KR20100126910A - Method of molding an electric device and apparatus for molding an electric device - Google Patents

Method of molding an electric device and apparatus for molding an electric device Download PDF

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Publication number
KR20100126910A
KR20100126910A KR1020090045333A KR20090045333A KR20100126910A KR 20100126910 A KR20100126910 A KR 20100126910A KR 1020090045333 A KR1020090045333 A KR 1020090045333A KR 20090045333 A KR20090045333 A KR 20090045333A KR 20100126910 A KR20100126910 A KR 20100126910A
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KR
South Korea
Prior art keywords
release film
cavity
liquid resin
electronic component
mold
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KR1020090045333A
Other languages
Korean (ko)
Inventor
김선오
Original Assignee
세크론 주식회사
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Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Priority to KR1020090045333A priority Critical patent/KR20100126910A/en
Publication of KR20100126910A publication Critical patent/KR20100126910A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

An electronic component molding method comprising: preparing a mold portion having an upper mold on which an electronic component is mounted and a lower mold having a cavity formed at a position corresponding to the electronic component, supplying the electronic component to the lower surface of the upper mold, and the upper mold and the The release film is supplied between the lower molds, a liquid resin is supplied to a position corresponding to the cavity in a state where the release film is spaced apart from the bottom of the cavity, and the liquid resin is filled in the cavity together with the release film. The upper mold and the lower mold are clamped to each other to immerse the electronic component mounted on the upper mold in the liquid resin in the cavity. Thus, the electronic component can be uniformly molded with the liquid resin.

Description

METHOD OF MOLDING AN ELECTRIC DEVICE AND APPARATUS FOR MOLDING AN ELECTRIC DEVICE

The present invention relates to a molding method for an electronic component and an electronic component molding apparatus for implementing the same. More particularly, the present invention relates to a molding method of an electronic component for molding an electronic component with a resin in a cavity using a release film, and an electronic component molding apparatus implementing the same.

In general, molding of an electronic component including a semiconductor chip mounted on a substrate using resin is performed. The semiconductor chip inside the electronic component may be protected from external moisture or impact through a molding process of molding the electronic component.

For the molding process, an electronic component molding apparatus including a mold unit having a cavity for a molding space and a film supply unit is used. Conventional electronic molding apparatus includes a film supply unit for supplying a release film to the upper and lower molds while applying a constant tension to the mold unit and the release film consisting of the upper and lower molds. The lower mold is formed with a cavity filled with a resin or a liquid resin in powder form. The electronic component is contained in a cavity filled with a resin so that the electronic component is resin molded. The release film is also arranged to cover the cavity inner surface. Therefore, after molding the electronic component using a resin, the electronic component molded using the release film can be easily separated from the lower mold.

Accordingly, it is an object of the present invention to provide an electronic component molding method capable of uniformly curing a liquid resin.

Another object of the present invention is to provide an electronic component molding apparatus capable of implementing an electronic component molding method capable of uniformly curing a liquid resin.

In order to achieve the above object of the present invention, in the electronic component molding method according to an embodiment of the present invention, a mold portion having an upper mold to which the electronic component is mounted and a lower mold having a cavity formed at a position corresponding to the electronic component. And a position where the electronic component is supplied to a lower surface of the upper mold, a release film is supplied between the upper mold and the lower mold, and a liquid resin corresponds to the cavity in a state in which the release film is spaced apart from the bottom of the cavity. The liquid resin is filled into the cavity together with the release film, and the upper mold and the lower mold are mutually clamped to immerse the electronic component mounted on the upper mold in the liquid resin in the cavity.

In one embodiment of the present invention, after the step of dipping the electronic component in the cavity, the liquid resin may be heated to cure the liquid resin.

In one embodiment of the present invention, before the upper mold and the lower mold are mutually clamped, the cavity may be entirely covered with the release film in which the liquid resin is formed by vacuum adsorbing the release film on the bottom surface of the cavity.

