CN104795309A - Film sheet resection device and resection method - Google Patents

Film sheet resection device and resection method Download PDF

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Publication number
CN104795309A
CN104795309A CN201510022076.9A CN201510022076A CN104795309A CN 104795309 A CN104795309 A CN 104795309A CN 201510022076 A CN201510022076 A CN 201510022076A CN 104795309 A CN104795309 A CN 104795309A
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CN
China
Prior art keywords
film
cut
thin
residual part
excision
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Granted
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CN201510022076.9A
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Chinese (zh)
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CN104795309B (en
Inventor
尾张弘树
高田準子
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Towa Corp
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Towa Corp
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Publication of CN104795309B publication Critical patent/CN104795309B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10Making cuts of other than simple rectilinear form
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/25Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member
    • B26D1/26Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut
    • B26D1/28Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting
    • B26D1/285Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting for thin material, e.g. for sheets, strips or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18Means for removing cut-out material or waste
    • B26D7/1845Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863Means for removing cut-out material or waste by non mechanical means by suction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27Means for performing other operations combined with cutting
    • B26D7/32Means for performing other operations combined with cutting for conveying or stacking cut product
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D2007/0012Details, accessories or auxiliary or special operations not otherwise provided for
    • B26D2007/0018Trays, reservoirs for waste, chips or cut products

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Advancing Webs (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Details Of Cutting Devices (AREA)

Abstract

The invention provides a film sheet resection device and a resection method. A correct shape is obtained through proper processing of a residual portion film after a film sheet is cut off a long-tape film. Roller-shaped winding long-tape film is grasped through a clamp fixture, a given length portion of the front end is carried on a base station for cutting through a clamping fixture mobile mechanism, and the film sheet is cut off through a cutting mechanism. The long-tape film after being cut off the film sheet is cut off at a boundary of the part through a cutting blade. The cut-off long-tape film, i.e., the residual portion film is conveyed in the reverse direction through a conveying roller and is taken out of the base station for cutting, and is received from receiving ports of a banner of a wide range provided with the corresponding residual portion film and a narrow vertical range to an attractive accommodating part provided with an attractive device.

Description

Thin-film sheet device for excising and cutting method
Technical field
The present invention relates to a kind of device for being excised from long band film by release film sheet material and cutting method thereof, it is when by electronic component resin-encapsulated such as semiconductor wafers, especially in order to compression forming, used when the resin material (following, only these to be generically and collectively referred to as " resin material ") of graininess, Powdered, pasty state etc. being supplied to mould chamber.
Background technology
Along with the slimming of electronic component, recent compression forming is used.In compression forming, resin material is supplied to the chamber of the lower film tool be coated to by release film sheet material, and by this resin material heating and melting, and make to be installed on mold and be equiped with electronic component substrate dipping to this molten resin, by the film that closes of bed die and mold, the compression of this resin is carried out shaping, for this reason, by the resin of given amount in chamber with homogeneous and without crossing and becoming important without too late supply.
In patent documentation 1, in chamber by particulate resins R with homogeneous thickness and without cross with without following described not as good as ground supply method (with reference to Figure 1A to Fig. 1 G).First, the lower openings up and down with the framework 11 of the opening of the opening shape of the chamber 18a of corresponding bed die 8 is coated to by release film sheet material 12, and the lower surface being adsorbed in framework 11 makes concavity resettlement section 13.This concavity resettlement section 13 is loaded in mounting table 14, and is supplied in the mode becoming homogeneous thickness on release film sheet material by particulate resins R from feed appliance 15.Thereafter, by the concavity resettlement section 13 of collecting particulate resins R, the die face of bed die 18 is placed in the part mode entered directly over the 18a of chamber of the release film sheet material 12 surrounded by framework 11, and after the absorption of the release film sheet material 12 of the lower surface of framework 11 is removed, by release film sheet material 12, to be attracted in the 18a of chamber with the particulate resins R of side thereon and to draw in.Thus, the particulate resins R of homogeneous thickness is supplied in the 18a of chamber.Thereafter, by particulate resins R heating and melting, the bed die 18 of this molten resin Rm in the 18a of chamber will be contained, and the substrate 21 of electronic component 20 is installed, with its installed surface state downwards and mold 19 mold closing of assembling, thus electronic component 20 is flooded to molten resin R, and the chamber floor members 18b that molten resin Rm is pressurizeed by resin is pressed.After molten resin solidification, by by mold 19 and bed die 18 die sinking, and obtain the resin-encapsulated products formed of electronic component 20.
