KR101448490B1

KR101448490B1 - Apparatus for molding a electronic device

Info

Publication number: KR101448490B1
Application number: KR1020080060639A
Authority: KR
Inventors: 김선오
Original assignee: 세메스 주식회사
Priority date: 2008-06-26
Filing date: 2008-06-26
Publication date: 2014-10-10
Also published as: KR20100000950A

Abstract

An electronic component molding apparatus includes a lower die forming a bottom surface of a cavity to be coated with a release film for molding an electronic component, a lower mold having a cavity member surrounding the lower die and forming a side wall of the cavity, A clamping member for clamping the release film together with the lower mold and lifting the cavity member so as to clamp the release film together with the lower die and the cavity member to form a molding region for molding the electronic component, And a height adjusting unit adjusting the height of the cavity with respect to the upper surface of the lower die to adjust the volume of the molding area. Therefore, the height of the cavity according to the type of the electronic component can be adjusted by the electronic component molding apparatus.

Description

[0001] APPARATUS FOR MOLDING A ELECTRONIC DEVICE [0002]

The present invention relates to a molding apparatus for electronic parts. More particularly, the present invention relates to an electronic component molding apparatus for molding an electronic component with a resin in a cavity using a release film.

Generally, a semiconductor chip mounted on a substrate is subjected to resin sealing molding. There has been used an electronic part molding apparatus provided with a mold and a release film for providing a space for resin-sealing molding of electronic components in the resin-seal molding.

The conventional electronic molding apparatus includes a release film feeding unit for applying a predetermined tension to a mold and a release film made of upper and lower molds, and supplying a release film to upper and lower molds. The lower mold is formed with a cavity filled with resin. The electronic part is filled in the cavity filled with the resin so that the electronic part is resin-molded. The release film is arranged to cover the inner surface of the cavity. Therefore, after the electronic component is molded using the resin, the release film can be easily released from the lower mold.

However, as the thickness of the electronic component varies depending on the type of the electronic component, the amount of resin accommodated in the cavity may vary. The volume in the cavity should be adjusted according to the amount of resin changed. Therefore, there arises a problem that the lower mold must be replaced every time the type of the electronic component is changed.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide an electronic part molding apparatus capable of improving workability of a molding operation by omitting an operation of replacing a lower mold according to the type of electronic part to be molded .

According to an aspect of the present invention, there is provided an electronic component molding apparatus comprising: a lower die forming a bottom surface of a cavity to be coated with a release film for molding an electronic component; A lower mold having a cavity member forming a side wall of the cavity, a lower mold disposed facing the lower mold, the cavity being closed with the lower die and the cavity member to form a molding region for molding the electronic component A clamping member disposed between the upper mold, the lower mold and the upper mold for clamping the release film together with the lower mold, and a clamping member for lifting the cavity member to adjust the volume of the molding region, And a height adjusting portion by adjusting the height. The height adjusting unit may include a storage tank for storing fluid, a driving cylinder connected to the cavity member to lift the cavity member, and a fluid line for interconnecting the storage tank and the cylinder and flowing the fluid. In addition, the fluid may comprise air or a liquid. The lower mold includes a lower panel, an elastic member disposed on the lower panel to surround the cavity member, and elastically clamping the release film together with the clamping member; And a bottom seal disposed on the periphery of the lower panel and defining a vacuum region formed with the topography. Further, the upper die includes an upper panel, an upper die disposed on the upper panel, on which the electronic component is fixed, and an upper sealing portion disposed on a peripheral portion of the upper panel and defining a vacuum region formed with the lower die can do. The upper mold may further include a first sealing member disposed at an end of the upper sealing portion and sealing the vacuum region.

According to such an electronic part molding apparatus, the height of the side wall of the cavity can be adjusted from the bottom surface of the lower die as the cavity member forming the side wall of the cavity moves up and down. Since the height of the cavity in which the resin is accommodated can be adjusted, the electronic part can be molded without changing the lower mold according to the change of the resin amount. As a result, the electronic part molding apparatus can have an improved efficiency.