In the electronic component molding method according to an embodiment of the present invention, a mold portion having an upper mold on which the electronic component is mounted and a lower mold forming a bottom surface of the cavity for molding the electronic component, supplying a release film on the cavity A clamping unit movable in a vertical direction is prepared for clamping the film supply unit and the release film. The release film is fed to the top of the cavity. The release film is clamped with the clamping unit. A liquid resin is supplied onto the release film spaced apart from the bottom of the cavity. By adsorbing the release film on the bottom and side surfaces of the cavity, the liquid resin is placed in the cavity. The upper mold and the lower mold are clamped to each other to immerse the electronic component mounted on the upper mold in the cavity in which the liquid resin remains. Here, the space between the upper mold and the lower mold may be evacuated in order to clamp the upper mold and the lower mold.

An electronic component molding apparatus according to an embodiment of the present invention includes an upper mold on which an electronic component is mounted and a lower mold disposed to face the upper mold and having a cavity formed at a position corresponding to the electronic component. Between the mold part configured to be engageable, the upper mold and the lower mold, a release film is supplied onto the cavity, the release film is disposed between the upper mold and the lower mold, and the release film is disposed between the upper mold and the lower mold. And a clamping unit for clamping the film and a resin supply unit for supplying a liquid resin for molding the electronic component on the release film while the release film is spaced apart from the bottom surface of the cavity. Here, the resin supply unit is disposed adjacent to the storage portion for storing the liquid resin, the upper mold and the lower mold, the nozzle portion for supplying the liquid resin supplied from the storage portion on the release film and the storage And a supply line interconnecting the nozzle portion. In addition, the supply line is arranged to surround the first tube and the first tube formed with a first flow path through which the liquid resin flows, and a second tube with a second flow path through which a coolant flows to maintain the temperature of the liquid resin. It may include. The resin supply unit may further include a nozzle driving unit configured to move the nozzle unit in a first direction that is a direction in which the nozzle part approaches the cavity and in a second direction that is perpendicular to the first direction. Here, the nozzle unit may be detachably fastened from the supply line. The nozzle unit may include a body connected to one end of the supply line and having a plurality of flow paths formed therein, and a plurality of nozzles connected to the flow path of the body to supply the liquid resin onto the release film. And the clamping unit is disposed above the release film and clamped in a vertical direction to clamp the release film supplied on the cavity, a top clamp disposed below the release film to clamp the release film. The lower clamp and the driving unit for moving the upper clamp in the vertical direction so that the release film is clamped by the upper clamp and the lower clamp and the clamped release film is in close contact with the upper surface of the lower mold. .

In one embodiment of the present invention, the lower mold may be formed with vacuum holes for evacuating the cavity in order to coat the release film on the bottom and inner surfaces of the cavity.

According to the embodiments of the present invention, the liquid resin is a heater disposed on the lower mold while the liquid resin is supplied on the release film when the release film is supplied onto the release film in a state spaced apart from the bottom of the cavity May not be in contact with Therefore, hardening of liquid resin by the heat which generate | occur | produces from the said heater can be suppressed. As a result, the variation in the exposure time during which the liquid resin is exposed to the heater during the supply time of the liquid resin in which the liquid resin is supplied to the release film can be reduced, so that the uneven curing of the liquid resin by the heater can be suppressed. have. As a result, the electronic component can be molded uniformly.

Hereinafter, an electronic component molding method and an electronic component molding apparatus implementing the same will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structure is shown to be larger than the actual size for clarity of the invention, or to reduce the actual size to understand the schematic configuration.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a plan view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention. FIG. 2 is a cross-sectional view for describing the molding part of FIG. 1.

1 and 2, an electronic component molding apparatus according to an exemplary embodiment of the present disclosure may include an electronic component 10 including a substrate 12 and a plurality of semiconductor chips 14 mounted on the substrate 12. (See FIG. 2) may be used to package the resins in a batch. The substrate 12 may be a PCB substrate and the semiconductor chips 14 may be mounted on the substrate 12 through a wire bonding process or a solder reflow process.