Under being the discoid situations such as wafer, be the circular release film sheet material using said method by the substrate of its resin forming, by the long band release film pulled out from donor rollers successively round excise, make.Specifically, as shown in Figure 2, the release film F rolled out from donor rollers 27 is transported to cut-out base station 23 by transport mechanism 22, and transport mechanism 22 stops in coming the time point on excision base station 23, and by rotating cutting edge 25, release film is excised by with round.Cut release film sheet material is that platform fallen by the sheet material by being located at excision base station 23, keeps its state to fall downwards, and from excision base station 23 removal.Further, transport mechanism 22 start, transported to takers-in 26 place by the release film F of cut residual part, and next place of incision is configured on excision base station 23 from excision base station 23.Release film (residual part film) the roll floor-covering roll by excising circularly is made to get like this in takers-in 26.
Prior art described above, by the ground of the long band residual part film roll after cut for the release film sheet material situation of batching, the two-side-ends part of the roller be taken up, release film is positively batched, but cut part is in the middle body overlapped loosely, release film little by little becomes huge, causes normally batching.Further, it affects also to involve and is drawn out and the release film be placed on excision base station, becomes and produces distortion and gauffer.Its result, produces distortion in cut release film sheet material, produces the problem cannot excising correct shape.Problem so is not limited only to the release film of resin-encapsulated shaped device, is also common person from the situation of the film excision thin-film sheet of long band.
Patent documentation 1 Japanese Unexamined Patent Publication 2010-036542 publication
Summary of the invention
In order to solve prior art Problems existing, the object of the invention is to: a kind of residual part film by suitably processing after thin-film sheet excises by long band film is provided, film is excised all the time under suitably state, thin-film sheet device for excising and the cutting method of the thin-film sheet of distortionless and correct shape can be obtained.
For reaching above-mentioned purpose, the invention provides a kind of thin-film sheet device for excising,
From long band film excision thin-film sheet, it possesses: excision base station; 1st conveyance means, the part of the certain length of its one end is also placed on aforementioned excision base station by conveyance long band film; Excision means, from long membrane preceding sections excision thin-film sheet; Cut-out means, cut off the long band film after cut for aforementioned film sheet material from the border of preceding sections; 2nd conveyance means, by the long band film of cut cut-out and residual part film, transport in the direction reverse with the 1st conveyance means and take out from aforementioned excision base station; And attraction resettlement section, it possesses and is received from residual part film that aforementioned cut-out base station takes out and has should the banner of wide cut of residual part film and the receiving port of narrow depth and suction device.
Preferably, described 1st conveyance means are the fixtures grasping the membrane front end of described length and draw on described cut-out base station.
Preferably, described 2nd conveyance means are clamped by two rollers by described residual part film and transport in the carrying roller pair reverse with the 1st conveyance means, and the roller above this carrying roller centering can be moved upward.
Preferably, the roller above described carrying roller centering, is provided with and namely the front end of described residual part film is cut off the film guiding element that end is directed at described receiving port.
Preferably, the roller below described carrying roller centering is provided with film guiding element, and this film guiding element is used for namely cutting off in the front end of described residual part film to be made it be wound in the roller below this when end enters described receiving port and does not make it reel excessively.
Preferably, the roller below described carrying roller centering is provided with film guiding element, and this film guiding element is used for namely cutting off in the front end of described residual part film to be made it be wound in the roller below this when end enters described receiving port and does not make it reel excessively.
Preferably, in the inside of described attraction resettlement section, be provided with for described residual part film being accommodated multiple resettlement sections in the below of described receiving port, and described suction device to be located at above comparatively this resettlement section and not to be interfered the position falling path of the residual part film fallen from described receiving port.