A molding apparatus for an electronic component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention, and are actually shown in a smaller scale than the actual dimensions in order to understand the schematic structure.

Also, the terms first and second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a cross-sectional view illustrating an electronic part molding apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view for explaining a method of adjusting the height of a cavity member of the electronic part molding apparatus of FIG. 1;

1 and 2, an electronic part molding apparatus according to an embodiment of the present invention includes a lower mold 120, a top mold 110, a clamping member 130, and a height adjusting unit 140. An electronic component (10) according to the present invention includes a substrate (11) and a semiconductor chip (13) formed on the substrate (11). The substrate 11 includes a printed circuit board. The substrate 11 may have a circular or polygonal shape.

The lower mold 120 is arranged to face the upper mold 110 in a mutually facing manner. The lower mold 120 is clamped together with the upper mold 110 to form a vacuum region. The lower mold 124 is provided with a cavity 129 for molding an electronic component. The cavity 129 is coated with a release film 20 for molding the electronic component 10 with resin and then releasing the molded electronic component 10 from the cavity.

The lower mold 120 includes a lower die 122 and a cavity member 123. Here, the lower die 122 and the cavity member 123 may be disposed on the lower panel 121 supporting the lower die 122 and the cavity member 123.

The lower die 122 is disposed facing the upper die 110. The upper surface of the lower mold die 122 corresponds to the bottom surface of the cavity 129 for molding the electronic component 10 fixed to the upper mold 110. The lower die 122 may have, for example, a plate shape.

A vacuum suction port (not shown) for vacuum-adsorbing the release film 20 is formed on the bottom surface and the side surface of the cavity 129 in communication with the cavity 129 in the lower die 122 according to an embodiment of the present invention. do.

The cavity member 123 is arranged to surround the lower die 122. Further, the cavity member 123 may be disposed on the lower panel 121. The cavity member 123 may have a cylindrical shape with a hollow capable of receiving the lower die 122. The inner wall of the cavity member 123 corresponds to the inner surface of the cavity 129. [ As a result, the upper surface of the lower die 122 forms the bottom surface of the cavity 129, and the inner surface of the cavity member 123 forms the inner surface of the cavity 129.

The distance from the bottom of the lower die 122 to the measured end of the cavity member 123 is defined as the height of the cavity member 123. The height of the cavity member 123 can be adjusted. For example, as shown in FIG. 1, when the cavity member 123 rises, the height of the cavity member 123 corresponds to the first height h1. Alternatively, as shown in FIG. 2, when the cavity member 123 is lowered, the height of the cavity member 123 may have a second height h2. Wherein the first height h1 is less than the second height h2. Therefore, the height of the cavity member 123 can be adjusted from the upper surface of the lower die 122, depending on the amount of resin for molding the electronic component 10. Therefore, when there is a change in the amount of resin required, it is not necessary to replace the lower mold 120 including the cavity member 123.

In one embodiment of the present invention, the cavity member 123 may have a tapered shape so as to have a smaller height toward the outer periphery. The cavity member 123 having a tapered shape can increase the contact surface with the release film 20 so that the release film 20 can be firmly fixed to the cavity member 123. [

The upper die 110 is disposed to face the lower die 120. The electronic component 10 is fixed to the upper die 110. The upper mold 110 together with the lower mold 120 defines a vacuum region. That is, the inside of the vacuum region formed by closing the upper mold 110 and the lower mold 120 can be evacuated. The upper mold 110 is also formed with a molding region together with the cavity 129 formed by the lower die 122 and the cavity member 123. The molding space is filled with resin so that the electronic part is molded with resin.

The upper die 113 forms a molding space together with the lower die 122 and the cavity member 123 when the upper mold 110 is closed together with the lower mold 120 described later. Inside the molding space, the electronic component 10 is molded with resin inside.