The electronic component molding apparatus 100 includes a mold part 102 having two molds disposed to face each other, a film supply unit 105, a clamping unit 130, and a resin supply unit 140.

In the molding apparatus 100, two mold parts 102 may be disposed to face each other. The molds 102 may be used to mold the electronic components 10 using a resin, for example, a liquid resin.

A loader 172 for transferring the electronic components 10 to the molds 102 may be disposed between the mold units 102. The loader 172 may be disposed to be movable in a first direction in which the molds 102 are arranged. For example, the loader 172 may move along a rail extending in the first direction, for example, the X-axis direction, and may load the electronic components 10 inside the mold part 102. have.

In the second direction perpendicular to the first direction, for example, in the Y-axis direction, a pickup unit 168 for transporting the electronic components 10 and a resin supply unit 140 for supplying a liquid resin are provided. Can be deployed. For example, the pickup unit 168 may be disposed on one side of the loader 172, and the resin supply unit 140 may be disposed on the other side of the loader 172 facing the pickup unit 168. Can be. The pickup unit 168 may be disposed to be movable along a rail extending in the Y-axis direction.

Referring to FIG. 2, the mold part 102 may include an upper mold 110 and a lower mold 120, and the lower mold 120 may be disposed to be movable in the vertical direction.

The upper mold 110 may include an upper press 111 and an upper die 113. The upper die 113 may be disposed on the lower surface of the upper press 111. In addition, the upper die 113 may have a lower surface on which the electronic component 10 is loaded.

Although not shown, the upper mold 110 may be configured to hold vacuum holes and / or grip the electronic component 10 on the lower surface of the upper die 113 to adsorb and fix the electronic component 10. It may have a holder.

The lower mold 120 may include a lower press 121, a lower die 123, and a cavity member 125. The lower die 123 may be disposed on the lower press 121, and the cavity member 125 may be disposed on the lower press 121 to surround the lower die 123. For example, the cavity member 125 may be elastically supported by the elastic member 124 disposed on the lower press 121.

Meanwhile, the bottom of the lower die 123 and the inner side of the cavity member 125 define the cavity 128. In particular, the lower die 123 may have an upper surface that functions as a bottom surface of the cavity 128 for molding the electronic component 10 into a resin, for example, a liquid resin. The cavity member 125 may have a ring shape disposed to surround the lower die 123. In particular, the cavity member 125 may be disposed to protrude upward from the lower die 123, and may have inner surfaces defining the cavity 128.

The lower die 123 may have vacuum holes 129 for sucking the release film 20 and covering the bottom and side surfaces of the cavity 128.

The film supply part 105 supplies a release film 20 between the upper mold 110 and the lower mold 120. The release film 20 covers the bottom and side surfaces of the cavity 128. Accordingly, the release film 20 can easily detach the electronic component 10 from the cavity 128. For example, the film supply unit 105 may include a supply roller (not shown) and a winding roller (not shown) disposed on both sides of the mold unit 102.

The clamping unit 130 clamps the release film 20. Thus, the clamping unit 130 prevents the release film 20 from deviating from the upper surface of the lower die 123 and the inner surface of the cavity member 125 that define the cavity 128.

In one embodiment of the present invention, the clamping unit 130 includes an upper clamp 131, a lower clamp 133, a drive shaft 135 and a clamp driver 137 for clamping the release film 20. can do.

The upper clamp 131 may have a ring shape and may be connected to a driving shaft 135 extending in the vertical direction through the lower press 121. The drive shaft 135 may be disposed to pass through the through hole 127 formed in the lower press 121. In addition, a clamp driver 137 for driving the upper clamp 131 in the vertical direction may be disposed below the lower press 121.

The lower clamp 133 may be disposed below the upper clamp 131, and may be elastically supported on the lower press 121. For example, an elastic member 134 may be disposed between the lower press 121 and the lower clamp 133, and thus the lower clamp 133 may move in the vertical direction.