In other words, thin-film sheet device for excising of the present invention carries out following action.First, by the 1st conveyance means, the certain length part (certainly, this part is large compared with the thin-film sheet for excision) of long membrane one end is placed on aforementioned excision base station.Further, on this excision base station, by excision means excision thin-film sheet.In this excision no matter its mode, means, also can excise with cutting knife, also can excise with stamping-out.Cut thin-film sheet is taken out from excision base station by the means be provided with in addition.
Ensuing cut-out means, are cut off long band film cut for the thin-film sheet of target by preceding sections and ensuing portion boundary.Because preceding sections is placed in the part on excision base station, so border be excision base station end or a little outside.2nd conveyance means, by so cut, cut off and the long band film shortened (residual part film) transport in the direction (i.e. Return-ing direction) reverse with the 1st conveyance means and take out from aforementioned excision base station.The residual part film be removed is that beginning forms cut-off end by cut-out means.Residual part film, though cut off end since then to enter the receiving port attracting resettlement section, but at this, because this attracts resettlement section to possess suction device, residual part film by by attracting the lamina air flow that formed in the narrow receiving port of depth, does not contact the wall of its receiving port etc. and smoothly enters and attract in resettlement section.Thin gauge film produces electrostatic because of friction in response to its material in time transporting, if for entering from narrow mouth, then be attached to the wall of the surrounding of mouth and produce the state of affairs of interference for majority, but in thin-film sheet device for excising of the present invention, from receiving port air to be attracted for making attraction resettlement section and receive residual part film, prevent it from adhering to wall by lamina air flow as the aforementioned, can smoothly receive.
In thin-film sheet device for excising of the present invention, 1st conveyance means, can accomplish to grasp long membrane front end and the fixture drawn on aforementioned cut-out base station, the 2nd conveyance means, can by residual part film by two rollers clampings and as transporting in the carrying roller pair with aforementioned fixture reverse direction.At this, the carrying roller centering of the 2nd conveyance means, the roller of top, when long band film transports by the fixture of the 1st conveyance means, for not forming obstruction, can move to top in advance.
And, in the 2nd conveyance means carrying roller among upper rolls, during for the conveyance of residual part film is declined downwards, for making the front end of residual part film (i.e. aforementioned cut-out end) successfully enter aforementioned receiving port, being preferably and being provided with film guiding element (upper film guiding element).
Similarly, also in the 2nd conveyance means carrying roller among lower roll, be preferably and be provided with, for do not make the front end of residual part film (aforementioned cut-out end) in time entering aforementioned receiving port overwind in the film guiding element (lower film guiding element) of the roller of below.
In the inside of aforementioned attraction resettlement section, for multiple for residual part film collecting being provided with resettlement section in the below of receiving port, and be preferably, aforementioned suction device is located at compared with above its resettlement section, and does not interfere the position falling path of the residual part film fallen from this receiving port.
For reaching above-mentioned purpose, the thin-film sheet cutting method that the present invention provides simultaneously, from long band film excision thin-film sheet, it has:
1st conveyance step, the part of the certain length of its one end is also placed on excision base station by conveyance long band film;
Excision step, from long membrane preceding sections excision thin-film sheet;
Cut off step, the long band film after cut for aforementioned film sheet material is cut off from the border of preceding sections;
2nd conveyance step, by membrane for the length of cut cut-out residual part film, transports in transporting the reverse direction of step with the 1st and taking out from aforementioned excision base station; And
Waste wood collecting step, by the residual part film taken out from aforementioned excision base station, has should the banner of wide cut of residual part film and the attraction resettlement section of the receiving portion of narrow depth and suction device receive by possessing.
In this thin-film sheet cutting method of the present invention, cut-out step is carried out after excision step, in time excising thin-film sheet, correct excision can be carried out in long band film owing to applying tension force, if but take other measure (such as in cut-out step, during excision by long band thin film adsorbs in excision base station) etc., then these steps are that reverse also it doesn't matter.
Beneficial effect of the present invention is:
In thin-film sheet device for excising of the present invention and thin-film sheet cutting method, the problems such as the distortion of film when producing excision can not be betided in the existing method of being batched with previous status by residual part film, the thin-film sheet of correct shape can be excised.In addition, residual part film is cut off from long band film, and for the situation of short status process, because of in film produce electrostatic make residual part film be attached to contact its part and produce install difficulty problem, but in device and method of the present invention, by using the attraction resettlement section with new structure by its Resolving probiems, and residual part film suitably being processed, the operation of thin-film sheet shearing device entirety not being impacted.