On the other hand, the electronic component 10 is fixed to the upper die 110. The upper die 113 includes an adsorption member (not shown) for adsorbing the substrate 11 among the electronic components 10. [ The adsorption member adsorbs the substrate 11 through, for example, vacuum adsorption.

Clamping member 130 is disposed between upper mold 110 and lower mold 120. The clamping member 130 clamps the release film 20. That is, the clamping member 130 is lowered and clamps the release film 20 with the release film 20 interposed between the lower molds 120.

In one embodiment of the present invention, the clamping member 130 may have, for example, a hollow plate shape. At this time, the hollow position may correspond to the position of the cavity 127. At this time, the clamping member 130 clamps the release film 20 with the release film 20 interposed between the lower molds 120. The clamping member 130 may be interposed between the upper mold 110 and the lower mold 120 to clamp the release film 20.

In another embodiment of the present invention, the clamping member 130 is disposed adjacent the cavity member 123 and can clamp the release film 20 independently. For example, the clamping member 130 can clamp the release film 20 like a griper.

The height adjuster 140 can elevate the cavity member 123 and adjust the height of the cavity member 123 measured from the upper surface of the lower die 122. For example, when the height adjusting portion 140 raises the cavity member 123, the height of the cavity member 123 measured from the upper surface of the lower die 122 increases. On the contrary, when the height adjuster 140 descends the cavity member 123, the height of the cavity member 123 measured from the upper surface of the lower die 122 decreases.

In one embodiment of the present invention, the height adjuster 141 includes a storage tank 141, a flow line 143, and a drive cylinder 145.

The storage tank 141 stores the fluid. Examples of the fluid include a gas such as an oxygen gas, a nitrogen gas, a mixture thereof, or a liquid such as water.

The driving cylinder 145 is connected to the cavity member 123 to move the cavity member 123 up and down. The drive cylinder 145 includes a hollow formed body capable of receiving fluid and a drive shaft interconnecting the drive cylinder 145 and the cavity member 123 according to the amount of fluid received in the hollow.

The flow line 143 interconnects the storage tank 141 and the drive cylinder 145. The flow line 143 allows fluid to flow between the storage tank 141 and the drive cylinder 145.

1, when the fluid stored in the storage tank 141 flows into the drive cylinder 145 through the fluid line 143, the drive shaft rises by the pressure of the introduced fluid. When the drive shaft rises, the cavity member 123 connected to the drive shaft rises. The height of the side wall of the cavity is increased by the raised cavity member 123. As a result, when the amount of the resin required is relatively large, the volume of the molding region accommodating the resin increases.

Alternatively, as shown in FIG. 2, when the fluid introduced into the drive cylinder 145 is recovered to the storage tank 141 through the flow line 143, as the pressure of the introduced fluid inside the drive cylinder decreases The drive shaft is lowered. When the drive shaft descends, the cavity member 123 connected to the drive shaft descends. The height of the side wall of the cavity is reduced by the lowered cavity member 123. [ As a result, when the amount of resin required is small, the volume of the molding region accommodating the resin is reduced.

In one embodiment of the present invention, the lower mold 120 includes an elastic member 131 and a lower sealing portion 125.

The elastic member 131 is disposed on the lower panel 121. Further, the elastic member 131 is disposed so as to surround the cavity member 123. In addition, the elastic member 131 is disposed apart from the cavity member 123. The elastic member 131 clamps the release film 20 via the release film 20 together with the clamping member 130.

The lower sealing portion 125 is disposed on the peripheral portion of the lower panel 121. The lower sealing portion 125 contacts with the upper sealing portion 115 included in the upper mold 110 to form a vacuum region. Further, the lower sealing portion 125 is disposed so as to surround the lower die 122. The lower sealing portion 125 is disposed so as to face the upper sealing portion 151. Therefore, when the upper die 110 and the lower die 120 come close to each other, the upper and lower seals 115 and 125 come into contact with each other. As a result, the upper die 110, the lower die 120 and the upper and lower seals 115 and 125 form the vacuum region.