The release film 20 may be supplied between the upper clamp 131 and the lower clamp 133 by the supply roller. That is, as shown in the figure, the upper clamp 131 and the lower clamp 133 may be disposed outside the cavity member 125, and vertically formed by the clamp driver 137 and the elastic member 134. Can move in each direction.

The release film 20 may be clamped between the upper clamp 131 and the lower clamp 133 by the downward movement of the upper clamp 131, the cavity by the downward movement of the upper clamp 131. It may be in close contact with the upper surface of the member (125).

Meanwhile, the inner space of the cavity 128 may be covered by the release film 20. That is, the release film 20 may be coated on the bottom and inner surfaces of the cavity 128 by the vacuum pressure provided through the vacuum hole 129 of the lower die 123.

Referring again to FIGS. 1 and 2, the resin supply unit 140 may be disposed adjacent to the loader 172. The resin supply unit 140 may supply the liquid resin 30 onto the release film 20 in a state where the release film 20 is spaced apart from the bottom surface of the cavity 128, and thus the release film 20. It is possible to suppress the hardening of the liquid resin 30 by the heater (not shown) connected to the lower mold 120 while being supplied to the. On the other hand, the liquid resin 30 may be cured at room temperature. In addition, the liquid resin 30 may be cured relatively quickly when heated.

If the release film 20 is supplied in contact with the bottom surface of the cavity 128, firstly, the liquid resin 30 supplied is exposed to heat of the heater for a long time, so that curing occurs first. Therefore, curing of the liquid resin 30 as a whole may occur unevenly as a whole.

As in the present invention, when the release film 20 is supplied onto the release film 20 in a state where the release film 20 is spaced apart from the bottom surface of the cavity 128, the liquid resin 30 is a release film ( 20) may not be in contact with the heater while being supplied. Therefore, hardening of the liquid resin 30 by the heat which generate | occur | produces from the said heater can be suppressed. As a result, during the supply time of the liquid resin 30 to which the liquid resin 30 is supplied to the release film 20, it is possible to reduce the variation in the exposure time when the liquid resin 30 is exposed to the heater. It can suppress that the liquid resin 30 by this hardens unevenly.

Referring back to FIG. 1, the resin supply unit 140 according to an embodiment of the present invention includes a storage unit 141 for storing a liquid resin, a nozzle unit 145 for spraying the liquid resin on the electronic component, and A supply line 144 having a flow path through which the liquid resin flows by connecting the storage unit 141 and the nozzle unit 145, a coolant supply unit 143 for preventing hardening of the liquid resin, and a temperature of the storage unit, the supply It may further include a control unit 145 for controlling the temperature of the line and the flow rate of the liquid resin. The temperature of the coolant can be kept constant and the thermal contact with the liquid resin 30 can suppress the curing of the liquid resin 30. Examples of the coolant may include water.

3 is a cross-sectional view for describing the nozzle unit of FIG. 1.

1 and 3, the nozzle unit 145 according to an embodiment of the present invention is connected to one end of the supply line and has a plurality of flow paths formed therein and the flow path of the body 147. And a plurality of nozzles 148 connected to and supplying the liquid resin on the release film 20.

By supplying the liquid resin 30 on the release film 20 to the plurality of nozzles 148 in a relatively large area, the supply time of the liquid resin 30 may be shortened. In addition, the nozzle unit 145 may be connected to the nozzle driving unit 146 to move in the first and second directions. For example, the nozzle driving unit 146 may move the nozzle unit 145 in the second direction to enter or exit the nozzle unit 145 into the mold unit 102. In addition, the nozzle driver 146 may evenly supply the liquid resin to the inside of the cavity 128 by moving the nozzle unit 145 in the first direction.

On the other hand, the nozzle unit 145 may be detachably fastened from the supply line. For example, when the liquid resin 30 is supplied using a nozzle 148 that is different in diameter from the nozzle 148 used in the previous process, the nozzle for which the technician is used is replaced with a nozzle 148 having a different diameter. Can be.

