発明は上記のようにフイルム状の粘着テー
プを粘着面を上にして長手方向に間欠的に移動さ
せ、送出し手段により1枚づつ送出される薄板
を、前記粘着テープとその上方において、粘着テ
ープと同様に間欠的に移動している保護テープ間
に挾み、この両テープを上下のローラにより圧着
して、粘着テープ上に薄板を貼着したのち、保護
テープは粘着テープおよび薄板から剥離して巻取
ローラによる巻取る工程と、薄板を貼着した粘着
テープ上にリングを供給して、このリングを薄板
の外側を囲む位置として粘着テープ上に貼着し、
ついで、リングの下面において、テープをリング
に沿つて切り離し、薄板を貼着したフイルムを張
つたリングは適宜回収し、残りの孔あきテープは
適宜巻取る工程とからなるものであるから、送出
し手段から送出された薄板の粘着テープ上への貼
着や、こうして貼着された薄板を囲むリングの貼
着が人手によらず自動的に行なえるが、薄板の貼
着時には保護フイルムを用いて薄板が割れたさい
に破片がローラにささらないようにしたので、そ
の後に続く薄板に疵が付かないという効果があ
る。さらに、これらの貼着はローラ間に張られた
テープ上において行なわれ、しかもリングの下面
において、切断手段が作用してテープをリングに
張つたまま切断するので切断がきわめて正確に行
なえ、かつフイルムに皺が生じない。さらに切断
後の孔のあいたテープは巻取りローラにより巻取
られるので切断後のテープの処分が容易であるな
どの効果がある。
In this invention, as described above, a film-like adhesive tape is moved intermittently in the longitudinal direction with the adhesive side facing upward, and the thin plates, which are delivered one by one by the delivery means, are attached to the adhesive tape and above the adhesive tape. Similar to the tape, it is sandwiched between protective tapes that move intermittently, and both tapes are pressed by upper and lower rollers to adhere a thin plate onto the adhesive tape, and then the protective tape is peeled off from the adhesive tape and the thin plate. a winding process using a winding roller; a ring is supplied onto the adhesive tape to which the thin plate is attached; the ring is attached to the adhesive tape at a position surrounding the outside of the thin plate;
Next, the tape is cut along the ring from the bottom surface of the ring, the ring covered with the thin film is appropriately collected, and the remaining perforated tape is appropriately wound. Attaching the thin plate sent out from the means onto the adhesive tape and attaching a ring surrounding the attached thin plate can be done automatically without manual intervention, but it is possible to use a protective film when attaching the thin plate. When the thin plate breaks, the pieces are prevented from getting stuck in the roller, which has the effect of preventing flaws from forming on subsequent thin plates. Furthermore, these attachments are carried out on the tape stretched between the rollers, and the cutting means acts on the underside of the ring to cut the tape while it is still attached to the ring, making it possible to cut the tape with great precision and to ensure that the film remains intact. No wrinkles appear on the skin. Furthermore, since the perforated tape after being cut is wound up by a winding roller, there is an effect that the tape after being cut can be easily disposed of.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明方法を実施する装置の一例を
示す正面図、第2図は同上の平面図、第3図は第
1図A―A線の拡大縦断側面図、第4図は要部の
斜視図である。 1…薄板、5…送出し手段、14,18…巻
軸、15…テープ、15′…フイルム、19,4
7…巻取軸、20…保護テープ、23…リング、
26…テープ切断手段。
Fig. 1 is a front view showing an example of an apparatus for carrying out the method of the present invention, Fig. 2 is a plan view of the same as above, Fig. 3 is an enlarged longitudinal sectional side view taken along line A-A in Fig. 1, and Fig. 4 is a main part. FIG. DESCRIPTION OF SYMBOLS 1... Thin plate, 5... Delivery means, 14, 18... Winding shaft, 15... Tape, 15'... Film, 19, 4
7... Winding shaft, 20... Protective tape, 23... Ring,
26...Tape cutting means.

Claims (1)

【特許請求の範囲】[Claims] 1 フイルム状の粘着テープを粘着面を上にして
長手方向に間欠的に移動させ、送出し手段により
1枚づつ送出される薄板を、前記粘着テープとそ
の上方において、粘着テープと同様に間欠的に移
動している保護テープ間に挾み、この両テープを
上下のローラにより圧着して、粘着テープ上に薄
板を貼着したのち、保護テープは粘着テープおよ
び薄板から剥離して巻取ローラにより巻取る工程
と、薄板を貼着した粘着テープ上にリングを供給
して、このリングを薄板の外側を囲む位置として
粘着テープ上に貼着し、ついでリングの下面にお
いて、テープをリングに沿つて切り離し、薄板を
上面に貼着し粘着テープから切離されたフイルム
を張つたリングは適宜回収し、残りの孔あきテー
プは適宜巻取る工程とからなる薄板とリングの貼
着方法。
1. A film-like adhesive tape is moved intermittently in the longitudinal direction with the adhesive side facing up, and the thin plates sent out one by one by the delivery means are intermittently moved in the same way as the adhesive tape. The protective tape is sandwiched between the moving protective tapes, and both tapes are pressed by upper and lower rollers to adhere a thin plate onto the adhesive tape.The protective tape is then peeled off from the adhesive tape and the thin plate, and is removed by a take-up roller. The winding process involves supplying a ring onto the adhesive tape to which the thin plate is attached, attaching the ring to the adhesive tape at a position surrounding the outside of the thin plate, and then rolling the tape along the ring on the underside of the ring. A method for attaching a thin plate and a ring, which comprises the steps of cutting it off, attaching a thin plate to the top surface, appropriately collecting the film-covered ring separated from the adhesive tape, and appropriately winding up the remaining perforated tape.
JP58148550A 1983-08-11 1983-08-11 Method of bonding thin plate to ring Granted JPS6038897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58148550A JPS6038897A (en) 1983-08-11 1983-08-11 Method of bonding thin plate to ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58148550A JPS6038897A (en) 1983-08-11 1983-08-11 Method of bonding thin plate to ring

Publications (2)

Publication Number Publication Date
JPS6038897A JPS6038897A (en) 1985-02-28
JPS6337018B2 true JPS6337018B2 (en) 1988-07-22

Family

ID=15455263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58148550A Granted JPS6038897A (en) 1983-08-11 1983-08-11 Method of bonding thin plate to ring

Country Status (1)

Country Link
JP (1) JPS6038897A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0725463B2 (en) * 1986-07-02 1995-03-22 富士通株式会社 Method for manufacturing semiconductor device
JPH01209262A (en) * 1988-02-16 1989-08-23 Shin Nippon Koki Kk Tape lateral displacement-preventing method and its device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5339330A (en) * 1976-09-24 1978-04-11 Hitachi Ltd Application of adherends to articles
JPS55128817A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Device for bonding piece on tape
JPS5839846B2 (en) * 1974-03-05 1983-09-01 スタミカ−ボン ビ− ベ− Netsukaso seizai riyouheno tenkazaino kongouhouhou

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839846U (en) * 1981-09-11 1983-03-16 東芝機械株式会社 Automatic tape pasting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839846B2 (en) * 1974-03-05 1983-09-01 スタミカ−ボン ビ− ベ− Netsukaso seizai riyouheno tenkazaino kongouhouhou
JPS5339330A (en) * 1976-09-24 1978-04-11 Hitachi Ltd Application of adherends to articles
JPS55128817A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Device for bonding piece on tape

Also Published As

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JPS6038897A (en) 1985-02-28

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