In one embodiment of the present invention, the topsheet 110 includes an upper panel 111, an upper die 113 and an upper sealing portion 115.

The upper panel 111 corresponds to the lower panel 121 described above. The upper panel 111 supports the upper die 113 and the upper sealing portion 115.

The upper die 113 is arranged to face the lower die 120. Electronic components are fixed to the upper die 113. The upper die 113 may have, for example, a plate shape.

The upper sealing portion 115 is disposed on the peripheral portion of the upper panel 111. The upper sealing portion 115 contacts with the lower sealing portion 125 included in the lower mold 120 to form a vacuum region. Further, the upper sealing portion 115 is arranged to surround the upper die 113. The lower sealing portion 125 is disposed so as to face the upper sealing portion 151. Therefore, when the upper die 110 and the lower die 120 come close to each other, the upper and lower seals 115 and 125 come into contact with each other. As a result, the upper die 110, the lower die 120 and the upper and lower seals 115 and 125 form the vacuum region.

In one embodiment of the present invention, the topsheet 110 may further include a first sealing member 155 disposed at an end of the top sealing portion 115 and sealing the vacuum region. The lower mold 120 may further include a second sealing member 127 disposed at an end of the lower sealing portion 115 and sealing the vacuum region. When the upper mold 110 and the lower mold 120 come close to each other and the upper and lower seals 115 and 125 contact each other, the first sealing member 117 and the second sealing member 127 seal the vacuum region, .

The electronic component molding apparatus 100 according to an embodiment of the present invention further includes a supply unit 150 for providing the release film 20. [

The supply unit 150 is disposed adjacent to the cavity. The supply unit 150 supplies the release film 20 between the upper mold 110 and the lower mold 120. The supply unit 150 supplies the release film 20 to mold the electronic part 10 into the cavity of the lower mold 120 and then the release film 20 to which the molded electronic part 10 is attached in the cavity, Can be released easily from this cavity.

The supply unit 150 may include a supply roller 151 for supplying the release film 20 to the cavity and a winding roller 153 for collecting the release film 20 from the cavity. The release film 20 moves from the feed roller 151 to the take-up roller 153 as shown in Fig. On the other hand, the feed roller 151 and the take-up roller 153 can apply tension or relax the release film 20 supplied in the cavity.

3 to 5 are sectional views for explaining the molding process of the electronic component molding apparatus shown in FIG.

1 and 2, the release film 20 is positioned between the upper mold 110 and the lower mold 120 while the upper mold 110 and the lower mold 120 are spaced apart from each other. At this time, the upper die 110 may hold the substrate 11 on which the electronic component 10 is mounted. The release film 20 can be supplied through, for example, a supply roller (not shown) and a winding roller (not shown) arranged to face each other on one side of the lower mold 120.

At this time, when the fluid stored in the storage tank 141 flows into the drive cylinder 145 through the fluid line 143, the drive shaft rises by the pressure of the introduced fluid. When the drive shaft rises, the cavity member 123 connected to the drive shaft rises. The height of the side wall of the cavity is increased by the raised cavity member 123. As a result, when the amount of resin required is relatively large, the volume of the molding region accommodating the resin increases. Alternatively, as shown in FIG. 2, when the fluid introduced into the drive cylinder 145 is recovered to the storage tank 141 through the flow line 143, as the pressure of the introduced fluid inside the drive cylinder decreases The cavity member 123 is lowered. The height of the side wall of the cavity is reduced by the lowered cavity member 123. [ As a result, when the amount of resin required is small, the volume of the molding region accommodating the resin is reduced.

Referring to FIG. 3, the clamping member 130 is lowered to clamp the release film 20 using the clamping member 130 and the elastic member 131.