4 is a cross-sectional view for describing a supply line of FIG. 1.

1 and 4, the supply line 144 according to an embodiment of the present invention may include a first tube 144c and a first tube 144c having a first flow path through which the liquid resin 30 flows. It is disposed to wrap, and may include a second tube 144d having a second flow path through which the coolant 40 flows to maintain the temperature of the liquid resin 30. Therefore, while the liquid resin 30 flows through the first tube 144c of the supply line 144, the coolant 40 and the liquid resin 30 are in thermal contact to maintain a constant temperature of the liquid resin 30. Can be. Thus, curing of the liquid resin 30 while flowing in the supply line 144 can be suppressed.

The electronic component molding apparatus 100 according to the exemplary embodiment of the present invention may further include a sealing part 150 that seals the cavity 128 as a whole. The sealing part may be kept lower than atmospheric pressure while the molding process of the electronic component 10 is performed using the cavity 128.

The sealing part includes a lower tube 156 disposed on the upper surface of the lower press 121 and an upper tube 151 disposed on the lower surface of the upper press 111. Here, the lower tube 156 may be in close contact with the upper tube 151 by raising the lower mold 120. In addition, a sealing member 155 may be interposed between the upper tube 151 and the lower tube 156. As a result, a space enclosed by the upper press 111, the upper tube 151, the sealing member 155, the lower tube 156, and the lower press 121 may be formed. The pressure inside the sealed space may be kept lower than atmospheric pressure during the molding process of the electronic component 10.

The electronic component 10 may be immersed in the liquid resin 20 by the rising of the lower mold 120, and then the liquid resin 20 is uniformly overall as the liquid resin 20 is cured by the heat generated by the heater. The electronic component 10 may be packaged.

5 to 8 are cross-sectional views illustrating a method of molding an electronic component according to an exemplary embodiment of the present disclosure.

First, referring to FIG. 5, an upper mold 110 and a lower mold 120 are prepared. In this case, the electronic component 10 may be mounted on the upper mold 110. In addition, the lower mold 120 is provided with a cavity 128 corresponding to the molding shape of the electronic component 10.

The release film 20 is positioned between the upper mold 110 and the lower mold 120 while the upper mold 110 and the lower mold 120 are spaced apart from each other. In this case, the upper die 113 included in the upper mold 110 may hold the substrate 11 on which the semiconductor chip 13 is mounted. The release film 20 may be supplied through, for example, a supply roller (not shown) and a winding roller (not shown) disposed to face each other outside the upper mold 110 and the lower mold 120.

Referring to FIG. 6, the driving unit 137 lowers the upper clamp 131 connected to the driving shaft 135, and interposes the release film 20 between the upper clamp 131 and the lower clamp 133. The upper clamp 131 is further lowered to clamp the release film 20 using the elastic force of the lower clamp 133. In addition, the release film 20 is in contact with the upper surface of the cavity member 125. Accordingly, the upper clamp 131, the lower clamp 133, and the cavity member 125 firmly clamp the release film 20.

The liquid resin 30 is supplied onto the release film 20 while the release film 20 is spaced apart from the bottom surface of the cavity 128. Therefore, while the liquid resin 30 is supplied on the release film 20, it is possible to suppress hardening in a heater (not shown) connected to the lower mold 120. If the release film 20 is supplied in contact with the bottom surface of the cavity 128, firstly, the liquid resin 30 supplied is exposed to heat of the heater for a long time, so that curing occurs first. Therefore, curing of the liquid resin as a whole may occur unevenly as a whole.