Accompanying drawing explanation
Figure 1A-Fig. 1 G is the skeleton diagram of the order of existing compression forming.
Fig. 2 A is the schematic configuration diagram of existing film device for excising.
Fig. 2 B is the summary section of existing film device for excising.
Fig. 3 is the schematic configuration diagram of the thin-film sheet device for excising of one embodiment of the invention.
Fig. 4 illustrates that the skeleton diagram of the state of residual part film is taken out in the absorption resettlement section to same embodiment.
Fig. 5 is the flow chart of the thin-film sheet cutting method of the thin-film sheet device for excising being illustrated in same embodiment.
Primary symbols illustrates:
30 thin-film sheet device for excising
40 membrane supplying portions
41 roller maintaining parts
42 fixtures
43 fixture travel mechanisms
50 thin-film sheet cut portions
51 excision base stations
52 grooves
Platform fallen by 53 sheet materials
54 excision guiding elements
55 excision mechanisms
56 rotating shafts
57 arms
58 rotary cuttves
60 residual part conveying units
61 carrying rollers pair
61a top roll
61b lower roll
62 severing swords
63 severing driving mechanisms
64 motors
65 roller elevating mechanisms
Sheet material guiding element on 66
67 times sheet material guiding elements
70 attract resettlement section
71 containing cases
72 suction ports
73 vacuum pumps
74 import road
75 receiving ports
76 isolation versions
77 through holes
80 control parts
F release film
Fr residual part film.
Embodiment
One side carries out following explanation with reference to Fig. 3 and Fig. 4 one side, in order to be made in the resin-encapsulated compression-molding apparatus that possesses the lower film with circular cavity by the thin-film sheet device for excising of the present invention (hereinafter simply referred to as " device for excising ") 30 of release film sheet material used.
The device for excising 30 of the present embodiment, possesses: membrane supplying portion 40, by roll the release film that reels keep, and by forwards (that is, toward the direction of the film cut portion 50) supply of its front end; Cut portion 50, excises circular release film sheet material from release film F; Residual part conveying unit 60, cuts off its full width of release film F after cut for release film sheet material, and rearward transports as residual part release film Fr; Attract resettlement section 70, the residual part film F r rearward transported is attracted and collecting; Control part 80, control its etc. each portion.
Membrane supplying portion 40, possesses: roller maintaining part 41, the long band release film F reeled is kept by roll; Fixture 42, grasps the front end (forward end) of the release film F be drawn out from this roller; Fixture travel mechanism 43, moves forward and backward the position that this fixture 42 slightly rises in the surface of the excision base station 51 of film cut portion 50.
Film cut portion 50 possesses: excision base station 51; Excision mechanism 55, is located at the top of this excision base station 51; Excision guiding element 54, is formed as moving up and down between the surface and top thereof of this excision base station 51.Excision mechanism 55 possesses: hang down to excision base station 51 from upper vertical and become liftable rotating shaft 56; Arm 57, from this rotational axis vertical (that is, being parallel to excision base station 51) extend; Rotary cutter 58, installs downwards perpendicular to arm 57.Be provided with above excision base station 51, to have with the release film F made with diameter and only there is in both sides the groove 52 of the circle of width, and aforementioned rotating shaft 56 be located on the center vertical line of the groove 52 of this circle.In addition, the length of aforementioned arms 57 is equal to this radius of a circle.The center line of the aforementioned grooves 52 of excision base station 51 is formed compared with the part of inner side, for platform 53 fallen by the sheet material taking out cut release film sheet material.Excision guiding element 54 clamps the groove of the circle of excision base station 51, and is formed by the two concentrically ringed fixing tool in inside it and outside.