For example, the clamping member 130 is lowered toward the elastic member 131. Therefore, the release film 20 is interposed between the clamping member 130 and the elastic member 131. The clamping member 130 is further lowered to clamp the release film 20 using the elastic force of the elastic member 131. [ Further, the release film 20 is disposed so as to be in surface contact with the tapered portion of the cavity member 123. Therefore, the clamping member 130, the elastic member 131, and the tapered cavity member 123 tightly clamp the release film 20. [

Referring to FIG. 4, the release film 20 covers the bottom surface of the cavity through a vacuum suction port (not shown) formed in the lower die 121.

5, after the release film 20 is adsorbed on the bottom surface of the cavity 127, the resin 30 is supplied to the cavity. In one embodiment of the present invention, the liquid resin can be fed directly into the cavity. Alternatively, after the resin in powder form is fed into the cavity, the resin in powder form can be melted and converted into a liquid resin. At this time, the upper mold 110 and the lower mold 120 may be maintained at a constant temperature capable of maintaining the molten state of the resin.

Subsequently, the lower mold 120 is raised toward the upper mold 110 to seal the vacuum region as a whole by using the upper and lower cutouts 115 and 125. Subsequently, the vacuum region is evacuated through a vacuum exhaust port (not shown) formed in the upper mold 110. Subsequently, the electronic component fixed to the upper mold 110 is precipitated in the cavity containing the molten resin. After a lapse of a certain period of time, the liquid resin is cured to form the electronic component 10 with the cured resin. For example, the electronic component 13 mounted on one surface of the substrate 11 can be molded with the cured resin. Alternatively, a plurality of electronic parts mounted on both sides of the substrate 11 can be molded with the cured resin. Then, air is introduced into the cavity through the vacuum adsorption port formed in the lower mold 120 to release the release film 20 from the cavity. Therefore, the molded electronic component 10 can be separated from the lower mold 120.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

According to the electronic component molding apparatus and the electronic component molding method, the release film is held by the holding unit, thereby preventing the release film from being released from the cavity during the molding process. Further, the mold structure can be simplified by fixing the release film to the holding unit instead of the intermediate mold.

On the other hand, by omitting the intermediate mold, the driving time required for driving the intermediate mold is saved, and the process efficiency of the overall molding process can be improved.

1 is a cross-sectional view illustrating an electronic part molding apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a method of adjusting the height of a cavity member of the electronic part molding apparatus of FIG. 1;

3 to 5 are sectional views for explaining a method of molding an electronic component using the electronic component molding apparatus of FIG.

Claims

A lower die having a lower die for forming a bottom surface of a cavity to which the release film is coated to mold the electronic component, and a cavity member surrounding the lower die and forming a side wall of the cavity;

An upper mold disposed to face the lower mold and fixed with the electronic component and closed with the lower die and the cavity member to form a molding region for molding the electronic component;

A clamping member disposed between the lower mold and the upper mold for clamping the release film together with the lower mold; And

And a height adjusting unit adjusting the height of the cavity with respect to the upper surface of the lower die so as to adjust the volume of the molding area by raising and lowering the cavity member,

In the lower mold,

Lower panel;

An elastic member disposed on the lower panel to surround the cavity member and elastically clamping the release film together with the clamping member; And

And a bottom sealing portion disposed on a peripheral portion of the lower panel and defining a vacuum region formed together with the upper mold.

The apparatus of claim 1, wherein the height adjuster

A storage tank for storing fluid;

A drive cylinder connected to the cavity member to move the cavity member up and down; And

And a fluid line connecting the storage tank and the cylinder and flowing the fluid.

The electronic part molding apparatus according to claim 2, wherein the fluid is air or liquid.

delete

The apparatus of claim 1, wherein the upper mold comprises:

An upper panel;

An upper die disposed on the upper panel and to which the electronic component is fixed; And

And an upper sealing portion disposed on a peripheral portion of the upper panel and defining a vacuum region formed with the lower mold.

6. The electronic part molding apparatus according to claim 5, wherein the upper mold further comprises a first sealing member disposed at an end of the upper sealing portion and sealing the vacuum region.