As in the present invention, when the release film 20 is supplied onto the release film 20 in a state where the release film 20 is spaced apart from the bottom surface of the cavity 128, the liquid resin 20 is a release film ( It may not be in contact with the heater while being fed to phase 30). Therefore, hardening of the liquid resin 20 by the heat which generate | occur | produces from the said heater can be suppressed. As a result, during the supply time of the liquid resin supplied to the release film, the liquid resin 20 can reduce the variation in the exposure time of the liquid resin 20 exposed to the heater. ) Can be suppressed from being unevenly cured.

Referring to FIG. 7, a vacuum pressure is formed through a vacuum suction hole 129 formed in the lower die 123 to apply the release film 20 to the bottom and side surfaces of the cavity 128.

Referring to FIG. 8, the lower mold 120 is raised toward the upper mold 110 to seal the sealed space by using the upper tube and the lower tubes 151 and 156. Subsequently, the vacuum region is evacuated through a vacuum exhaust port (not shown) formed in the upper mold 110. Then, the electronic component 20 fixed to the upper mold 110 is precipitated in the cavity 128 containing the liquid resin. Thereafter, after a predetermined time, the liquid resin 20 is cured to form the electronic component 10 using the cured resin. For example, the electronic component 13 mounted on one surface of the substrate 11 may be molded of a cured resin. Alternatively, a plurality of electronic components mounted on both surfaces of the substrate 11 may be molded of a cured resin. Subsequently, air is introduced into the cavity 128 through the vacuum suction port 129 formed in the lower die 123 to release the release film 20 from the bottom and side surfaces of the cavity 128. Therefore, the molded electronic component 10 may be separated from the lower mold 120.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

According to the present invention, the liquid resin does not contact the heater disposed on the lower mold while the liquid resin is supplied on the release film when the release film is supplied onto the release film while being spaced apart from the bottom of the cavity. You may not. Therefore, hardening of liquid resin by the heat which generate | occur | produces from the said heater can be suppressed. As a result, the variation in the exposure time during which the liquid resin is exposed to the heater during the supply time of the liquid resin in which the liquid resin is supplied to the release film can be reduced, so that the uneven curing of the liquid resin by the heater can be suppressed. have. As a result, the electronic component can be molded uniformly. The present invention can be applied to a method and apparatus for molding an electronic component using a liquid resin.

1 is a plan view illustrating an electronic component molding apparatus according to an exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view for describing the molding part of FIG. 1.

3 is a cross-sectional view for describing the nozzle unit of FIG. 1.

4 is a cross-sectional view for describing a supply line of FIG. 1.

5 to 8 are cross-sectional views illustrating a method of molding an electronic component according to an embodiment of the present invention.

Claims (13)