Residual part conveying unit 60, except comprising the carrying roller of two up and down that rearward transported by residual part film F r to except 61, comprises: severing sword 62, be located at its carrying roller to 61 dead astern (that is, roller maintaining part 41 side); Severing driving mechanism 63, drives this severing sword 62.Carrying roller is to the lower roll 61b in 61, and its top is located at and the substantially same height above of aforementioned excision base station 51, and is driven by motor 64.Top roll 61a can be elevated by roller elevating mechanism 65, and drops to driven rotary when contacting with the residual part film F r on lower roll 61b.In top roll 61a by the end of residual part film F r to pressing down, and for guiding to the receiving port 75 of resettlement section, be provided with the upper film guiding element 66 of tortuous L font in below.In addition, in lower roll 61b, the end of its residual part film F r, along with the rotation of roller 61b, is wound in roller 61b, and is provided with as correctly guiding the lower film guiding element 67 entering receiving port 75.
Attract resettlement section 70, be located at comparatively lower roll 61b rear, and comparatively excision base station 51 be above below, and to possess: containing case 77, the residual part film F be cut off accommodated; Vacuum pump 73, attracts the air in this containing case 71; Import road 74, extend upward from the top of this containing case 71.Import road 74, have: opening immediately below the rear of lower roll 61b, and the receiving port 75 of width (that is, the width of release film F) the slightly large banner had compared with residual part film F r and narrow depth.The below of resettlement section 71, can take out the residual part film of accumulation, and can removal.Above the side of resettlement section 71, be provided with suction port 72, and aforementioned vacuum pump connects this suction port 72.Suction port 72 is surrounded by the division board 76 with multiple through hole 77 in containing case 71, and certainly contains part and resettlement section 78 (Fig. 4, the dotted portion) isolation of residual part film F r.Moreover, in aforementioned can the part of removal or its top, also can be provided with the confirmation window of the collecting situation into confirming residual part film F r.
Control part 80, excises the release film sheet material of circle from long band release film F, and in order to by suitably being recycled by residual part film F r, makes it excise continuously and carry out unchangeably, and above-mentioned each portion is with the sequential control of the such as flow chart of Fig. 5.Moreover the process of the flow chart of Fig. 5 repeatedly carries out for continuous print long band film.
First, fixture 42 is moved to roller maintaining part 41 place by fixture travel mechanism 43, and fixture 42 grasps the end of long band release film F.Then, release film F, by fixture 42 is moved to excision base station 51 side, pulls out from roller by fixture travel mechanism 43.Forward end in release film F arrives the time point of excision with the rear end (with the end of roller maintaining part 41 opposition side) of base station 51, and fixture 42 stops, and is configured at by release film F (step S11) on excision base station 51.
Following control part 80, excision guiding element 54 drops on excision base station 51, is pressed by release film F.Then, release film F is pierced through in the front end that rotating shaft 56 drops to rotary cutter 58, rotating shaft 56 is revolved and turns around.Thus the release film F on excision base station 51 is excised circularly, and made circular release film sheet material (step S12).
Thereafter, the sheet material of excision base station 51 central authorities is fallen platform 53 and is fallen downwards.Release film sheet material, by not shown device or by operator, takes out (step S13) from excision base station 51.
Control part 80 then passes through severing driving mechanism 63 by long band release film F severing (step 14).Now, for making release film F be fixed on excision board, by severing sword 62 severing really by excision guiding element 54.Thereafter, cut-out guiding element 54 is risen to top by control part 80.Thus, release film sheet material is cut, is removed fixing, become free state (step S15) with shorter length by the waste wood of severing and release film F (residual part film F) on excision base station.
Thereafter, control part 80, first starts the vacuum pump 73 (step S16) attracting resettlement section 70.Moreover the startup of vacuum pump 73 also can drive with following motor 64 simultaneously.Or vacuum pump also repeatedly can not start, stop, and operates constantly.
Following control part 80, by roller elevating mechanism 65, makes top roll 61a drop to and is connected to roller 61b.Its severing side of residual part film F r is sandwiched in carrying roller between 61 thus.Next, lower roll 61b is by motor 61 rotary actuation, and top roll 61a is also by lower roll 61 driven rotary.Thus, residual part film F r is drawn out from excision base station 51 and rearward transports (step S17, Fig. 4).Now, the front side end of residual part film F r grasps upwards with fixture 42 by fixture travel mechanism 43, simultaneously with carrying roller to 61 rotation rearward move simultaneously.Thus, the rearward conveyance of residual part film F r is smoothly carried out.As the situation of conveyance of carrying out without this fixture 42, during conveyance, residual part Fr produces electrostatic by the slip of cut-out on base station 51, has and is attached to excision base station 51 or other parts and smoothly cannot carries out the possibility that transports.Fixture travel mechanism 43, comes the time point of conveyance to 61 places in fixture 42, removes the fixture 42 forward end of residual part film F r grasped.When residual part film F r rearward being transported to 61 by carrying roller, the severing end of residual part film F r is by being located at the upper film guiding element of top roll 61a and being located at the lower film guiding element of lower roll 61b, and the receiving port 45 to the importing road 74 attracting resettlement section 70 is smoothly imported into.
In attraction resettlement section 70, in containing case 71, attract air by importing road 74 by the receiving port 75 of vacuum pump 73 self-conductance approach 74.Because the depth of receiving port 75 is narrow, produce lamina air flow in its place, residual part film F r takes advantage of its lamina air flow be attached to the upper lower wall surface of receiving port 75 and smoothly import road 74.
The suction port 72 being connected in vacuum pump 71 is located at above the side of containing case 71, and because being provided with large through hole 77 in the top of division board 76, above the containing case 71 in the source of self-conductance approach 74, air comparatively strongly attracts.Its result, imports road 74 by the residual part film F r of removing with in great power inspiration containing case 71.On the other hand, because the through hole 77 be located at below division board 76 is little, self-gravitation mouth 72 becomes stable in the attraction of distant place containing case 71 lower air, and the residual part be sucked in containing case 71 drops down onto the below (Fig. 4) of containing case 71 from body weight by it.
Even if how many residual part film F r falling to the below of containing case 71 is floated by the attraction of self-gravitation mouth 71, because having division board 76 at the end of containing case 71 and suction port 72, residual part film F r is sucked into suction port 72 and does not stop attracting.
Control part 80, only makes lower roll 61b rotate both after fixing turn, motor 64 is stopped.Thus, residual part film F r overall by carrying roller to 61, and collecting is in the containing case attracting resettlement section 70.In addition, vacuum pump 73 stops, and makes top roll 61a rise (step S18) by roller elevating mechanism 65.As done above, waste wood and residual part film F r are from excision base station 51 removal.
Thereafter, get back to step S11, step S11 repeatedly ~ S18.As done above, circular release film sheet material is by continuously and make unchangeably.
So, if by the thin-film sheet device for excising 30 of the present embodiment, to often make residual part film F r (waste wood) that a slice release film sheet material produces from long band release film F severing and from excision base station 51 removal, because long band release film F is reconfigured by fixture 42, the distortion that the situation as batched in the past at this point that can not produce produces or gauffer.In addition, in the recovery of residual part film F r, the laminar flow also by utilizing the attraction of air to be formed, can prevent electrostatic from causing the problems such as the attachment of residual part film F r guide approach 74.

Claims (8)

1. a thin-film sheet device for excising, from long band film excision thin-film sheet, it is characterized in that, it possesses: excision base station; 1st conveyance means, it is conveyance long band film and the part of the certain length of its one end is placed on described excision base station; Excision means, it is the Partial Resection thin-film sheet from long membrane described certain length; Cut-out means, it is cut off from the portion boundary of described certain length by the long band film after cut for described thin-film sheet; 2nd conveyance means, it is by the long band film of cut cut-out and residual part film, transports in the direction reverse with the 1st conveyance means and takes out from described excision base station; And attraction resettlement section, it possesses and is received from residual part film that described cut-out base station takes out and has should the banner of wide cut of residual part film and the receiving port of narrow depth and suction device.
2. thin-film sheet device for excising according to claim 1, is characterized in that, described 1st conveyance means are the fixtures grasping the membrane front end of described length and draw on described cut-out base station.
3. thin-film sheet device for excising according to claim 1 and 2, it is characterized in that, described 2nd conveyance means are clamped by two rollers by described residual part film and transport in the carrying roller pair reverse with the 1st conveyance means, and the roller above this carrying roller centering can be moved upward.