Preparing a mold part having an upper mold to which the electronic component is mounted and a lower mold having a cavity formed at a position corresponding to the electronic component; Supplying the electronic component to the lower surface of the upper mold; Supplying a release film between the upper mold and the lower mold; Supplying a liquid resin to a position corresponding to the cavity in a state in which the release film is spaced apart from a bottom of the cavity; Filling the cavity with the liquid resin together with the release film; And Clamping the upper mold and the lower mold to immerse the electronic component mounted on the upper mold in the liquid resin in the cavity. The method of claim 1, further comprising curing the liquid resin by heating the liquid resin after the step of dipping the electronic component in the cavity. The method of claim 1, wherein filling the cavity with the liquid resin together with the release film is performed by vacuum adsorbing the release film on a bottom surface of the cavity. A mold portion having an upper mold on which the electronic component is mounted and a lower mold forming a bottom surface of the cavity for molding the electronic component, a film supply unit for supplying a release film onto the cavity, and a vertical direction for clamping the release film. Preparing a movable clamping unit; Supplying a release film on top of the cavity; Clamping the release film with the clamping unit; Supplying a liquid resin on the release film spaced apart from the bottom of the cavity; Positioning the liquid resin in the cavity by adsorbing the release film to the bottom and side surfaces of the cavity; And Clamping the upper mold and the lower mold to immerse the electronic component mounted on the upper mold in the liquid resin in the cavity. The method of claim 4, further comprising vacuuming the space between the upper mold and the lower mold after the upper mold and the lower mold are mutually clamped. A mold part disposed to face the upper mold and the upper mold on which the electronic component is mounted, and having a lower mold having a cavity formed at a position corresponding to the electronic component, and configured to combine the upper mold and the lower mold; A film supply unit for supplying a release film on the cavity between the upper mold and the lower mold, wherein the release film is coated on the cavity; A clamping unit disposed between the upper mold and the lower mold, for clamping the release film; And And a resin supply unit for supplying a liquid resin for molding the electronic component on the release film while the release film is spaced apart from the bottom surface of the cavity. The method of claim 6, wherein the resin supply unit, A storage unit for storing the liquid resin; A nozzle unit disposed adjacent to the upper mold and the lower mold, for supplying the liquid resin supplied from the reservoir onto the release film; And And a supply line interconnecting the reservoir and the nozzle. The method of claim 7, wherein the supply line A first tube having a first flow path through which the liquid resin flows; And And a second tube disposed to surround the first tube and having a second flow path through which a coolant flows to maintain the temperature of the liquid resin. 8. The resin supply unit of claim 7, wherein the resin supply unit further comprises a nozzle driving unit for moving the nozzle unit in a first direction which is a direction in which the nozzle part approaches the cavity and in a second direction perpendicular to the first direction. Electronic component molding device. The apparatus of claim 7, wherein the nozzle unit is detachably fastened from the supply line. The method of claim 7, wherein the nozzle unit, A body connected to one end of the supply line and having a plurality of flow paths formed therein; And And a plurality of nozzles communicating with the flow path of the body to supply the liquid resin onto the release film. The method of claim 6, wherein the clamping unit, An upper clamp disposed above the release film and movable in a vertical direction to clamp the release film supplied onto the cavity; A lower clamp disposed below the release film and elastically movable to clamp the release film; And And a driving part for moving the upper clamp in a vertical direction such that the release film is clamped by the upper clamp and the lower clamp and the clamped release film is in close contact with the upper surface of the lower mold. The electronic component molding apparatus of claim 6, wherein the lower mold includes vacuum holes for evacuating a cavity formed in the lower mold to coat the release film on the cavity.
KR1020090045333A 2009-05-25 2009-05-25 Method of molding an electric device and apparatus for molding an electric device KR20100126910A (en)

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KR101238212B1 (en) * 2010-12-23 2013-02-28 하나 마이크론(주) Semiconductor package and method for manufacturing the same
KR101317617B1 (en) * 2011-11-04 2013-10-14 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Apparatus and methods for molded underfills in flip chip packaging
KR101364715B1 (en) * 2012-02-13 2014-02-19 쓰리이엠주식회사 Vacuum forming apparatus and method of the same
KR101493362B1 (en) * 2013-04-05 2015-02-16 주식회사 케이엔제이 Resin molding apparatus and method of the same
EP3540765A4 (en) * 2016-11-11 2020-05-13 SHIN-ETSU ENGINEERING Co., Ltd. Resin-sealing device and resin-sealing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101238212B1 (en) * 2010-12-23 2013-02-28 하나 마이크론(주) Semiconductor package and method for manufacturing the same
KR101317617B1 (en) * 2011-11-04 2013-10-14 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Apparatus and methods for molded underfills in flip chip packaging
KR101388753B1 (en) * 2011-11-04 2014-04-25 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 Apparatus and methods for molded underfills in flip chip packaging
US9412717B2 (en) 2011-11-04 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for molded underfills in flip chip packaging
KR101364715B1 (en) * 2012-02-13 2014-02-19 쓰리이엠주식회사 Vacuum forming apparatus and method of the same
KR101493362B1 (en) * 2013-04-05 2015-02-16 주식회사 케이엔제이 Resin molding apparatus and method of the same
EP3540765A4 (en) * 2016-11-11 2020-05-13 SHIN-ETSU ENGINEERING Co., Ltd. Resin-sealing device and resin-sealing method

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