4. thin-film sheet device for excising according to claim 3, is characterized in that, the roller above described carrying roller centering, is provided with and namely the front end of described residual part film is cut off the film guiding element that end is directed at described receiving port.
5. thin-film sheet device for excising according to claim 3, it is characterized in that, roller below described carrying roller centering is provided with film guiding element, and this film guiding element is used for namely cutting off in the front end of described residual part film to be made it be wound in the roller below this when end enters described receiving port and does not make it reel excessively.
6. thin-film sheet device for excising according to claim 4, it is characterized in that, roller below described carrying roller centering is provided with film guiding element, and this film guiding element is used for namely cutting off in the front end of described residual part film to be made it be wound in the roller below this when end enters described receiving port and does not make it reel excessively.
7. thin-film sheet device for excising according to claim 1, it is characterized in that, in the inside of described attraction resettlement section, be provided with for described residual part film being accommodated multiple resettlement sections in the below of described receiving port, and described suction device to be located at above comparatively this resettlement section and not to be interfered the position falling path of the residual part film fallen from described receiving port.
8. a thin-film sheet cutting method, from long band film excision thin-film sheet, it is characterized in that, it has:
1st conveyance step, it is conveyance long band film and is placed on excision base station by the part of the certain length of its one end;
Excision step, it is from long membrane described Partial Resection thin-film sheet;
Cut off step, it is cut off from described portion boundary by the long band film after cut for described thin-film sheet;
2nd conveyance step, it is by membrane for the length of cut cut-out residual part film, transports in transporting the reverse direction of step with the 1st and taking out from described excision base station; And
Waste wood collecting step, it be the residual part film that will take out from described excision base station, has should the banner of wide cut of residual part film and the attraction resettlement section reception of the receiving portion of narrow depth and suction device by possessing.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
US20090133551A1 (en) * 2007-11-26 2009-05-28 Masayuki Yamamoto Method for cutting protective tape of semiconductor wafer and protective tape cutting device
CN102034729A (en) * 2009-10-01 2011-04-27 日东电工株式会社 Adhesive tape joining apparatus
CN102529002A (en) * 2010-09-16 2012-07-04 东和株式会社 Compression forming mold and compression forming method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165060U (en) * 1984-10-05 1986-05-02
JPH0487796A (en) * 1990-07-27 1992-03-19 Kataoka Mach Co Ltd Apparatus for cutting and processing side wrapping paper and apparatus for preparing side wrapping paper
JPH085577B2 (en) * 1992-04-23 1996-01-24 日本金網商工株式会社 Transfer device for thin strips
JP4796673B2 (en) 2005-06-14 2011-10-19 日本メクトロン株式会社 Long film substrate cutting device
JP4403133B2 (en) * 2005-11-18 2010-01-20 日本メクトロン株式会社 Long film transport apparatus and transport method.
CN101450419B (en) * 2007-11-30 2011-09-28 深圳市大族激光科技股份有限公司 ITO film laser engraving device and method
JP5153509B2 (en) 2008-08-08 2013-02-27 Towa株式会社 Electronic component compression molding method and mold apparatus
JP5413582B2 (en) 2009-07-17 2014-02-12 岩崎通信機株式会社 Cutting device and paper discharge tray
JP5991655B2 (en) * 2012-02-27 2016-09-14 三菱重工メカトロシステムズ株式会社 Print issue device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
US20090133551A1 (en) * 2007-11-26 2009-05-28 Masayuki Yamamoto Method for cutting protective tape of semiconductor wafer and protective tape cutting device
CN102034729A (en) * 2009-10-01 2011-04-27 日东电工株式会社 Adhesive tape joining apparatus
CN102529002A (en) * 2010-09-16 2012-07-04 东和株式会社 Compression forming mold and compression forming method

Cited By (11)

* Cited by examiner, † Cited by third party
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JP2015137157A (en) 2015-07-30
TW201532769A (en) 2015-09-01
KR20150087137A (en) 2015-07-29
TWI551415B (en) 2016-10-01
KR101622509B1 (en) 2016-05-18
JP6212399B2 (en) 2017-10-11

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